Abstract: A magnetic element is disclosed, and includes a magnetic core, at least one winding set and at least one heat conduction pipe. The magnetic core includes two magnetic columns arranged oppositely, and two magnetic plates arranged oppositely. The magnetic plates respectively cover two opposite end surfaces of each magnetic column to mutually form a closed magnetic flux path with the magnetic columns. Each of the magnetic columns includes a plurality of first magnetic blocks stacked together. Each of the magnetic plates includes at least one second magnetic block. The winding set binds one of the magnetic columns. The heat conduction pipe is disposed internally in one of the magnetic columns.

Abstract: A conductive structure for an electromagnetic device includes a conductive sheet and a plurality of protrusions. The conductive sheet includes two electrical connection terminals. The protrusions are arranged between the electrical connection terminals. The protrusions include a support. The support is connected to the conductive sheet. Adjacent two of the protrusions define a first heat dissipation passage.

Abstract: A magnetic element is disclosed, and includes a magnetic core, at least one winding set and at least one heat conduction pipe. The magnetic core includes two magnetic columns arranged oppositely, and two magnetic plates arranged oppositely. The magnetic plates respectively cover two opposite end surfaces of each magnetic column to mutually form a closed magnetic flux path with the magnetic columns. Each of the magnetic columns includes a plurality of first magnetic blocks stacked together. Each of the magnetic plates includes at least one second magnetic block. The winding set binds one of the magnetic columns. The heat conduction pipe is disposed internally in one of the magnetic columns.

Abstract: A conductive structure for an electromagnetic device includes a conductive sheet and a plurality of protrusions. The conductive sheet includes two electrical connection terminals. The protrusions are arranged between the electrical connection terminals. The protrusions include a support. The support is connected to the conductive sheet. Adjacent two of the protrusions define a first heat dissipation passage.

Abstract: The present invention provides a high-power medium-voltage drive power cell, which comprises: a rectifier module for rectifying the three-phase AC input voltage to get a DC voltage; an IGBT (Insulated Gate Bipolar Transistor) inverter bridge connected to capacitors for converting the DC voltage into an AC voltage of which the frequency, the amplitude and the phase are adjustable; a bypass module connected to the IGBT inverter bridge for providing the bypass function when the IGBT inverter bridge works in an abnormal state; and a heat pipe heat sink having a base plate on both sides of which power elements of the high-power medium-voltage drive power cell are disposed.

Abstract: The present invention provides a heat sink device, suitable to the heat dissipation of a high-power medium-voltage drive power cell. The device comprises a heat dissipation substrate having a first surface, a second surface and an inner layer between the first surface and the second surface; a heat pipe having an evaporation section and a condensation section. The evaporation section is buried in the inner layer of the heat dissipation substrate, and the condensation section is used to dissipate the heat from the evaporation section to the air. The power elements of the high-power medium-voltage drive power cell are disposed on the first surface and the second surface, respectively.

Abstract: A power module includes a first power chip and a second power chip, each of which has at least two electrodes. The power module is applied to a power converter having a power density higher than 15 W/inch3 and a maximum efficiency higher than 92%, or to a power converter having a power density higher than 20 W/inch3 or having a maximum efficiency higher than 93%. At least one of the power chips operates at a frequency higher than 25 kHz.

Abstract: The present invention provides a heat sink device, suitable to the heat dissipation of a high-power medium-voltage drive power cell. The device comprises a heat dissipation substrate having a first surface, a second surface and an inner layer between the first surface and the second surface; a heat pipe having an evaporation section and a condensation section. The evaporation section is buried in the inner layer of the heat dissipation substrate, and the condensation section is used to dissipate the heat from the evaporation section to the air. The power elements of the high-power medium-voltage drive power cell are disposed on the first surface and the second surface, respectively.

Abstract: The present invention provides a high-power medium-voltage drive power cell, which comprises: a rectifier module for rectifying the three-phase AC input voltage to get a DC voltage; an IGBT (Insulated Gate Bipolar Transistor) inverter bridge connected to capacitors for converting the DC voltage into an AC voltage of which the frequency, the amplitude and the phase are adjustable; a bypass module connected to the IGBT inverter bridge for providing the bypass function when the IGBT inverter bridge works in an abnormal state; and a heat pipe heat sink having a base plate on both sides of which power elements of the high-power medium-voltage drive power cell are disposed.

Abstract: A heat dissipation apparatus is suitable for dissipating heat from heat-generating elements in a medium-voltage drive. The heat dissipation apparatus comprises: a heat-dissipating substrate, wherein the heat-generating elements are placed on at least one of a first surface and a second surface of the heat-dissipating substrate; at least one heat pipe group each of which includes a plurality of heat pipes, each heat pipe having an evaporation section and a condensation section, wherein the evaporation section is buried in an inner layer of the heat-dissipating substrate for absorbing heat from the heat-generating elements; and a plurality of fins arranged to be intersected with each heat pipe and connected to the condensation sections of the heat pipes, so as to transfer the heat released from the condensation sections to air. The contact portions between the heat pipe group and the fins are arranged in triangle staggered arrangements.

Abstract: A power module includes a first power chip and a second power chip, each of which has at least two electrodes. The power module is applied to a power converter having a power density higher than 15 W/inch3 and a maximum efficiency higher than 92%, or to a power converter having a power density higher than 20 W/inch3 or having a maximum efficiency higher than 93%. At least one of the power chips operates at a frequency higher than 25 kHz.