Abstract: A cooling system for power modules is provided. The cooling system includes two covers, a plurality of power modules and a plurality of first spaces. The power modules are disposed between the two covers. Each power module includes a housing, a circuit board and heat dissipation elements disposed on the two sides of the circuit board. There is a through hole on the housing. Each first space is formed between two neighboring power modules or is formed between the cover and the neighboring power module. The heat dissipation elements of each power module are located in the neighboring first spaces, and the through hole of each power module is in communication with the neighboring first spaces. The first spaces and the through holes of the power modules are communicated with each other to form a coolant passageway collaboratively for allowing a coolant to pass through.

Abstract: A cooling system for power modules is provided. The cooling system includes two covers, a plurality of power modules and a plurality of first spaces. The power modules are disposed between the two covers. Each power module includes a housing, a circuit board and heat dissipation elements disposed on the two sides of the circuit board. There is a through hole on the housing. Each first space is formed between two neighboring power modules or is formed between the cover and the neighboring power module. The heat dissipation elements of each power module are located in the neighboring first spaces, and the through hole of each power module is in communication with the neighboring first spaces. The first spaces and the through holes of the power modules are communicated with each other to form a coolant passageway collaboratively for allowing a coolant to pass through.

Abstract: A tri-level inverter power module has an architecture employing a high degree of modularity that allows a base power module to be quickly, easily, and cost effectively configured to address a large variety of applications.

Abstract: Power converter system topologies comprise a first DC/DC converter to pull a positive rail of a high voltage bus up, while a second DC/DC converter pushes a negative rail of the high voltage bus down. One or both the DC/DC converters may be bi-directional. Such topologies are suitable for use with separate primary power sources, and/or auxiliary power sources. Such topologies may include a DC/AC converter, which may be bi-directional. Such topologies may include one or more auxiliary DC/DC converters, which may be bi-directional. Multiple substrates, including at least one stacked above another may enhance packaging.

Abstract: A power converter comprising a DC/AC bridge circuit electrically coupled between positive and negative DC bus terminals and a set of phase terminals, a DC/DC bridge circuit electrically coupled to the positive and negative DC bus terminals and a set of DC bridge terminals. The power converter may be configured to control the transfer of power to and/or from the DC bridge terminals and to control the transfer of power to and/or from the AC phase terminals.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: A power module comprises first and second substrates carrying semiconductor devices and coupled to respective pluralities of heat exchange members without intervening thermally insulative structures. One or more heat exchange loops circulate a heat exchange medium thermally coupled to the heat exchange members. Substrates may function as integral bus bars.