Abstract: A message tracking engine facilitates processing of a message through a determined workflow. In particular, the message tracking engine may route the message to various services in an order specified by the workflow. During processing, the message tracking engine tracks the progress of the message through the workflow. If any issues are encountered, the message tracking engine handles the encountered issues. In one aspect, the message tracking engine facilitates performance of one or more synchronous processing steps of the workflow during a first phase. Following the first phase, the message tracking engine serializes one or more asynchronous processing steps of the workflow to a storage device. After serializing the asynchronous processing steps, the message tracking engine facilitates performance of the asynchronous processing steps during a second phase.

Abstract: A message tracking engine facilitates processing of a message through a determined workflow. In particular, the message tracking engine may route the message to various services in an order specified by the workflow. During processing, the message tracking engine tracks the progress of the message through the workflow. If any issues are encountered, the message tracking engine handles the encountered issues. In one aspect, the message tracking engine facilitates performance of one or more synchronous processing steps of the workflow during a first phase. Following the first phase, the message tracking engine serializes one or more asynchronous processing steps of the workflow to a storage device. After serializing the asynchronous processing steps, the message tracking engine facilitates performance of the asynchronous processing steps during a second phase.

Abstract: An electronic device can include a first die having a first terminal at a first front side, and a second die having a second terminal at a second front side and a through via. In one aspect, a process of forming the electronic device includes supplying a second substrate including a die location of the second die. The process can also include attaching the second substrate to a handling substrate and singulating the second die from the second substrate before removing the handling substrate. In another aspect, the handling substrate can include a rigid substrate. The process can include orienting the front side of the first die and a back side of the second substrate front-to-back with respect to each other. In yet another aspect, the first terminal is electrically connected to the through via and the second terminal. In one embodiment, the electronic device can include a third die.

Abstract: An electronic device can include a first die having a first terminal at a first front side, and a second die having a second terminal at a second front side and a through via. In one aspect, a process of forming the electronic device includes supplying a second substrate including a die location of the second die. The process can also include attaching the second substrate to a handling substrate and singulating the second die from the second substrate before removing the handling substrate. In another aspect, the handling substrate can include a rigid substrate. The process can include orienting the front side of the first die and a back side of the second substrate front-to-back with respect to each other. In yet another aspect, the first terminal is electrically connected to the through via and the second terminal. In one embodiment, the electronic device can include a third die.

Abstract: A method for making a composite integrated device includes providing a first integrated device having a substrate, an overlying interconnect region, and a contact, wherein the contact electrically contacts the interconnect region and is at a surface of the first integrated device. The method further includes forming a sidewall spacer along a sidewall of a first opening in a first dielectric layer, located over the surface of the integrated device, and providing a deformable metal feature adjacent to the sidewall spacer and in the first opening. The method further includes providing a second integrated device having a substrate, an overlying interconnect region, a contact, and a second dielectric layer surrounding the contact of the second integrated device. The method further includes contacting the contact of the second integrated device with the deformable metal feature and pressing the first dielectric layer against the second dielectric layer.

Abstract: An electronic device can include a first die having a first terminal at a first front side, and a second die having a second terminal at a second front side and a through via. In one aspect, a process of forming the electronic device includes supplying a second substrate including a die location of the second die. The process can also include attaching the second substrate to a handling substrate and singulating the second die from the second substrate before removing the handling substrate. In another aspect, the handling substrate can include a rigid substrate. The process can include orienting the front side of the first die and a back side of the second substrate front-to-back with respect to each other. In yet another aspect, the first terminal is electrically connected to the through via and the second terminal. In one embodiment, the electronic device can include a third die.

Abstract: A method for making a composite integrated device includes providing a first integrated device having a substrate, an overlying interconnect region, and a contact, wherein the contact electrically contacts the interconnect region and is at a surface of the first integrated device. The method further includes forming a sidewall spacer along a sidewall of a first opening in a first dielectric layer, located over the surface of the integrated device, and providing a deformable metal feature adjacent to the sidewall spacer and in the first opening. The method further includes providing a second integrated device having a substrate, an overlying interconnect region, a contact, and a second dielectric layer surrounding the contact of the second integrated device. The method further includes contacting the contact of the second integrated device with the deformable metal feature and pressing the first dielectric layer against the second dielectric layer.