Abstract: A monitoring system is configured to monitor an environment within an enclosure of a heating, ventilation, air conditioning, and/or refrigeration (HVAC&R) system. The monitoring system includes a sensor configured to acquire data indicative of an environmental parameter value within the enclosure. The monitoring system also includes a controller configured to receive the data from the sensor, to determine occurrence of a thermal event within the enclosure based on the data, and to instruct a circuit breaker of the HVAC&R system to transition to a fault configuration in response to determining the occurrence of the thermal event.

Abstract: In a method and system for placing an IC (integrated circuit) die onto a package substrate, a first reference is determined after locating a first fiducial on the package substrate, and a second reference is determined after locating a second fiducial on the package substrate. The IC die is placed onto the package substrate to be aligned with respect to the first and second references of the first and second fiducials that are comprised of a plurality of markings such as a plurality of dots.

Abstract: In a method and system for inspecting alignment between an IC (integrated circuit) die and a package substrate, a plurality of fiducials are located on the package substrate for determining a plurality of references. A center point of the package substrate is determined from the plurality of references. In addition, whether a center point of the IC die is aligned to the center point of the package substrate within an acceptable range is determined.