Patents by Inventor Aizar Abdul Karim Norfidathul
Aizar Abdul Karim Norfidathul has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8356917Abstract: An embodiment of a light source comprises a first lead and a second lead. The first lead comprises a first mounting surface wherein a first light emitter is connectable to the first mounting surface, a support member attached to the first mounting surface, a conductor portion attached to the support member, and at least one tab extending from the first mounting surface, the at least one tab being used to hold the first lead during fabrication. The second lead is second lead located adjacent the first lead and comprises a second mounting surface wherein a second light emitter is connectable to the second mounting surface, at least two support members attached to the second mounting surface, and a conductor portion attached to each of the support members.Type: GrantFiled: August 19, 2009Date of Patent: January 22, 2013Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Keat Chuan Ng, Chiau Jin Lee, Kheng Leng Tan, Aizar Abdul Karim Norfidathul
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Patent number: 8120055Abstract: Embodiments of a light source are disclosed herein. An embodiment of the light source comprises a first terminal and a second terminal. The first terminal comprises a first terminal first portion and a first terminal second portion, wherein at least a portion of the first terminal second portion is located on a first plane, the first terminal second portion comprising at least two contacts separated by a space. A second terminal comprises a second terminal first portion and a second terminal second portion. The second terminal first portion is located proximate the first terminal first portion. The second terminal second portion is located substantially on the first plane and in the space. A light emitter is affixed to the first terminal first portion, the light emitter is electrically connected to the first terminal first portion. A connection exists between the light emitter and the second terminal first portion.Type: GrantFiled: April 20, 2009Date of Patent: February 21, 2012Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Aizar Abdul Karim Norfidathul, Chiau Jin Lee, Keat Chuan Ng
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Patent number: 8115385Abstract: A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.Type: GrantFiled: August 30, 2010Date of Patent: February 14, 2012Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Aizar Abdul Karim Norfidathul, Chiau Jin Lee, Kheng Leng Tan, Keat Chuan Ng, Kiam Soon Ong
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Publication number: 20110044062Abstract: An embodiment of a light source comprises a first lead and a second lead. The first lead comprises a first mounting surface wherein a first light emitter is connectable to the first mounting surface, a support member attached to the first mounting surface, a conductor portion attached to the support member, and at least one tab extending from the first mounting surface, the at least one tab being used to hold the first lead during fabrication. The second lead is second lead located adjacent the first lead and comprises a second mounting surface wherein a second light emitter is connectable to the second mounting surface, at least two support members attached to the second mounting surface, and a conductor portion attached to each of the support members.Type: ApplicationFiled: August 19, 2009Publication date: February 24, 2011Applicant: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.Inventors: Keat Chuan Ng, Chiau Jin Lee, Kheng Leng Tan, Aizar Abdul Karim Norfidathul
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Publication number: 20100320485Abstract: A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.Type: ApplicationFiled: August 30, 2010Publication date: December 23, 2010Applicant: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.Inventors: Aizar Abdul Karim Norfidathul, Chiau Jin Lee, Kheng Leng Tan, Keat Chuan Ng, Kiam Soon Ong
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Publication number: 20100264450Abstract: Embodiments of a light source are disclosed herein. An embodiment of the light source comprises a first terminal and a second terminal. The first terminal comprises a first terminal first portion and a first terminal second portion, wherein at least a portion of the first terminal second portion is located on a first plane, the first terminal second portion comprising at least two contacts separated by a space. A second terminal comprises a second terminal first portion and a second terminal second portion. The second terminal first portion is located proximate the first terminal first portion. The second terminal second portion is located substantially on the first plane and in the space. A light emitter is affixed to the first terminal first portion, the light emitter is electrically connected to the first terminal first portion. A connection exists between the light emitter and the second terminal first portion.Type: ApplicationFiled: April 20, 2009Publication date: October 21, 2010Applicant: Avago Technologies ECUBU IP (Singapore) Pte. Ltd.Inventors: Aizar Abdul Karim Norfidathul, Chiau Jin Lee, Keat Chuan Ng
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Patent number: 7800304Abstract: A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.Type: GrantFiled: January 12, 2007Date of Patent: September 21, 2010Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Aizar Abdul Karim Norfidathul, Chiau Jin Lee, Kheng Leng Tan, Keat Chuan Ng, Kiam Soon Ong
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Patent number: 7547583Abstract: A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.Type: GrantFiled: March 7, 2008Date of Patent: June 16, 2009Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Kee Yean Ng, Hui Peng Koay, Chiau Jin Lee, Kheng Leng Tan, Wei Liam Loo, Keat Chuan Ng, Aizar Abdul Karim Norfidathul
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Publication number: 20080170391Abstract: A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.Type: ApplicationFiled: January 12, 2007Publication date: July 17, 2008Inventors: Aizar Abdul Karim Norfidathul, Chiau Jin Lee, Kheng Leng Tan, Keat Chuan Ng, Kiam Soon Ong
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Publication number: 20080153190Abstract: A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.Type: ApplicationFiled: March 7, 2008Publication date: June 26, 2008Applicant: Avago Technologies General IP (Singapore) Pte. LtdInventors: Kee Yean Ng, Hui Peng Koay, Chiau Jin Lee, Kheng Leng Tan, Wei Liam Loo, Keat Chuan Ng, Aizar Abdul Karim Norfidathul
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Publication number: 20080144322Abstract: A light source having a rigid substrate, a first LED, and a flexible reflector housing is disclosed. The rigid substrate has a first surface having a plurality of electrical traces formed thereon, the first LED die being disposed on the first surface and connected to two of the electrical traces. The rigid substrate also includes a plurality of external electrical connections for accessing the electrical traces. The reflector housing includes a layer of flexible material having at least one cavity extending through the layer of flexible material. The layer of flexible material is bonded to the first surface such that the cavity overlies the first LED die. The cavity has walls that reflect light generated in the first LED die. The first die can be encapsulated in a layer of silicone encapsulant. The reflector can likewise be constructed from silicone.Type: ApplicationFiled: December 15, 2006Publication date: June 19, 2008Inventors: Aizar Abdul Karim Norfidathul, Siew It Pang, Kheng Leng Tan, Tong Fatt Chew
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Publication number: 20080117619Abstract: A light source, a flexible circuit carrier and a flexible reflector are disclosed. The flexible circuit carrier includes a flexible substrate having a first surface having a plurality of electrical traces formed thereon. A first LED die is disposed on the first surface and connected to two of the electrical traces. A plurality of external electrical connections for accessing the electrical traces are also included in the circuit carrier. The flexible reflector includes a layer of flexible material having at least one cavity extending through the layer of flexible material. The flexible layer is bonded to the first surface such that the cavity overlies the first LED die. The cavity has walls that reflect light generated in the first LED die. The flexible material and the flexible substrate can include silicone.Type: ApplicationFiled: November 21, 2006Publication date: May 22, 2008Inventors: Siew It Pang, Aizar Abdul Karim Norfidathul, Kheng Leng Tan, Tong Fatt Chew