Abstract: A sealing device and method are described herein that can be used to manufacture a hermetically sealed glass package. In one embodiment, the hermetically sealed glass package is suitable to protect thin film devices which are sensitive to the ambient environment (e.g., oxygen, moisture). Some examples of such glass packages are organic emitting light diode (OLED) displays, sensors, and other optical devices. The present invention is demonstrated using an OLED display as an example.

Abstract: A method for manufacturing a hermetically sealed package is provided, using a laser to heat a frit, disposed in a pattern between two substrates, such that the heated frit forms a hermetic seal which connects the substrates.

Abstract: A method for manufacturing a hermetically sealed package is provided, the method comprising the steps of: using a laser to heat a frit, disposed in a pattern between two substrates, such that the heated frit forms a hermetic seal which connects the substrates and further comprising: directing the laser to enter the frit pattern, then to trace the frit pattern, then to retrace a portion of the frit pattern, and then to exit the frit pattern; and selecting an initial laser power which, when the laser enters the frit pattern, is insufficient to heat the frit to form a hermetic seal; then increasing the laser power over a first section of the frit pattern to a target laser power at least sufficient to heat the frit to form a hermetic seal; and then decreasing the laser power over a second section of the frit pattern until the laser power is insufficient to heat the frit to form a hermetic seal before the laser exits the frit pattern.

Abstract: A sealing device and method are described herein that can be used to manufacture a hermetically sealed glass package. In one embodiment, the hermetically sealed glass package is suitable to protect thin film devices which are sensitive to the ambient environment (e.g., oxygen, moisture). Some examples of such glass packages are organic emitting light diode (OLED) displays, sensors, and other optical devices. The present invention is demonstrated using an OLED display as an example.

Abstract: A method for manufacturing a hermetically sealed package is provided, the method comprising the steps of: using a laser to heat a frit, disposed in a pattern between two substrates, such that the heated frit forms a hermetic seal which connects the substrates and further comprising: directing the laser to enter the frit pattern, then to trace the frit pattern, then to retrace a portion of the frit pattern, and then to exit the frit pattern; and selecting an initial laser power which, when the laser enters the frit pattern, is insufficient to heat the frit to form a hermetic seal; then increasing the laser power over a first section of the frit pattern to a target laser power at least sufficient to heat the frit to form a hermetic seal; and then decreasing the laser power over a second section of the frit pattern until the laser power is insufficient to heat the frit to form a hermetic seal before the laser exits the frit pattern.

Abstract: A method of sealing a plurality of frame-like frit walls disposed between two substrates. The frit walls are arranged in rows and columns and divided into groups, each group being sealed by a separate laser beam. Several strategies are disclosed for the order in which the frit walls are heated and sealed by a laser beam to optimize the efficiency of the sealing process.

Abstract: A method of minimizing the formation of interference fringes in an OLED display device is disclosed comprising sealing the upper and lower glass substrates comprising the display device to one another within an enclosure wherein a pressure of the atmosphere within the enclosure is greater than the pressure of the atmosphere outside the enclosure.

Abstract: A method of sealing a glass package comprising providing a first glass substrate, the first substrate having first and second alignment marks. A second glass substrate having third and fourth alignment marks is aligned to the first substrate by translating the first substrate relative to the second substrate, and aligning the second and fourth alignment marks by rotating the first substrate relative to the second substrate.

Abstract: A method of sealing a plurality of frame-like frit walls disposed between two substrates. The frit walls are arranged in rows and columns and divided into groups, each group being sealed by a separate laser beam. Several strategies are disclosed for the order in which the frit walls are heated and sealed by a laser beam to optimize the efficiency of the sealing process.