Patents by Inventor Ajay Prabhakar Giri

Ajay Prabhakar Giri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a multichip module having chips on two sides
    Patent number: 6973715
    Abstract: A method of forming a multichip module in which a thin film structure is formed on a temporary carrier and then an electrically insulating frame is attached to the thin film structure. A semiconductor device is attached to the thin film structure and then the temporary carrier is removed. Lastly, at least one semiconductor device is attached to the other side of the thin film structure. There is interconnectvity through the thin film structure between the semiconductor devices and the frame.
    Type: Grant
    Filed: December 3, 2003
    Date of Patent: December 13, 2005
    Assignee: International Business Machines Corporation
    Inventors: Ajay Prabhakar Giri, Joseph Michael Sullivan, Christopher Lee Tessler
  • Multichip module having chips on two sides
    Patent number: 6765152
    Abstract: A multichip module including a frame having contacts suitable for making an electrical connection with an article, preferably a printed wiring board or similar, which is the next level of packaging, a multilayer thin film structure mounted to the frame, and semiconductor devices mounted to the thin film structure with at least one semiconductor device on each of two opposed sides of the thin film structure. The thin film structure includes arrays of pads on opposed surfaces of the thin film structure for connecting the thin film structure to the semiconductor devices and the frame. The thin film structure further includes wiring for chip to chip connectivity and for connecting to the frame.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: July 20, 2004
    Assignee: International Business Machines Corporation
    Inventors: Ajay Prabhakar Giri, Joseph Michael Sullivan, Christopher Lee Tessler
  • Multichip module having chips on two sides
    Publication number: 20040118601
    Abstract: A multichip module including a frame having contacts suitable for making an electrical connection with an article, preferably a printed wiring board or similar, which is the next level of packaging, a multilayer thin film structure mounted to the frame, and semiconductor devices mounted to the thin film structure with at least one semiconductor device on each of two opposed sides of the thin film structure. The thin film structure includes arrays of pads on opposed surfaces of the thin film structure for connecting the thin film structure to the semiconductor devices and the frame. The thin film structure further includes wiring for chip to chip connectivity and for connecting to the frame.
    Type: Application
    Filed: December 3, 2003
    Publication date: June 24, 2004
    Inventors: Ajay Prabhakar Giri, Joseph Michael Sullivan, Christopher Lee Tessler
  • Multichip module having chips on two sides
    Publication number: 20040060732
    Abstract: A multichip module including a frame having contacts suitable for making an electrical connection with an article, preferably a printed wiring board or similar, which is the next level of packaging, a multilayer thin film structure mounted to the frame, and semiconductor devices mounted to the thin film structure with at least one semiconductor device on each of two opposed sides of the thin film structure. The thin film structure includes arrays of pads on opposed surfaces of the thin film structure for connecting the thin film structure to the semiconductor devices and the frame. The thin film structure further includes wiring for chip to chip connectivity and for connecting to the frame.
    Type: Application
    Filed: September 27, 2002
    Publication date: April 1, 2004
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Ajay Prabhakar Giri, Joseph Michael Sullivan, Christopher Lee Tessler