Patents by Inventor Ajay P. Giri
Ajay P. Giri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8314500Abstract: An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting metallurgy including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.Type: GrantFiled: December 28, 2006Date of Patent: November 20, 2012Assignee: Ultratech, Inc.Inventors: Luc Belanger, Stephen L. Buchwalter, Leena Paivikki Buchwalter, Ajay P. Giri, Jonathan H. Griffith, Donald W. Henderson, Sung Kwon Kang, Eric H. Laine, Christian Lavoie, Paul A. Lauro, Valérie Anne Oberson, Da-Yuan Shih, Kamalesh K Srivastava, Michael J. Sullivan
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Patent number: 8003512Abstract: Methods and UBM structures having bilayer or trilayer UBM layers that include a thin TiW adhesion layer and a thick Ni-based barrier layer thereover both deposited under sputtering operating conditions that provide the resultant bilayer or trilayer UBM layers with minimal composite stresses. The Ni-based barrier layer may be pure Ni or a Ni alloy. These UBM layers may be patterned to fabricate bilayer or trilayer UBM capture pads, followed by joining a lead-free solder thereto for providing lead-free solder joints that maintain reliability after multiple reflows. Optionally, the top layer of the trilayer UBM structures may include soluble or insoluble metals for doping the lead-free solder connections.Type: GrantFiled: February 3, 2009Date of Patent: August 23, 2011Assignee: International Business Machines CorporationInventors: Luc L. Belanger, Marc A. Bergendahl, Ajay P. Giri, Paul A. Lauro, Valerie A. Oberson, Da-Yuan Shih
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Patent number: 7932169Abstract: An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting metallurgy including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.Type: GrantFiled: October 5, 2009Date of Patent: April 26, 2011Assignee: International Business Machines CorporationInventors: Luc Belanger, Stephen L. Buchwalter, Leena Paivikki Buchwalter, Ajay P. Giri, Jonathan H. Griffith, Donald W. Henderson, Sung Kwon Kang, Eric H. Laine, Christian Lavoie, Paul A. Lauro, Valérie Anne Oberson, Da-Yuan Shih, Kamalesh K Srivastava, Michael J. Sullivan
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Publication number: 20100193949Abstract: Methods and UBM structures having bilayer or trilayer UBM layers that include a thin TiW adhesion layer and a thick Ni-based barrier layer thereover both deposited under sputtering operating conditions that provide the resultant bilayer or trilayer UBM layers with minimal composite stresses. The Ni-based barrier layer may be pure Ni or a Ni alloy. These UBM layers may be patterned to fabricate bilayer or trilayer UBM capture pads, followed by joining a lead-free solder thereto for providing lead-free solder joints that maintain reliability after multiple reflows. Optionally, the top layer of the trilayer UBM structures may include soluble or insoluble metals for doping the lead-free solder connections.Type: ApplicationFiled: February 3, 2009Publication date: August 5, 2010Applicant: International Business Machines CorporationInventors: Luc L. Belanger, Marc A. Bergendahl, Ajay P. Giri, Paul A. Lauro, Valerie A. Oberson, Da-Yuan Shih
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Publication number: 20100062597Abstract: An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting metallurgy including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.Type: ApplicationFiled: October 5, 2009Publication date: March 11, 2010Inventors: Luc Belanger, Stephen L. Buchwalter, Leena Paivikki Buchwalter, Ajay P. Giri, Jonathan H. Griffith, Donald W. Henderson, Sung Kwon Kang, Eric H. Laine, Christian Lavoie, Paul A. Lauro, Valérie Anne Oberson, Da-Yuan Shih, Kamalesh K. Srivastava, Michael J. Sullivan
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Publication number: 20080157395Abstract: An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting metallurgy including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.Type: ApplicationFiled: December 28, 2006Publication date: July 3, 2008Inventors: Luc Belanger, Stephen L. Buchwalter, Leena Paivikki Buchwalter, Ajay P. Giri, Jonathan H. Griffith, Donald W. Henderson, Sung Kwon Kang, Eric H. Laine, Christian Lavoie, Paul A. Lauro, Valerie Anne Oberson, Da-Yuan Shih, Kamalesh K. Srivastava, Michael J. Sullivan
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Patent number: 6896784Abstract: A process for electroplating metallic features of different density on a surface of a substrate comprises providing an electroplating bath having an anode, immersing the substrate into the electroplating bath, spaced from the anode, the substrate comprising a cathode. Positioned in the electroplating bath between the substrate and the anode, and adjacent to and separated from the substrate surface is a second cathode that includes a wire mesh screening portion having openings of different sizes conforming to the metallic features to be electroplated. The second cathode screening portion has openings of larger size adjacent areas of higher density of features to be electroplated and openings of smaller size adjacent areas of lower density of features to be electroplated.Type: GrantFiled: June 15, 2004Date of Patent: May 24, 2005Assignee: International Business Machines CorporationInventors: Tien-Jen Cheng, Todd M. Fowler, Ajay P. Giri, Anton Nenadic, Blessen Samuel, Keith Kwong Hon Wong
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Patent number: 6890413Abstract: A process for electroplating metallic features of different density on a surface of a substrate comprises providing an electroplating bath having an anode, immersing the substrate into the electroplating bath, spaced from the anode, the substrate comprising a cathode. Positioned in the electroplating bath between the substrate and the anode, and adjacent to and separated from the substrate surface is a second cathode that includes a wire mesh screening portion having openings of different sizes conforming to the metallic features to be electroplated. The second cathode screening portion has openings of larger size adjacent areas of higher density of features to be electroplated and openings of smaller size adjacent areas of lower density of features to be electroplated.Type: GrantFiled: December 11, 2002Date of Patent: May 10, 2005Assignee: International Business Machines CorporationInventors: Tien-Jen Cheng, Todd M. Fowler, Ajay P. Giri, Anton Nenadic, Blessen Samuel, Keith Kwong Hon Wong
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Publication number: 20040226826Abstract: A process for electroplating metallic features of different density on a surface of a substrate comprises providing an electroplating bath having an anode, immersing the substrate into the electroplating bath, spaced from the anode, the substrate comprising a cathode. Positioned in the electroplating bath between the substrate and the anode, and adjacent to and separated from the substrate surface is a second cathode that includes a wire mesh screening portion having openings of different sizes conforming to the metallic features to be electroplated. The second cathode screening portion has openings of larger size adjacent areas of higher density of features to be electroplated and openings of smaller size adjacent areas of lower density of features to be electroplated.Type: ApplicationFiled: June 15, 2004Publication date: November 18, 2004Applicant: International Business Machines IncorporationInventors: Tien-Jen Cheng, Todd M. Fowler, Ajay P. Giri, Anton Nenadic, Blessen Samuel, Keith Kwong Hon Wong
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Publication number: 20040115932Abstract: A process for electroplating metallic features of different density on a surface of a substrate comprises providing an electroplating bath having an anode, immersing the substrate into the electroplating bath, spaced from the anode, the substrate comprising a cathode. Positioned in the electroplating bath between the substrate and the anode, and adjacent to and separated from the substrate surface is a second cathode that includes a wire mesh screening portion having openings of different sizes conforming to the metallic features to be electroplated. The second cathode screening portion has openings of larger size adjacent areas of higher density of features to be electroplated and openings of smaller size adjacent areas of lower density of features to be electroplated.Type: ApplicationFiled: December 11, 2002Publication date: June 17, 2004Applicant: International Business Machines CorporationInventors: Tien-Jen Cheng, Todd M. Fowler, Ajay P. Giri, Anton Nenadic, Blessen Samuel, Keith Kwong Hon Wong
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Patent number: 6678949Abstract: A structure for mounting electronic devices. The structure uses a non-conductive, compliant spacer interposed between an underlying carrier and an overlying thin film. The spacer includes a pattern of through-vias which matches opposing interconnects on opposing surfaces of the carrier and the thin film. In this way, solder connections can extend in the through-vias to electrically connect the thin film to the carrier and smooth out topography. In a related process for forming the structure, the thin film is built on a first sacrificial carrier and then further processed on a second sacrificial carrier to keep it from distorting, expanding, or otherwise suffering adversely during its processing. The solder connections between the thin film and the carrier are formed using a closed solder joining process. The spacer is used with laminate cards to create thermal stress release structures on portions of the cards carrying a thin film.Type: GrantFiled: June 21, 2001Date of Patent: January 20, 2004Assignee: International Business Machines CorporationInventors: Chandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri, Lewis S. Goldmann, Kimberley A. Kelly, Bouwe W. Leenstra, Voya R. Markovich, Eric D. Perfecto, Sampath Purushothaman, Joseph M. Sullivan
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Patent number: 6451155Abstract: A heat sink assembly and method for attaching a multi-chip module cap to a polymeric heat sink adhesive by means of a thin adhesion-promoting metal film layer, which provides an interfacial bond between the cap and polymeric adhesive meeting package performance and reliability requirements. There is also a method of promoting adhesion between a silicon-containing polymeric adhesive and a metal surface using the thin adhesion-promoting metal film layer and the products thereof.Type: GrantFiled: October 24, 1996Date of Patent: September 17, 2002Assignee: International Business Machines CorporationInventors: Hilton T. Toy, David L. Edwards, Da-Yuan Shih, Ajay P. Giri
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Publication number: 20010037565Abstract: A structure for mounting electronic devices. The structure uses a non-conductive, compliant spacer interposed between an underlying carrier and an overlying thin film. The spacer includes a pattern of through-vias which matches opposing interconnects on opposing surfaces of the carrier and the thin film. In this way, solder connections can extend in the through-vias to electrically connect the thin film to the carrier and smooth out topography. In a related process for forming the structure, the thin film is built on a first sacrificial carrier and then further processed on a second sacrificial carrier to keep it from distorting, expanding, or otherwise suffering adversely during its processing. The solder connections between the thin film and the carrier are formed using a closed solder joining process. The spacer is used with laminate cards to create thermal stress release structures on portions of the cards carrying a thin film.Type: ApplicationFiled: June 21, 2001Publication date: November 8, 2001Inventors: Chandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri, Lewis S. Goldmann, Kimberley A. Kelly, Bouwe W. Leenstra, Voya R. Markovich, Eric D. Perfecto, Sampath Purushothaman, Joseph M. Sullivan
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Patent number: 6291272Abstract: A process for fabricating a microelectronic structure. The process comprises processing a metal carrier having a top surface and a bottom surface, wherein the top surface and the bottom surface are processed to promote adhesion, forming a dielectric layer around the metal carrier, wherein the dielectric layer substantially covers the top surface and the bottom surface of the metal carrier, and applying a first patterned layer of conductive material to the microelectronic structure. In one preferred embodiment, the process further comprises comprising sintering the metal carrier, the dielectric layer, and the first patterned layer of conductive material. In one preferred embodiment, the process further comprises forming a via hole through the metal carrier before the forming of the dielectric layer around the metal carrier, wherein the forming of the dielectric layer comprises forming the dielectric layer inside the via hole.Type: GrantFiled: December 23, 1999Date of Patent: September 18, 2001Assignee: International Business Machines CorporationInventors: Ajay P. Giri, John U. Knickerbocker, David C. Long, Subhash L. Shinde, Lisa M. Studzinski, Rao V. Vallabhaneni
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Patent number: 6281452Abstract: A structure for mounting electronic devices which uses a non-conductive, compliant spacer interposed between an underlying carrier and an overlying thin film. The spacer includes a pattern of through-vias which matches opposing interconnects on opposing surfaces of the carrier and the thin film. In this way, solder connections can extend in the through-vias to electrically connect the thin film to the carrier and smooth out topography. In a related process for forming the structure, the thin film is built on a first sacrificial carrier and then further processed on a second sacrificial carrier to keep it from distorting, expanding, or otherwise suffering adversely during its processing. The solder connections between the thin film and the carrier are formed using a closed solder joining process. The spacer is used with laminate cards to create thermal stress release structures on portions of the cards carrying a thin film.Type: GrantFiled: December 3, 1998Date of Patent: August 28, 2001Assignee: International Business Machines CorporationInventors: Chandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri, Lewis S. Goldmann, Kimberley A. Kelly, Bouwe W. Leenstra, Voya R. Markovich, Eric D. Perfecto, Sampath Purushothaman, Joseph M. Sullivan
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Patent number: 6261467Abstract: A high performance TF-ceramic module for mounting integrated circuit chips thereto and a method of fabricating the module at reduced cost. The substrate includes thin film (TF) layers formed directly on a layered ceramic base. A first thick film wiring layer is formed on or embedded in a top surface of the thick film layered ceramic base using thick film techniques. A first dielectric layer of a polyimide or other organic material, or an insulating material different than the ceramic material is formed on top of the first wiring layer. The dielectric layer may be spun on or sprayed on and baked; vapor deposited; laminated to the ceramic base; or an inorganic layer may be deposited using plasma enhanced chemical vapor deposition (PECVD). Vias are formed through the first dielectric layer. A second wiring layer is formed on the first dielectric layer. A second dielectric layer is formed on the second wiring layer.Type: GrantFiled: October 27, 1999Date of Patent: July 17, 2001Assignee: International Business Machines CorporationInventors: Ajay P. Giri, Sundar M. Kamath, Daniel P. O'Connor, Rajesh B. Patel, Herbert I. Stoller, Lisa M. Studzinski, Paul R. Walling
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Patent number: 6235412Abstract: A process for producing a terminal metal pad structure electrically interconnecting a package and other components. More particularly, the invention encompasses a process for producing a plurality of corrosion-resistant terminal metal pads. Each pad includes a base pad containing copper which is encapsulated within a series of successively electroplated metal encapsulating films to produce a corrosion-resistant terminal metal pad.Type: GrantFiled: April 6, 2000Date of Patent: May 22, 2001Assignee: International Business Machines CorporationInventors: Tien-Jen Cheng, Ajay P. Giri, Ashwani K. Malhotra, John R. Pennacchia, Eric D. Perfecto, Roy Yu
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Patent number: 6083375Abstract: A process for producing a terminal metal pad structure electrically interconnecting a package and other components. More particularly, the invention encompasses a process for producing a plurality of corrosion-resistant terminal metal pads. Each pad includes a base pad containing copper which is encapsulated within a series of successively electroplated metal encapsulating films to produce a corrosion-resistant terminal metal pad.Type: GrantFiled: November 2, 1998Date of Patent: July 4, 2000Assignee: International Business Machines CorporationInventors: Tien-Jen Cheng, Ajay P. Giri, Ashwani K. Malhotra, John R. Pennacchia, Eric D. Perfecto, Roy Yu
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Patent number: 6037044Abstract: A high performance TF-ceramic module for mounting integrated circuit chips thereto and a method of fabricating the module at reduced cost. The substrate includes thin film (TF) layers formed directly on a layered ceramic base. A first thick film wiring layer is formed on or embedded in a top surface of the thick film layered ceramic base using thick film techniques. A first dielectric layer of a polyimide or other organic material, or an insulating material different than the ceramic material is formed on top of the first wiring layer. The dielectric layer may be spun on or sprayed on and baked; vapor deposited; laminated to the ceramic base; or an inorganic layer may be deposited using plasma enhanced chemical vapor deposition (PECVD). Vias are formed through the first dielectric layer. A second wiring layer is formed on the first dielectric layer. A second dielectric layer is formed on the second wiring layer.Type: GrantFiled: January 8, 1998Date of Patent: March 14, 2000Assignee: International Business Machines CorporationInventors: Ajay P. Giri, Sundar M. Kamath, Daniel P. O'Connor, Rajesh B. Patel, Herbert I. Stoller, Lisa M. Studzinski, Paul R. Walling
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Adhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using same
Patent number: 5931222Abstract: A heat sink assembly and method for attaching a multi-chip module cap to a polymeric heat sink adhesive by means of a thin adhesion-promoting metal film layer, which provides an interfacial bond between the cap and polymeric adhesive meeting package performance and reliability requirements. There is also a method of promoting adhesion between a silicon-containing polymeric adhesive and a metal surface using the thin adhesion-promoting metal film layer and the products thereof.Type: GrantFiled: July 30, 1997Date of Patent: August 3, 1999Assignee: International Business Machines CoporationInventors: Hilton T. Toy, David L. Edwards, Da-Yuan Shih, Ajay P. Giri