Patents by Inventor Ajay Pai
Ajay Pai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11846438Abstract: A Heating, Ventilation, and/or Air Conditioning (HVAC) controller configured to control at least part of an HVAC system of a building. The HVAC controller may include a user interface and a controller. In response to a selection by a user at the user interface, the controller may assemble and present via the user interface an output that encodes settings in a machine readable form. The controller may display the encoded settings on the display with fixed segments of a fixed segment display. An application program code on a remote device may be utilized to capture the displayed fixed segments that encode the settings in an image. The captured image of fixed segments may be decoded at the remote device or may be sent to a remote computing device for processing and/or decoding.Type: GrantFiled: October 22, 2021Date of Patent: December 19, 2023Assignee: Ademco Inc.Inventors: Nathaniel D. Kraft, Bernard T. Geary, Ajay Pai, Michael Albright, Sharath Venkatesha, Jeffrey Boll
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Patent number: 11650555Abstract: A system and approach for remote reading, setting and control of devices such as thermostats. A phone, such as a smartphone, a gateway and a cloud may be incorporated relative to interaction with the device or devices. The gateway may have a hub that has bluetooth communication capabilities with the device. The hub may be connected to a router that in turn is connected to a cloud in a wireless or wired manner. The phone may communicate with the cloud to achieve interaction with the device. The hub may also handle WiFi communications. The gateway may instead be a phone that contains an app which lets operate as a gateway for communications with the cloud. There may be one or more devices that are a part of one or more home area networks that are connected to a gateway via bluetooth and WiFi, and in turn connected to the cloud.Type: GrantFiled: May 14, 2020Date of Patent: May 16, 2023Assignee: Ademco Inc.Inventors: David J. Emmons, Ajay Pai, Soumitri Kolavennu
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Publication number: 20220042697Abstract: A Heating, Ventilation, and/or Air Conditioning (HVAC) controller configured to control at least part of an HVAC system of a building. The HVAC controller may include a user interface and a controller. In response to a selection by a user at the user interface, the controller may assemble and present via the user interface an output that encodes settings in a machine readable form. The controller may display the encoded settings on the display with fixed segments of a fixed segment display. An application program code on a remote device may be utilized to capture the displayed fixed segments that encode the settings in an image. The captured image of fixed segments may be decoded at the remote device or may be sent to a remote computing device for processing and/or decoding.Type: ApplicationFiled: October 22, 2021Publication date: February 10, 2022Inventors: Nathaniel D. Kraft, Bernard T. Geary, Ajay Pai, Michael Albright, Sharath Venkatesha, Jeffrey Boll
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Patent number: 11156375Abstract: A Heating, Ventilation, and/or Air Conditioning (HVAC) controller configured to control at least part of an HVAC system of a building. The HVAC controller may include a user interface and a controller. In response to a selection by a user at the user interface, the controller may assemble and present via the user interface an output that encodes settings in a machine readable form. The controller may display the encoded settings on the display with fixed segments of a fixed segment display. An application program code on a remote device may be utilized to capture the displayed fixed segments that encode the settings in an image. The captured image of fixed segments may be decoded at the remote device or may be sent to a remote computing device for processing and/or decoding.Type: GrantFiled: July 22, 2016Date of Patent: October 26, 2021Assignee: Ademco Inc.Inventors: Nathaniel D. Kraft, Bernard T. Geary, Ajay Pai, Michael Albright, Sharath Venkatesha, Jeffrey Boll
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Publication number: 20200272115Abstract: A system and approach for remote reading, setting and control of devices such as thermostats. A phone, such as a smartphone, a gateway and a cloud may be incorporated relative to interaction with the device or devices. The gateway may have a hub that has bluetooth communication capabilities with the device. The hub may be connected to a router that in turn is connected to a cloud in a wireless or wired manner. The phone may communicate with the cloud to achieve interaction with the device. The hub may also handle WiFi communications. The gateway may instead be a phone that contains an app which lets operate as a gateway for communications with the cloud. There may be one or more devices that are a part of one or more home area networks that are connected to a gateway via bluetooth and WiFi, and in turn connected to the cloud.Type: ApplicationFiled: May 14, 2020Publication date: August 27, 2020Inventors: David J. Emmons, Ajay Pai, Soumitri Kolavennu
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Patent number: 10691083Abstract: A system and approach for remote reading, setting and control of devices such as thermostats. A phone, such as a smartphone, a gateway and a cloud may be incorporated relative to interaction with the device or devices. The gateway may have a hub that has bluetooth communication capabilities with the device. The hub may be connected to a router that in turn is connected to a cloud in a wireless or wired manner. The phone may communicate with the cloud to achieve interaction with the device. The hub may also handle WiFi communications. The gateway may instead be a phone that contains an app which lets operate as a gateway for communications with the cloud. There may be one or more devices that are a part of one or more home area networks that are connected to a gateway via bluetooth and WiFi, and in turn connected to the cloud.Type: GrantFiled: August 7, 2015Date of Patent: June 23, 2020Assignee: Ademco Inc.Inventors: David J. Emmons, Ajay Pai, Soumitri Kolavennu
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Patent number: 10372093Abstract: The present disclosure relates to systems and methods for mapping a building space using wearable devices in order to better control the comfort level in the building. In some instances, a system compiles information such as temperature information that is provided by an individual's wearable device as the individual moves about the building over time. Using this data, the system may create and/or update a comfort map of the building, which can be used to determine how various rooms of the building heat and cool over time, as well as usage pattern of the various rooms of the building. The system can then use the comfort map of the building to better control one or more comfort sources of the building.Type: GrantFiled: January 19, 2016Date of Patent: August 6, 2019Assignee: Ademco Inc.Inventors: Pedro Davalos, Wendy Foslien, Ajay Pai
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Publication number: 20180023837Abstract: A Heating, Ventilation, and/or Air Conditioning (HVAC) controller configured to control at least part of an HVAC system of a building. The HVAC controller may include a user interface and a controller. In response to a selection by a user at the user interface, the controller may assemble and present via the user interface an output that encodes settings in a machine readable form. The controller may display the encoded settings on the display with fixed segments of a fixed segment display. An application program code on a remote device may be utilized to capture the displayed fixed segments that encode the settings in an image. The captured image of fixed segments may be decoded at the remote device or may be sent to a remote computing device for processing and/or decoding.Type: ApplicationFiled: July 22, 2016Publication date: January 25, 2018Inventors: Nathaniel D. Kraft, Bernard T. Geary, Ajay Pai, Michael Albright, Sharath Venkatesha, Jeffrey Boll
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Publication number: 20160252267Abstract: The present disclosure relates to systems and methods for mapping a building space using wearable devices in order to better control the comfort level in the building. In some instances, a system compiles information such as temperature information that is provided by an individual's wearable device as the individual moves about the building over time. Using this data, the system may create and/or update a comfort map of the building, which can be used to determine how various rooms of the building heat and cool over time, as well as usage pattern of the various rooms of the building. The system can then use the comfort map of the building to better control one or more comfort sources of the building.Type: ApplicationFiled: January 19, 2016Publication date: September 1, 2016Inventors: Pedro Davalos, Wendy Foslien, Ajay Pai
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Publication number: 20160040903Abstract: A system and approach for remote reading, setting and control of devices such as thermostats. A phone, such as a smartphone, a gateway and a cloud may be incorporated relative to interaction with the device or devices. The gateway may have a hub that has bluetooth communication capabilities with the device. The hub may be connected to a router that in turn is connected to a cloud in a wireless or wired manner. The phone may communicate with the cloud to achieve interaction with the device. The hub may also handle WiFi communications. The gateway may instead be a phone that contains an app which lets operate as a gateway for communications with the cloud. There may be one or more devices that are a part of one or more home area networks that are connected to a gateway via bluetooth and WiFi, and in turn connected to the cloud.Type: ApplicationFiled: August 7, 2015Publication date: February 11, 2016Inventors: David J. Emmons, Ajay Pai, Soumitri Kolavennu
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Patent number: 9062859Abstract: Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. The at least one image can be analyzed in order to identify an edge bead removal line. An illumination system having a diffuser can further be used in capturing images.Type: GrantFiled: April 23, 2013Date of Patent: June 23, 2015Assignee: Rudolph Technologies, Inc.Inventors: Christopher Voges, Ajay Pai, Antony Ravi Philip, Tuan D. Le
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Patent number: 8818074Abstract: Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed pixel arrays is generated by compressing each of the pixel arrays in the first dimension and concatenating the pixel arrays. The composite image is analyzed to identify a wafer feature, for example using a sinusoidal line fit.Type: GrantFiled: May 8, 2012Date of Patent: August 26, 2014Assignee: Rudolph Technologies, Inc.Inventors: Ajay Pai, Tuan D. Le
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Patent number: 8492178Abstract: Systems and method for monitoring semiconductor wafer fabrication processing, for example based upon EBR line inspection, including capturing at least one image of a wafer at an intermediate stage of fabrication. The captured image(s) are compressed to generate a composite representation of at least an edge zone of the wafer. An edge bead removal area is identified in the representation, and at least one feature attribute is extracted from the identified area. The extracted feature attribute is automatically assessed, and information relating to a status of the fabrication processing in generated based upon the assessment. For example, recommended modifications to the fabrication processing, either upstream or downstream of the current stage of fabrication (or both) can be generated and implemented.Type: GrantFiled: February 25, 2008Date of Patent: July 23, 2013Assignee: Rudolph Technologies, Inc.Inventors: Alan Carlson, Ajay Pai, Tuan D. Le, Antony Ravi Philip
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Patent number: 8426223Abstract: Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. The at least one image can be analyzed in order to identify an edge bead removal line. An illumination system having a diffuser can further be used in capturing images.Type: GrantFiled: September 8, 2009Date of Patent: April 23, 2013Assignee: Rudolph Technologies, Inc.Inventors: Christopher Voges, Ajay Pai, Antony Ravi Philip, Tuan D. Le
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Publication number: 20130022260Abstract: Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed pixel arrays is generated by compressing each of the pixel arrays in the first dimension and concatenating the pixel arrays. The composite image is analyzed to identify a wafer feature, for example using a sinusoidal line fit.Type: ApplicationFiled: May 8, 2012Publication date: January 24, 2013Applicant: Rudolph Technologies, Inc.Inventors: Ajay Pai, Tuan D. Le
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Patent number: 8175372Abstract: Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed pixel arrays is generated by compressing each of the pixel arrays in the first dimension and concatenating the pixel arrays. The composite image is analyzed to identify a wafer feature, for example using a sinusoidal line fit.Type: GrantFiled: December 17, 2010Date of Patent: May 8, 2012Assignee: Rudolph Technologies, Inc.Inventors: Ajay Pai, Tuan D. Le
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Publication number: 20110263049Abstract: Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. The at least one image can be analyzed in order to identify an edge bead removal line. An illumination system having a diffuser can further be used in capturing images.Type: ApplicationFiled: September 8, 2009Publication date: October 27, 2011Applicant: Rudolph Technologies, Inc.Inventors: Christopher Voges, Ajay Pai, Antony Ravi Philip, Tuan D. Le
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Publication number: 20110085725Abstract: Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed pixel arrays is generated by compressing each of the pixel arrays in the first dimension and concatenating the pixel arrays. The composite image is analyzed to identify a wafer feature, for example using a sinusoidal line fit.Type: ApplicationFiled: December 17, 2010Publication date: April 14, 2011Applicant: Rudolph Technologies, Inc.Inventors: Ajay Pai, Tuan D. Le
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Publication number: 20110054659Abstract: Systems and method for monitoring semiconductor wafer fabrication processing, for example based upon EBR line inspection, including capturing at least one image of a wafer at an intermediate stage of fabrication. The captured image(s) are compressed to generate a composite representation of at least an edge zone of the wafer. An edge bead removal area is identified in the representation, and at least one feature attribute is extracted from the identified area. The extracted feature attribute is automatically assessed, and information relating to a status of the fabrication processing in generated based upon the assessment. For example, recommended modifications to the fabrication processing, either upstream or downstream of the current stage of fabrication (or both) can be generated and implemented.Type: ApplicationFiled: February 25, 2008Publication date: March 3, 2011Applicant: RUDOLPH TECHNOLOGIES, INC.Inventors: Alan Carlson, Ajay Pai, Tuan D. Le, Antony Ravi Philip
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Patent number: 7865010Abstract: Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed pixel arrays is generated by compressing each of the pixel arrays in the first dimension and concatenating the pixel arrays. The composite image is analyzed to identify a wafer feature, for example using a sinusoidal line fit.Type: GrantFiled: October 1, 2009Date of Patent: January 4, 2011Assignee: Rudolph Technologies, Inc.Inventors: Ajay Pai, Tuan D. Le