Patents by Inventor Aizou Kaneda
Aizou Kaneda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7781896Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: GrantFiled: June 13, 2008Date of Patent: August 24, 2010Assignee: Hitachi Chemical Co., Ltd.Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Patent number: 7560307Abstract: There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.Type: GrantFiled: April 14, 2006Date of Patent: July 14, 2009Assignee: Hitachi Chemical Company, Ltd.Inventors: Yasuhiro Yano, Hidekazu Matsuura, Yoshihiro Nomura, Yoshii Morishita, Touichi Sakata, Hiroshi Nishizawa, Toshiaki Tanaka, Masaaki Yasuda, Aizou Kaneda
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Publication number: 20080290529Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250 ° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: ApplicationFiled: June 13, 2008Publication date: November 27, 2008Applicant: Hitachi Chemical Co., Ltd.Inventors: Shinji TAKEDA, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Patent number: 7387914Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: GrantFiled: April 24, 2006Date of Patent: June 17, 2008Assignee: Hitachi Chemical Company, Ltd.Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Publication number: 20060180908Abstract: There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.Type: ApplicationFiled: April 14, 2006Publication date: August 17, 2006Inventors: Yasuhiro Yano, Hidekazu Matsuura, Yoshihiro Nomura, Yoshii Morishita, Touichi Sakata, Hiroshi Nishizawa, Toshiaki Tanaka, Masaaki Yasuda, Aizou Kaneda
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Publication number: 20060180903Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: ApplicationFiled: April 24, 2006Publication date: August 17, 2006Applicant: Hitachi Chemical Co., Ltd.Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Patent number: 7078094Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: GrantFiled: July 15, 2004Date of Patent: July 18, 2006Assignee: Hitachi Chemical Co., Ltd.Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Patent number: 7061081Abstract: There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.Type: GrantFiled: March 6, 2001Date of Patent: June 13, 2006Assignee: Hitachi Chemical Co., Ltd.Inventors: Yasuhiro Yano, Hidekazu Matsuura, Yoshihiro Nomura, Yoshii Morishita, Touichi Sakata, Hiroshi Nishizawa, Toshiaki Tanaka, Masaaki Yasuda, Aizou Kaneda
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Patent number: 7057265Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: GrantFiled: May 2, 2003Date of Patent: June 6, 2006Assignee: Hitachi Chemical Co., Ltd.Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Patent number: 7012320Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: GrantFiled: February 20, 2001Date of Patent: March 14, 2006Assignee: Hitachi Chemical Company, Ltd.Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Patent number: 6855579Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: GrantFiled: February 20, 2001Date of Patent: February 15, 2005Assignee: Hitachi Chemical Company, Ltd.Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Publication number: 20040253770Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250 ° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: ApplicationFiled: July 15, 2004Publication date: December 16, 2004Applicant: Hitachi Chemical Company, Ltd.Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Patent number: 6825249Abstract: Provided are a laminating method and machine for successively heating and compression-bonding a film-shaped organic die-bonding material on a leadframe. leadframe 7 is placed on a travelling table 8 and is heated there. A film-shaped organic die-bonding material 2 is punched out and the resulting film is tack-bonded to a die pad on the leadframe. The leadframe with the film tack-bonded thereon is then moved to a position B by the travelling table. After the film is pressed by a compression-bonding element at the position B, a chip is mounted on the film-shaped organic die-bonding material 2. It is therefore possible to bond a film-shaped organic die-bonding material under compression on a leadframe with good productivity but without voids and further to avoid package cracking upon mounting a chip.Type: GrantFiled: July 14, 2000Date of Patent: November 30, 2004Assignee: Hitachi Chemical Co., Ltd.Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Yasuo Miyadera, Mituo Yamasaki, Iwao Maekawa, Akio Kotato, Yuusuke Miyamae, Tadaji Satou, Makoto Saitou, Tooru Kikuchi, Akira Kageyama, Aizou Kaneda
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Patent number: 6717242Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 Mpa or less at a temperature of 259° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: GrantFiled: February 20, 2001Date of Patent: April 6, 2004Assignee: Hitachi Chemical Company, Ltd.Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Publication number: 20030160337Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: ApplicationFiled: May 2, 2003Publication date: August 28, 2003Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Patent number: 6611064Abstract: In the present invention, provided are a semiconductor device having a semiconductor-element-mounting substrate on which a semiconductor element has been mounted via an adhesive having an exothermic-reaction curing start temperature of 130° C. or below as measured with a differential scanning calorimeter at a heating rate of 10° C./minute, and a process for its fabrication.Type: GrantFiled: April 5, 2001Date of Patent: August 26, 2003Assignee: Hitachi Chemical Company, Ltd.Inventors: Takashi Kousaka, Naoya Suzuki, Toshiaki Tanaka, Masaaki Yasuda, Aizou Kaneda
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Publication number: 20030082925Abstract: There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.Type: ApplicationFiled: September 6, 2002Publication date: May 1, 2003Inventors: Yasuhiro Yano, Hidekazu Matsuura, Yoshihiro Nomura, Yoshii Morishita, Touichi Sakata, Hiroshi Nishizawa, Toshiaki Tanaka, Masaaki Yasuda, Aizou Kaneda
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Patent number: 6404068Abstract: A paste composition which comprises as essential ingredients (A) a thermoplastic resin, (B) an epoxy resin, (C) a coupling agent, (D) a powdery inorganic filler, (E) a powder having rubber elasticity and (F) an organic solvent and which, when applied and dried, gives a coating film having a void content of 3% by volume or higher and a water vapor permeability as measured at 40° C. and 90 %RH of 500 g/m2·24 h or less; a protective film which is formed by applying the paste composition to a surface of a semiconductor part and drying it and has a void content of 3% by volume or higher and a water vapor permeability as measured at 40° C. and 90%RH of 500 g/m2·24 h or less; and a semiconductor device having the protective film.Type: GrantFiled: February 20, 2001Date of Patent: June 11, 2002Assignee: Hitachi Chemical Company, Ltd.Inventors: Toshiaki Tanaka, Takafumi Dohdoh, Tsutomu Kitakatsu, Aizou Kaneda, Masaaki Yasuda, Takashi Kousaka, Akira Kageyama
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Publication number: 20010035533Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: ApplicationFiled: February 20, 2001Publication date: November 1, 2001Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Publication number: 20010016384Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: ApplicationFiled: February 20, 2001Publication date: August 23, 2001Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda