Abstract: A speaker is provided, including a holder, a diaphragm fixed to the holder, and a voice coil located under the diaphragm and configured to drive the diaphragm to vibrate to sound. The diaphragm includes a diaphragm body, a protruding portion extending from the diaphragm body while being bent towards the voice coil, and a dome fitted to the protruding portion. The protruding portion includes a first wall and a second wall connected to the first wall and parallel to the diaphragm body. The diaphragm body is provided with a suspension disposed around the dome. The speaker of the present disclosure has the diaphragm of an improved structure, which greatly increases the adhesion between the dome and the diaphragm, effectively improves the reliability of the product, reduces the total harmonic distortion, and improves the acoustic performance of the product.

Abstract: The present invention provides a diaphragm including a first polymer substrate material made of polymer material, a second polymer substrate material made of polymer material, and a porous damping substrate material made of porous damping material. The porous damping substrate material has a first side surface and a second side surface opposite to the first side surface. The first polymer substrate material is fixed to the first side surface, and the second polymer substrate material is fixed to the second side surface. The first polymer substrate material and/or the second polymer substrate material are at least partially embedded in the porous damping substrate material. The diaphragm in the invention can reduce the amplitude deviation under high temperature. Further, the invention provides a method for forming the diaphragm and a speaker using the same.

Abstract: A transient IR-drop waveform measurement system and method for a high speed integrated circuit are provided. The system includes all-digital elements and is based on a ring oscillator in GHz. Through oscillation with a Fast Ring Oscillator, sampling with an Edge Detector and counting with a Ripple Counter, a width and a peak of an IR-drop waveform are obtained. Moreover, a power supply network is adapted during a clock cycle through sending an adaptation signal to a connected dynamic voltage frequency scaling (DVFS) system. The measurement method includes 11 steps. The measurement system has following features: 1) IR-drop peak/width measurement ability; 2) low fabrication and test cost; 3) high accuracy and sensitivity; 4) early adaptation ability. Therefore, the measurement system can be used alone for chip monitoring or testing, in order to reduce a power supply noise disturbance to a chip.

Abstract: A speaker is provided, including a holder, a diaphragm fixed to the holder, and a voice coil located under the diaphragm and configured to drive the diaphragm to vibrate to sound. The diaphragm includes a diaphragm body, a protruding portion extending from the diaphragm body while being bent towards the voice coil, and a dome fitted to the protruding portion. The protruding portion includes a first wall and a second wall connected to the first wall and parallel to the diaphragm body. The diaphragm body is provided with a suspension disposed around the dome. The speaker of the present disclosure has the diaphragm of an improved structure, which greatly increases the adhesion between the dome and the diaphragm, effectively improves the reliability of the product, reduces the total harmonic distortion, and improves the acoustic performance of the product.

Abstract: A transient IR-drop waveform measurement system and method for a high speed integrated circuit are provided. The system includes all-digital elements and is based on a ring oscillator in GHz. Through oscillation with a Fast Ring Oscillator, sampling with an Edge Detector and counting with a Ripple Counter, a width and a peak of an IR-drop waveform are obtained. Moreover, a power supply network is adapted during a clock cycle through sending an adaptation signal to a connected dynamic voltage frequency scaling (DVFS) system. The measurement method includes 11 steps. The measurement system has following features: 1) IR-drop peak/width measurement ability; 2) low fabrication and test cost; 3) high accuracy and sensitivity; 4) early adaptation ability. Therefore, the measurement system can be used alone for chip monitoring or testing, in order to reduce a power supply noise disturbance to a chip.