Abstract: A composite server heat sink with a metal base having a thermal conductivity of at least 200W/mK. Plural fins extend from the metal base, each fin having an anisotropic thermal conductivity in a range of approximately 300 to 650 W/mK in a longitudinal direction of the fin and less than approximately 30 W/mK in a widthwise direction of the fin. Each fin includes graphite in an amount of approximately 45-70 wt. %, diamond in an amount of approximately 2.5 to 10 wt. % with the balance comprising a metal selected from one or more of copper and aluminum. To create the anisotropic thermal properties, the graphite is aligned along the longitudinal direction of the fin.

Abstract: The present invention provides a composite server heat sink with a metal base having a thermal conductivity of at least 200 W/mK. Plural fins extend from the metal base, each fin having an anisotropic thermal conductivity in a range of approximately 300 to 650 W/mK in a longitudinal direction of the fin and less than approximately 30 W/mK in a widthwise direction of the fin. Each fin includes graphite in an amount of approximately 45-70 wt. %, diamond in an amount of approximately 2.5 to 10 wt. % with the balance comprising a metal selected from one or more of copper and aluminum. To create the anisotropic thermal properties, the graphite is aligned along the longitudinal direction of the fin.

Abstract: In an anisotropic flexible thermal interface pad, a heat-conduction layer on a dielectric layer is formed by using electroflocking to attach a plurality of thermally-conductive fibers, such as carbon fibers, on the dielectric layer and sealing the fibers with a sealing agent, such as silicone. The sealing agent is less thermally-conductive than the fibers. The plurality of fibers is aligned substantially-unidirectionally to achieve a predetermined inclination angle (e.g., 90°) with respect to the dielectric layer for discouraging neighboring fibers to contact each other while maintaining efficient heat transmission along each fiber. Thus, heat is transmitted more efficiently along a direction perpendicular to the dielectric layer than along another direction in parallel thereto. The pad may include additional heat-conduction layers, each configured similar to the heat-conduction layer, stacked together thereon.