Abstract: A thin film magnetic recording disk that has a layer of lubricant bonded thereto is enclosed within a vapor phase lubricant system that operates to continuously apply lubricant vapors to the disk's bonded lubricant layer by operation of Langmuir kinetics. Lubricant vapors are selectively adsorbed on the disk, including regions of the disk where the bonded lubricant is either too thin or is entirely absent, thus minimizing failures that might be caused by such imperfections in the bonded lubricant layer. A reactive perfluoropolyether (PFPE) lubricant containing chemically active functional groups is substantially bonded onto the recording surface of the disk, for example by the application of heat. The mobile residue of this bonded lubricant layer may be left on the disk, to thereafter function as a non-bonded, mobile, lubricant layer covering the surface of the bonded lubricant layer.

Abstract: A lubricant film for a thin-film disk is disclosed. The lubricant film comprises a monolayer of fixed lubricant bonded to the surface of the thin-film disk and a mobile lubricant in contact with the layer of fixed lubricant. The monolayer of lubricant film is applied to the thin-film in a method comprising applying a lubricant composition to the surface of a thin-film disk, then heating the thin-film disk at a sufficient temperature for a sufficient time to bond or fix a portion of the lubricant composition to the disk; to evaporate a portion of the lubricant composition from the surface of the disk; and to dispose a portion of the lubricant composition as a mobile lubricant in contact with the fixed lubricant.

Abstract: A method and a solder transfer member for applying discrete bodies of solder of predetermined size to the leads of a component for subsequent surface mounting to a substrate. The transfer member is a plate having a non-wetted surface, for example titanium, with an array of cavities matching the component lead pattern, each having a volume corresponding to the desired amount of solder to be applied to the corresponding lead. The method includes placing solder paste on the transfer member and filling the cavities by wiping the plate surface. The component is placed on the transfer member with the leads contacting the solder paste in the cavities. Reflow of the solder paste bonds to each lead a discrete body of solder having a precisely determined size.