Patents by Inventor Ajesh Shah

Ajesh Shah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same
    Patent number: 6372113
    Abstract: Treated copper foil produced by electrodepositing on a matte surface of a base copper foil a “corrective” copper layer having a surface roughness different from the surface roughness of the matte surface of the base foil and which has a peak count greater than the peak count of the matte surface of the base foil. In the electrodeposition there are used a unique electrolyte composition and plating conditions effective to control the micro-throwing process of the plating process so that the surface roughness of the corrective is substantially constant from one batch of base foil to another.
    Type: Grant
    Filed: September 13, 1999
    Date of Patent: April 16, 2002
    Assignee: Yates Foil USA, Inc.
    Inventors: Charles B. Yates, George Gaskill, Chinsai T. Cheng, Ajesh Shah, Adam M. Wolski, Paul DuFresne
  • Process and apparatus for the manufacture of high peel-strength copper foil useful in the manufacture of printed circuit boards, and laminates made with such foil
    Publication number: 20020023844
    Abstract: A one-step, integrated process and apparatus for producing electrolytic copper foil having a dual-layer copper bond-enhancing treatment electrodeposited on the matte side of the foil, which employs two “super anodes” on a rotating drum cathode to deposit the treatment.
    Type: Application
    Filed: June 11, 2001
    Publication date: February 28, 2002
    Applicant: Yates Foil USA, Inc.
    Inventors: Charles B. Yates, George Gaskill, Ajesh Shah, Chinsai T. Cheng, Keith Bodendorf, Adam M. Wolski
  • Copper foil bonding treatment with improved bond strength and resistance to undercutting
    Patent number: 6342308
    Abstract: A treated electrodeposited copper foil having a bond-enhancing copper layer, preferably a plurality of layers, electrodeposited on a bonding side of a base copper foil, a layer of co-deposited copper and arsenic electrodeposited on the bond-enhancing layer, and a zinc or zinc alloy layer electrodeposited on the copper/arsenic layer. A process for making such foil, and a copper-clad laminate wherein such foil is bonded to a polymeric substrate.
    Type: Grant
    Filed: September 29, 1999
    Date of Patent: January 29, 2002
    Assignee: Yates Foil USA, Inc.
    Inventors: Charles B. Yates, George Gaskill, Chinsai T. Cheng, Ajesh Shah
  • COPPER FOIL AND COPPER CLAD LAMINATES FOR FABRICATION OF MULTI-LAYER PRINTED CIRCUIT BOARDS AND PROCESS FOR PRODUCING SAME
    Publication number: 20010051282
    Abstract: Treated copper foil produced by electrodepositing on a matte surface of a base copper foil a “corrective” copper layer having a surface roughness different from the surface roughness of the matte surface of the base foil and which has a peak count greater than the peak count of the matte surface of the base foil. In the electrodeposition there are used a unique electrolyte composition and plating conditions effective to control the micro-throwing process of the plating process so that the surface roughness of the corrective is substantially constant from one batch of base foil to another.
    Type: Application
    Filed: September 13, 1999
    Publication date: December 13, 2001
    Applicant: Yates Foil USA, Inc.
    Inventors: CHARLES B. YATES, GEORGE GASKILL, CHINSAI T. CHENG, AJESH SHAH, ADAM M. WOLSKI, PAUL DUFRESNE
  • Process and apparatus for the manufacture of high peel-strength copper foil useful in the manufacture of printed circuit boards, and laminates made with such foil
    Patent number: 6270648
    Abstract: A one-step, integrated process and apparatus for producing electrolytic copper foil having a dual-layer copper bond-enhancing treatment electrodeposited on the matte side of the foil, which employs two “super anodes” on a rotating drum cathode to deposit the treatment.
    Type: Grant
    Filed: October 22, 1999
    Date of Patent: August 7, 2001
    Assignee: Yates Foil USA, Inc.
    Inventors: Charles B. Yates, George Gaskill, Ajesh Shah, Chinsai T. Cheng, Keith Bodendorf, Adam M. Wolski
  • Process for electrodeposition of barrier layer over copper foil bonding treatment, products thereof and electrolyte useful in such process
    Patent number: 6224991
    Abstract: Treated copper foil for use in the manufacture of copper-clad laminates for printed circuit boards, wherein a continuous, very thin cobalt barrier layer, which is substantially non-ferromagnetic, is electrodeposited on a copper bonding treatment electrodeposited on a bonding side of a base copper foil; and a process and electrolyte for producing such treated foil, wherein the electrolyte contains a low concentration of cobalt and certain addition agents.
    Type: Grant
    Filed: September 13, 1999
    Date of Patent: May 1, 2001
    Assignee: Yates Foil USA, Inc.
    Inventors: Charles B. Yates, George Gaskill, Chinsai T. Cheng, Ajesh Shah, Adam M. Wolski, Paul DuFresne