Patents by Inventor Ajay Pai

Ajay Pai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11846438
    Abstract: A Heating, Ventilation, and/or Air Conditioning (HVAC) controller configured to control at least part of an HVAC system of a building. The HVAC controller may include a user interface and a controller. In response to a selection by a user at the user interface, the controller may assemble and present via the user interface an output that encodes settings in a machine readable form. The controller may display the encoded settings on the display with fixed segments of a fixed segment display. An application program code on a remote device may be utilized to capture the displayed fixed segments that encode the settings in an image. The captured image of fixed segments may be decoded at the remote device or may be sent to a remote computing device for processing and/or decoding.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: December 19, 2023
    Assignee: Ademco Inc.
    Inventors: Nathaniel D. Kraft, Bernard T. Geary, Ajay Pai, Michael Albright, Sharath Venkatesha, Jeffrey Boll
  • Patent number: 11650555
    Abstract: A system and approach for remote reading, setting and control of devices such as thermostats. A phone, such as a smartphone, a gateway and a cloud may be incorporated relative to interaction with the device or devices. The gateway may have a hub that has bluetooth communication capabilities with the device. The hub may be connected to a router that in turn is connected to a cloud in a wireless or wired manner. The phone may communicate with the cloud to achieve interaction with the device. The hub may also handle WiFi communications. The gateway may instead be a phone that contains an app which lets operate as a gateway for communications with the cloud. There may be one or more devices that are a part of one or more home area networks that are connected to a gateway via bluetooth and WiFi, and in turn connected to the cloud.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: May 16, 2023
    Assignee: Ademco Inc.
    Inventors: David J. Emmons, Ajay Pai, Soumitri Kolavennu
  • Publication number: 20220042697
    Abstract: A Heating, Ventilation, and/or Air Conditioning (HVAC) controller configured to control at least part of an HVAC system of a building. The HVAC controller may include a user interface and a controller. In response to a selection by a user at the user interface, the controller may assemble and present via the user interface an output that encodes settings in a machine readable form. The controller may display the encoded settings on the display with fixed segments of a fixed segment display. An application program code on a remote device may be utilized to capture the displayed fixed segments that encode the settings in an image. The captured image of fixed segments may be decoded at the remote device or may be sent to a remote computing device for processing and/or decoding.
    Type: Application
    Filed: October 22, 2021
    Publication date: February 10, 2022
    Inventors: Nathaniel D. Kraft, Bernard T. Geary, Ajay Pai, Michael Albright, Sharath Venkatesha, Jeffrey Boll
  • Patent number: 11156375
    Abstract: A Heating, Ventilation, and/or Air Conditioning (HVAC) controller configured to control at least part of an HVAC system of a building. The HVAC controller may include a user interface and a controller. In response to a selection by a user at the user interface, the controller may assemble and present via the user interface an output that encodes settings in a machine readable form. The controller may display the encoded settings on the display with fixed segments of a fixed segment display. An application program code on a remote device may be utilized to capture the displayed fixed segments that encode the settings in an image. The captured image of fixed segments may be decoded at the remote device or may be sent to a remote computing device for processing and/or decoding.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: October 26, 2021
    Assignee: Ademco Inc.
    Inventors: Nathaniel D. Kraft, Bernard T. Geary, Ajay Pai, Michael Albright, Sharath Venkatesha, Jeffrey Boll
  • Publication number: 20200272115
    Abstract: A system and approach for remote reading, setting and control of devices such as thermostats. A phone, such as a smartphone, a gateway and a cloud may be incorporated relative to interaction with the device or devices. The gateway may have a hub that has bluetooth communication capabilities with the device. The hub may be connected to a router that in turn is connected to a cloud in a wireless or wired manner. The phone may communicate with the cloud to achieve interaction with the device. The hub may also handle WiFi communications. The gateway may instead be a phone that contains an app which lets operate as a gateway for communications with the cloud. There may be one or more devices that are a part of one or more home area networks that are connected to a gateway via bluetooth and WiFi, and in turn connected to the cloud.
    Type: Application
    Filed: May 14, 2020
    Publication date: August 27, 2020
    Inventors: David J. Emmons, Ajay Pai, Soumitri Kolavennu
  • Patent number: 10691083
    Abstract: A system and approach for remote reading, setting and control of devices such as thermostats. A phone, such as a smartphone, a gateway and a cloud may be incorporated relative to interaction with the device or devices. The gateway may have a hub that has bluetooth communication capabilities with the device. The hub may be connected to a router that in turn is connected to a cloud in a wireless or wired manner. The phone may communicate with the cloud to achieve interaction with the device. The hub may also handle WiFi communications. The gateway may instead be a phone that contains an app which lets operate as a gateway for communications with the cloud. There may be one or more devices that are a part of one or more home area networks that are connected to a gateway via bluetooth and WiFi, and in turn connected to the cloud.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: June 23, 2020
    Assignee: Ademco Inc.
    Inventors: David J. Emmons, Ajay Pai, Soumitri Kolavennu
  • Patent number: 10372093
    Abstract: The present disclosure relates to systems and methods for mapping a building space using wearable devices in order to better control the comfort level in the building. In some instances, a system compiles information such as temperature information that is provided by an individual's wearable device as the individual moves about the building over time. Using this data, the system may create and/or update a comfort map of the building, which can be used to determine how various rooms of the building heat and cool over time, as well as usage pattern of the various rooms of the building. The system can then use the comfort map of the building to better control one or more comfort sources of the building.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: August 6, 2019
    Assignee: Ademco Inc.
    Inventors: Pedro Davalos, Wendy Foslien, Ajay Pai
  • Publication number: 20180023837
    Abstract: A Heating, Ventilation, and/or Air Conditioning (HVAC) controller configured to control at least part of an HVAC system of a building. The HVAC controller may include a user interface and a controller. In response to a selection by a user at the user interface, the controller may assemble and present via the user interface an output that encodes settings in a machine readable form. The controller may display the encoded settings on the display with fixed segments of a fixed segment display. An application program code on a remote device may be utilized to capture the displayed fixed segments that encode the settings in an image. The captured image of fixed segments may be decoded at the remote device or may be sent to a remote computing device for processing and/or decoding.
    Type: Application
    Filed: July 22, 2016
    Publication date: January 25, 2018
    Inventors: Nathaniel D. Kraft, Bernard T. Geary, Ajay Pai, Michael Albright, Sharath Venkatesha, Jeffrey Boll
  • Publication number: 20160252267
    Abstract: The present disclosure relates to systems and methods for mapping a building space using wearable devices in order to better control the comfort level in the building. In some instances, a system compiles information such as temperature information that is provided by an individual's wearable device as the individual moves about the building over time. Using this data, the system may create and/or update a comfort map of the building, which can be used to determine how various rooms of the building heat and cool over time, as well as usage pattern of the various rooms of the building. The system can then use the comfort map of the building to better control one or more comfort sources of the building.
    Type: Application
    Filed: January 19, 2016
    Publication date: September 1, 2016
    Inventors: Pedro Davalos, Wendy Foslien, Ajay Pai
  • Publication number: 20160040903
    Abstract: A system and approach for remote reading, setting and control of devices such as thermostats. A phone, such as a smartphone, a gateway and a cloud may be incorporated relative to interaction with the device or devices. The gateway may have a hub that has bluetooth communication capabilities with the device. The hub may be connected to a router that in turn is connected to a cloud in a wireless or wired manner. The phone may communicate with the cloud to achieve interaction with the device. The hub may also handle WiFi communications. The gateway may instead be a phone that contains an app which lets operate as a gateway for communications with the cloud. There may be one or more devices that are a part of one or more home area networks that are connected to a gateway via bluetooth and WiFi, and in turn connected to the cloud.
    Type: Application
    Filed: August 7, 2015
    Publication date: February 11, 2016
    Inventors: David J. Emmons, Ajay Pai, Soumitri Kolavennu
  • Patent number: 9062859
    Abstract: Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. The at least one image can be analyzed in order to identify an edge bead removal line. An illumination system having a diffuser can further be used in capturing images.
    Type: Grant
    Filed: April 23, 2013
    Date of Patent: June 23, 2015
    Assignee: Rudolph Technologies, Inc.
    Inventors: Christopher Voges, Ajay Pai, Antony Ravi Philip, Tuan D. Le
  • Patent number: 8818074
    Abstract: Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed pixel arrays is generated by compressing each of the pixel arrays in the first dimension and concatenating the pixel arrays. The composite image is analyzed to identify a wafer feature, for example using a sinusoidal line fit.
    Type: Grant
    Filed: May 8, 2012
    Date of Patent: August 26, 2014
    Assignee: Rudolph Technologies, Inc.
    Inventors: Ajay Pai, Tuan D. Le
  • Patent number: 8492178
    Abstract: Systems and method for monitoring semiconductor wafer fabrication processing, for example based upon EBR line inspection, including capturing at least one image of a wafer at an intermediate stage of fabrication. The captured image(s) are compressed to generate a composite representation of at least an edge zone of the wafer. An edge bead removal area is identified in the representation, and at least one feature attribute is extracted from the identified area. The extracted feature attribute is automatically assessed, and information relating to a status of the fabrication processing in generated based upon the assessment. For example, recommended modifications to the fabrication processing, either upstream or downstream of the current stage of fabrication (or both) can be generated and implemented.
    Type: Grant
    Filed: February 25, 2008
    Date of Patent: July 23, 2013
    Assignee: Rudolph Technologies, Inc.
    Inventors: Alan Carlson, Ajay Pai, Tuan D. Le, Antony Ravi Philip
  • Patent number: 8426223
    Abstract: Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. The at least one image can be analyzed in order to identify an edge bead removal line. An illumination system having a diffuser can further be used in capturing images.
    Type: Grant
    Filed: September 8, 2009
    Date of Patent: April 23, 2013
    Assignee: Rudolph Technologies, Inc.
    Inventors: Christopher Voges, Ajay Pai, Antony Ravi Philip, Tuan D. Le
  • Publication number: 20130022260
    Abstract: Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed pixel arrays is generated by compressing each of the pixel arrays in the first dimension and concatenating the pixel arrays. The composite image is analyzed to identify a wafer feature, for example using a sinusoidal line fit.
    Type: Application
    Filed: May 8, 2012
    Publication date: January 24, 2013
    Applicant: Rudolph Technologies, Inc.
    Inventors: Ajay Pai, Tuan D. Le
  • Patent number: 8175372
    Abstract: Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed pixel arrays is generated by compressing each of the pixel arrays in the first dimension and concatenating the pixel arrays. The composite image is analyzed to identify a wafer feature, for example using a sinusoidal line fit.
    Type: Grant
    Filed: December 17, 2010
    Date of Patent: May 8, 2012
    Assignee: Rudolph Technologies, Inc.
    Inventors: Ajay Pai, Tuan D. Le
  • Publication number: 20110263049
    Abstract: Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. The at least one image can be analyzed in order to identify an edge bead removal line. An illumination system having a diffuser can further be used in capturing images.
    Type: Application
    Filed: September 8, 2009
    Publication date: October 27, 2011
    Applicant: Rudolph Technologies, Inc.
    Inventors: Christopher Voges, Ajay Pai, Antony Ravi Philip, Tuan D. Le
  • Publication number: 20110085725
    Abstract: Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed pixel arrays is generated by compressing each of the pixel arrays in the first dimension and concatenating the pixel arrays. The composite image is analyzed to identify a wafer feature, for example using a sinusoidal line fit.
    Type: Application
    Filed: December 17, 2010
    Publication date: April 14, 2011
    Applicant: Rudolph Technologies, Inc.
    Inventors: Ajay Pai, Tuan D. Le
  • Publication number: 20110054659
    Abstract: Systems and method for monitoring semiconductor wafer fabrication processing, for example based upon EBR line inspection, including capturing at least one image of a wafer at an intermediate stage of fabrication. The captured image(s) are compressed to generate a composite representation of at least an edge zone of the wafer. An edge bead removal area is identified in the representation, and at least one feature attribute is extracted from the identified area. The extracted feature attribute is automatically assessed, and information relating to a status of the fabrication processing in generated based upon the assessment. For example, recommended modifications to the fabrication processing, either upstream or downstream of the current stage of fabrication (or both) can be generated and implemented.
    Type: Application
    Filed: February 25, 2008
    Publication date: March 3, 2011
    Applicant: RUDOLPH TECHNOLOGIES, INC.
    Inventors: Alan Carlson, Ajay Pai, Tuan D. Le, Antony Ravi Philip
  • Patent number: 7865010
    Abstract: Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed pixel arrays is generated by compressing each of the pixel arrays in the first dimension and concatenating the pixel arrays. The composite image is analyzed to identify a wafer feature, for example using a sinusoidal line fit.
    Type: Grant
    Filed: October 1, 2009
    Date of Patent: January 4, 2011
    Assignee: Rudolph Technologies, Inc.
    Inventors: Ajay Pai, Tuan D. Le