Patents by Inventor Ajesh K K

Ajesh K K has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and apparatus to implement microphones in thin form factor electronic devices
    Patent number: 11119532
    Abstract: Methods and apparatus to implement microphones in thin form factor electronic devices are disclosed. An electronic device includes a chassis having an exterior surface and an interior surface. The chassis includes a plurality of holes extending through the chassis. The plurality of holes are within a 1 mm diameter circular area of the chassis. The electronic device further includes a microphone coupled to the interior surface of the chassis adjacent the circular area of the chassis.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: September 14, 2021
    Assignee: Intel Corporation
    Inventors: Sumod Cherukkate, Gopinath K, Prakash Kurma Raju, Ajesh K K
  • METHOD AND SYSTEM OF ENVIRONMENT-SENSITIVE WAKE-ON-VOICE INITIATION USING ULTRASOUND
    Publication number: 20210225374
    Abstract: A system, article, and method of environment-sensitive wake-on-voice initiation uses ultrasound signals.
    Type: Application
    Filed: December 23, 2020
    Publication date: July 22, 2021
    Applicant: Intel Corporation
    Inventors: Sumod Cherukkate, Srikanth Potluri, Ajesh K K, Xintian Lin
  • METHODS AND APPARATUS TO IMPLEMENT MICROPHONES IN THIN FORM FACTOR ELECTRONIC DEVICES
    Publication number: 20190324496
    Abstract: Methods and apparatus to implement microphones in thin form factor electronic devices are disclosed. An electronic device includes a chassis having an exterior surface and an interior surface. The chassis includes a plurality of holes extending through the chassis. The plurality of holes are within a 1 mm diameter circular area of the chassis. The electronic device further includes a microphone coupled to the interior surface of the chassis adjacent the circular area of the chassis.
    Type: Application
    Filed: June 28, 2019
    Publication date: October 24, 2019
    Inventors: Sumod Cherukkate, Gopinath K, Prakash Kurma Raju, Ajesh K K