Patents by Inventor AJIT YADAV

AJIT YADAV has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaged intrinsic safe industrial modem
    Patent number: 9948337
    Abstract: A packaged cellular modem system includes a capacitor for receiving power from a DC power source, a DC-to-DC converter coupled to capacitor electrodes, a cellular modem coupled to the converter output and to an antenna, and an IS barrier circuit coupled to a modem output. A microcontroller coupled to a boost regulator has its output coupled to electrodes. A metrology jumper is between the microcontroller and ground. An encapsulation material provides a potted area for the capacitor, converter, modem, IS barrier circuit and microcontroller. A SIM card is coupled to the modem by the IS barrier circuit. LED's are coupled to the microcontroller. The SIM card and LEDs are in a non-potted area. A transparent SIM card access cover over the SIM card and LEDs enables exposing the SIM card.
    Type: Grant
    Filed: March 3, 2016
    Date of Patent: April 17, 2018
    Assignee: Honeywell International Inc.
    Inventors: Ajit Yadav, Murali Thavva. V. V, Murali Krishna Bezawada, John Boettger
  • PACKAGED INTRINSIC SAFE INDUSTRIAL MODEM
    Publication number: 20170257130
    Abstract: A packaged cellular modem system includes a capacitor for receiving power from a DC power source, a DC-to-DC converter coupled to capacitor electrodes, a cellular modem coupled to the converter output and to an antenna, and an IS barrier circuit coupled to a modem output. A microcontroller coupled to a boost regulator has its output coupled to electrodes. A metrology jumper is between the microcontroller and ground. An encapsulation material provides a potted area for the capacitor, converter, modem, IS barrier circuit and microcontroller. A SIM card is coupled to the modem by the IS barrier circuit. LED's are coupled to the microcontroller. The SIM card and LEDs are in a non-potted area. A transparent SIM card access cover over the SIM card and LEDs enables exposing the SIM card.
    Type: Application
    Filed: March 3, 2016
    Publication date: September 7, 2017
    Inventors: AJIT YADAV, MURALI THAVVA. V.V, MURALI KRISHNA BEZAWADA, JOHN BOETTGER