Patents by Inventor Ajit Ravindran

Ajit Ravindran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250204859
    Abstract: Embodiments generally relate to a pressure sensing sheet system including a pressure sensing mat. The pressure sensing mat includes a piezoresistive material sandwiched between an at least one conductor array row and an at least one conductor array column, wherein each intersection of the conductor array row and the conductor array column defines a taxel; at least one sheet-edge row segment coupled to the at least one conductor array row; at least one sheet-edge column segment coupled to the at least one conductor array column; a sheet interface board connected to the at least one sheet-edge row segment and the at least one sheet-edge column segment, and configured to act as a fan-out; and a databox connected to the sheet interface board of the pressure sensing mat via signal wires and configured to measure each taxel of the pressure sensing mat.
    Type: Application
    Filed: March 17, 2023
    Publication date: June 26, 2025
    Inventors: William Sing Ho YANG, Ajit RAVINDRAN, Blake Jordan FULLER, Yi YUAN, Arda YILMAZ
  • Patent number: 11680968
    Abstract: Embodiments generally relate to an addressing circuit for a conductor array comprising intersecting row and column conductors. The addressing circuit comprises a switching circuit configured to selectively address an intersection between a selected row conductor and a selected column conductor for connection to a measuring circuit; and at least one voltage buffer selectively connectable to un-selected column conductors on opposite sides of and adjacent to the selected column conductor. The at least one voltage buffer is configured to equalise voltages between the un-selected column conductors and the selected column conductor.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: June 20, 2023
    Assignee: Lenexa Medical Pty Ltd
    Inventors: Martin Neil Thompson, William Sing Ho Yang, Ajit Ravindran
  • Publication number: 20220214387
    Abstract: Embodiments generally relate to an addressing circuit for a conductor array comprising intersecting row and column conductors. The addressing circuit comprises a switching circuit configured to selectively address an intersection between a selected row conductor and a selected column conductor for connection to a measuring circuit; and at least one voltage buffer selectively connectable to un-selected column conductors on opposite sides of and adjacent to the selected column conductor. The at least one voltage buffer is configured to equalise voltages between the un-selected column conductors and the selected column conductor.
    Type: Application
    Filed: September 11, 2019
    Publication date: July 7, 2022
    Inventors: Martin Neil Thompson, William Sing Ho Yang, Ajit Ravindran