Abstract: An inspection system for inspecting a semiconductor wafer. The inspection system comprises an illumination setup for supplying broadband illumination. The broadband illumination can be of different contrasts, for example brightfield and darkfield broadband illumination. The inspection system further comprises a first image capture device and a second image capture device, each configured for receiving broadband illumination to capture images of the semiconductor wafer while the semiconductor wafer is in motion. The system comprises a number of tube lenses for enabling collimation of the broadband illumination. The system also comprises a stabilizing mechanism and an objective lens assembly. The system further comprises a thin line illumination emitter and a third image capture device for receiving thin line illumination to thereby capture three-dimensional images of the semiconductor wafer.

Abstract: A 3D object inspection process includes: capturing an object bottom surface 3D profile (a) while an object top surface freely rests on an object seating surface, or (b) without forcibly compressing the top surface of the object against a reference structure distinct from a suction tip; capturing an object top surface 3D profile while (c) the object bottom surface freely rests on the object seating surface, or (d) without forcibly compressing the bottom surface of the object against the reference structure; capturing a plurality of object sidewall images; generating a 3D composite image comprising a 3D digital reconstruction or estimation of the object based upon or using a bottom surface 3D profile image dataset, a top surface 3D profile image dataset, and the sidewall image dataset; and determining a set or array of total object and/or object main body contour values and/or thickness values from the 3D composite image.

Abstract: An inspection system for inspecting a semiconductor wafer. The inspection system comprises an illumination setup for supplying broadband illumination. The broadband illumination can be of different contrasts, for example brightfield and darkfield broadband illumination. The inspection system further comprises a first image capture device and a second image capture device, each configured for receiving broadband illumination to capture images of the semiconductor wafer while the semiconductor wafer is in motion. The system comprises a number of tube lenses for enabling collimation of the broadband illumination. The system also comprises a stabilizing mechanism and an objective lens assembly. The system further comprises a thin line illumination emitter and a third image capture device for receiving thin line illumination to thereby capture three-dimensional images of the semiconductor wafer.

Abstract: An inspection system for inspecting a semiconductor wafer. The inspection system comprises an illumination setup for supplying broadband illumination. The broadband illumination can be of different contrasts, for example brightfield and darkfield broadband illumination. The inspection system further comprises a first image capture device and a second image capture device, each configured for receiving broadband illumination to capture images of the semiconductor wafer while the semiconductor wafer is in motion. The system comprises a number of tube lenses for enabling collimation of the broadband illumination. The system also comprises a stabilizing mechanism and an objective lens assembly. The system further comprises a thin line illumination emitter and a third image capture device for receiving thin line illumination to thereby capture three-dimensional images of the semiconductor wafer.

Abstract: A 3D object inspection process includes: capturing an object bottom surface 3D profile (a) while an object top surface freely rests on an object seating surface, or (b) without forcibly compressing the top surface of the object against a reference structure distinct from a suction tip; capturing an object top surface 3D profile while (c) the object bottom surface freely rests on the object seating surface, or (d) without forcibly compressing the bottom surface of the object against the reference structure; capturing a plurality of object sidewall images; generating a 3D composite image comprising a 3D digital reconstruction or estimation of the object based upon or using a bottom surface 3D profile image dataset, a top surface 3D profile image dataset, and the sidewall image dataset; and determining a set or array of total object and/or object main body contour values and/or thickness values from the 3D composite image.

Abstract: A skeleton wafer inspection system includes an expansion table displaceable relative to a camera configured for capturing segmental images of a skeleton wafer on a film frame. During segmental image capture, illumination is directed to the top and/or bottom of the film frame. Segmental images are digitally stitched together to produce a composite image, which can be processed to identify die presence or absence therein at active area die positions having counterpart die positions in a process wafer map. A composite image of a diced wafer on a film frame can also be generated, and used as a navigation aid or guide during die sort operations, or to verify whether a die sort apparatus has correctly detected a reference die prior to die sort operations. A composite image of a skeleton wafer can similarly be generated for use as a navigation aid or guide for film frame repopulation operations.

Abstract: A method and a system for inspecting a wafer. The system comprises an optical inspection head, a wafer table, a wafer stack, a XY table and vibration isolators. The optical inspection head comprises a number of illuminators, image capture devices, objective lens and other optical components. The system and method enables capture of brightfield images, darkfield images, 3D profile images and review images. Captured images are converted into image signals and transmitted to a programmable controller for processing. Inspection is performed while the wafer is in motion. Captured images are compared with reference images for detecting defects on the wafer. An exemplary reference creation process for creating reference images and an exemplary image inspection process is also provided by the present invention. The reference image creation process is an automated process.

Abstract: A component inspection process includes positioning a component (e.g., a semiconductor component or other object) such that component sidewalls are disposed along an optical path corresponding to sidewall beam splitters configured for receiving sidewall illumination provided by a set of sidewall illuminators, and transmitting this sidewall illumination therethrough, toward and to component sidewalls. Sidewall illumination incident upon component sidewalls is reflected from the component sidewalls back toward the sidewall beam splitters, which reflect or redirect this reflected sidewall illumination along an optical path corresponding to an image capture device for sidewall image capture to enable component sidewall inspection.

Abstract: An optical inspection system in accordance with the disclosure can be configured to simultaneously capture illumination reflected in multiple directions from the surface of a substrate, thereby overcoming inaccurate or incomplete characterization of substrate surface aspects as a result of reflected intensity variations that can arise when illumination is captured only from a single direction. Such a system includes a set of illuminators and an image capture device configured to simultaneously capture at least two beams of illumination that are reflected off the surface. The at least two beams of illumination that are simultaneously captured by the image capture device have different angular separations between their reflected paths of travel. The set of illuminators can include a set of thin line illuminators positioned and configured to supply one or more beams of thin line illumination incident to the surface.

Abstract: A skeleton wafer inspection system includes an expansion table displaceable relative to a camera configured for capturing segmental images of a skeleton wafer on a film frame. During segmental image capture, illumination is directed to the top and/or bottom of the film frame. Segmental images are digitally stitched together to pro duce a composite image, which can be processed to identify die presence or absence therein at active area die positions having counterpart die positions in a process wafer map. A composite image of a diced wafer on a film frame can also be generated, and used as a navigation aid or guide during die sort operations, or to verify whether a die sort apparatus has correctly detected a reference die prior to die sort operations. A composite image of a skeleton wafer can similarly be generated for use as a navigation aid or guide for film frame repopulation operations.

Abstract: An inspection system for inspecting a semiconductor wafer. The inspection system comprises an illumination setup for supplying broadband illumination. The broadband illumination can be of different contrasts, for example brightfield and darkfield broadband illumination. The inspection system further comprises a first image capture device and a second image capture device, each configured for receiving broadband illumination to capture images of the semiconductor wafer while the semiconductor wafer is in motion. The system comprises a number of tube lenses for enabling collimation of the broadband illumination. The system also comprises a stabilizing mechanism and an objective lens assembly. The system further comprises a thin line illumination emitter and a third image capture device for receiving thin line illumination to thereby capture three-dimensional images of the semiconductor wafer.

Abstract: A component inspection process includes positioning a component (e.g., a semiconductor component or other object) such that component sidewalls are disposed along an optical path corresponding to sidewall beam splitters configured for receiving sidewall illumination provided by a set of sidewall illuminators, and transmitting this sidewall illumination therethrough, toward and to component sidewalls. Sidewall illumination incident upon component sidewalls is reflected from the component sidewalls back toward the sidewall beam splitters, which reflect or redirect this reflected sidewall illumination along an optical path corresponding to an image capture device for sidewall image capture to enable component sidewall inspection.

Abstract: A method for inspecting a wafer. The method comprises a training process for creating reference images. The training process comprises capturing a number of images of a first wafer of unknown quality, each of the number of images of the first wafer being captured at a predetermined contrast illumination and each of the number of images of the first wafer comprising a plurality of pixels. The training process also comprises determining a plurality of reference intensities for each of the plurality of pixels of each of the number of images of the first wafer, calculating a plurality of statistical parameters for the plurality of reference intensities of each of the plurality of pixels of each of the number of images of the first wafer, and selecting a plurality of reference images from the plurality of images of the first wafer based on the calculated plurality of statistical parameters.

Abstract: A system for inspecting semiconductor devices is provided. The system includes a region system selecting a plurality of regions from a semiconductor wafer. A golden template system generates a region golden template for each region, such as to allow a die image to be compared to golden templates from a plurality of regions. A group golden template system generates a plurality of group golden templates from the region golden templates, such as to allow the die image to be compared to golden templates from a plurality of group golden templates.

Abstract: An optical inspection system in accordance with the disclosure can be configured to simultaneously capture illumination reflected in multiple directions from the surface of a substrate, thereby overcoming inaccurate or incomplete characterization of substrate surface aspects as a result of reflected intensity variations that can arise when illumination is captured only from a single direction. Such a system includes a set of illuminators and an image capture device configured to simultaneously capture at least two beams of illumination that are reflected off the surface. The at least two beams of illumination that are simultaneously captured by the image capture device have different angular separations between their reflected paths of travel. The set of illuminators can include a set of thin line illuminators positioned and configured to supply one or more beams of thin line illumination incident to the surface.

Abstract: A system for on-the-fly inspection of components is provided. The system includes a prism structure disposed below an inspection item transit path. An image data system is disposed below the prism structure. A lighting assembly provides a first lighting source to illuminate a plurality of sides of an inspection item and a second lighting source to illuminate a bottom of the inspection item.

Abstract: A system for inspecting components is provided. The system includes a prism having a first end, a second end, a first reflecting surface, and a second reflecting surface. The first end of the prism is located in a plane that is parallel to and axially separated from a plane of one or more of a plurality of inspection pieces. An image data system is disposed beyond the second end of the prism and generates image data of one or more of the inspection piece that includes a top surface of at least one of the inspection pieces and at least one side of at least one of the inspection pieces. An inspection piece transportation system, such as a pick and place tool or conveyor, moves a plurality of inspection pieces past the first end of the prism through an inspection area.

Abstract: A method for inspecting a wafer. The method comprises a training process for creating reference images. The training process comprises capturing a number of images of a first wafer of unknown quality, each of the number of images of the first wafer being captured at a predetermined contrast illumination and each of the number of images of the first wafer comprising a plurality of pixels. The training process also comprises determining a plurality of reference intensities for each of the plurality of pixels of each of the number of images of the first wafer, calculating a plurality of statistical parameters for the plurality of reference intensities of each of the plurality of pixels of each of the number of images of the first wafer, and selecting a plurality of reference images from the plurality of images of the first wafer based on the calculated plurality of statistical parameters.

Abstract: An inspection system for inspecting a semiconductor wafer. The inspection system comprises an illumination setup for supplying broadband illumination. The broadband illumination can be of different contrasts, for example brightfield and darkfield broadband illumination. The inspection system further comprises a first image capture device and a second image capture device, each configured for receiving broadband illumination to capture images of the semiconductor wafer while the semiconductor wafer is in motion. The system comprises a number of tube lenses for enabling collimation of the broadband illumination. The system also comprises a stabilizing mechanism and an objective lens assembly. The system further comprises a thin line illumination emitter and a third image capture device for receiving thin line illumination to thereby capture three-dimensional images of the semiconductor wafer.

Abstract: A method and a system for inspecting a wafer. The system comprises an optical inspection head, a wafer table, a wafer stack, a XY table and vibration isolators. The optical inspection head comprises a number of illuminators, image capture devices, objective lens and other optical components. The system and method enables capture of brightfield images, darkfield images, 3D profile images and review images. Captured images are converted into image signals and transmitted to a programmable controller for processing. Inspection is performed while the wafer is in motion. Captured images are compared with reference images for detecting defects on the wafer. An exemplary reference creation process for creating reference images and an exemplary image inspection process is also provided by the present invention. The reference image creation process is an automated process.