Patents by Inventor Ajmal Ansari
Ajmal Ansari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240092291Abstract: An electrical assembly may include a bus bar assembly, a sensor assembly, including a circuit board connected to the bus bar assembly, and a sensor, a bracket connected to the bus bar assembly, and a cooling member connected to the bracket. A method of assembling an electrical assembly may include connecting a shunt resistor with a bus bar assembly, connecting a circuit board with the bus bar assembly, connecting the bus bar assembly with the bracket, disposing the cooling member on or about the bracket, and/or connecting the cooling member with the bracket.Type: ApplicationFiled: November 28, 2023Publication date: March 21, 2024Inventors: Aric Anglin, Ajmal Ansari, Greg Dickerhoof, Robert M. Schmidt, Rutunj Rai, Hongen Tu
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Patent number: 11858437Abstract: An electrical assembly may include a bus bar assembly, a sensor assembly, including a circuit board connected to the bus bar assembly, and a sensor, a bracket connected to the bus bar assembly, and a cooling member connected to the bracket. A method of assembling an electrical assembly may include connecting a shunt resistor with a bus bar assembly, connecting a circuit board with the bus bar assembly, connecting the bus bar assembly with the bracket, disposing the cooling member on or about the bracket, and/or connecting the cooling member with the bracket.Type: GrantFiled: October 6, 2021Date of Patent: January 2, 2024Assignee: Lear CorporationInventors: Aric Anglin, Ajmal Ansari, Greg Dickerhoof, Robert M. Schmidt, Rutunj Rai, Hongen Tu
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Patent number: 11785740Abstract: An electronic module is provided with a housing with a base and walls extending transversely from the base. The housing comprises an inlet port and an outlet port formed through the walls. A circuit board assembly is supported by the housing and includes electronics that generate heat during operation. A cold plate is mounted to the walls of the housing to define a manifold. The housing and the cold plate are in thermal communication with the circuit board assembly for transferring heat generated by the electronics. A baffle is disposed within the manifold for directing coolant flow. Elastic material is disposed over a distal end of the baffle and adapted to engage a lower surface of the cold plate in an interference fit to block coolant leakage.Type: GrantFiled: May 24, 2021Date of Patent: October 10, 2023Assignee: LEAR CORPORATIONInventors: Parminder Brar, Ajmal Ansari, Jared Pieknik, Michael Scott Duco, Kevin J. Foldvary
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Publication number: 20230118180Abstract: An assembly includes an electrical component; a bus bar assembly connected with the electrical component; and a cooling member connected with the bus bar assembly, the cooling member including: a tubular member; and a cover enclosing portions of the tubular member, the cover comprising thermally conductive and electrically insulating material. The enclosed portions of the tubular member may include a non-circular cross-section.Type: ApplicationFiled: December 21, 2022Publication date: April 20, 2023Inventors: Aric Anglin, Ajmal Ansari, Jesus Carbo
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Publication number: 20220089110Abstract: An electrical assembly may include a bus bar assembly, a sensor assembly, including a circuit board connected to the bus bar assembly, and a sensor, a bracket connected to the bus bar assembly, and a cooling member connected to the bracket. A method of assembling an electrical assembly may include connecting a shunt resistor with a bus bar assembly, connecting a circuit board with the bus bar assembly, connecting the bus bar assembly with the bracket, disposing the cooling member on or about the bracket, and/or connecting the cooling member with the bracket.Type: ApplicationFiled: October 6, 2021Publication date: March 24, 2022Inventors: Aric Anglin, Ajmal Ansari, Greg Dickerhoof, Robert M. Schmidt, Rutunj Rai, Hongen Tu
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Publication number: 20210410326Abstract: An electronic module is provided with a housing with a base and walls extending transversely from the base. The housing comprises an inlet port and an outlet port formed through the walls. A circuit board assembly is supported by the housing and includes electronics that generate heat during operation. A cold plate is mounted to the walls of the housing to define a manifold. The housing and the cold plate are in thermal communication with the circuit board assembly for transferring heat generated by the electronics. A baffle is disposed within the manifold for directing coolant flow. Elastic material is disposed over a distal end of the baffle and adapted to engage a lower surface of the cold plate in an interference fit to block coolant leakage.Type: ApplicationFiled: May 24, 2021Publication date: December 30, 2021Applicant: LEAR CORPORATIONInventors: Parminder BRAR, Ajmal ANSARI, Jared PIEKNIK, Michael Scott DUCO, Kevin J. Foldvary
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Publication number: 20210335535Abstract: In at least one embodiment, a transformer assembly including a bobbin, a first winding and a second winding is provided. The bobbin defines a first chamber, a second chamber, and a gap. The first winding is positioned in the first chamber. The second winding is positioned in the second chamber. The gap separates the first chamber from the second chamber to cause the first winding and the second winding to generate a leakage inductance such that the leakage inductance and a capacitance of a capacitor that is operably coupled to the transformer assembly generate a resonant frequency to enable inductive mode charging with a vehicle pad.Type: ApplicationFiled: April 27, 2020Publication date: October 28, 2021Inventors: Steven CONG, Ajmal ANSARI, Anthony ARMENTO, Shane LUERSMAN
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Patent number: 9076593Abstract: A heat conductor for use with an inverter in an electric or hybrid-electric vehicle, the inverter including a direct current link capacitor having multiple film capacitors configured in a stack to form a substantially polygonal prism. Each film capacitor has orthotropic characteristics. The heat conductor has a first substantially planar member configured to contact a first side of the polygonal prism formed by one of the film capacitors, and a second substantially planar member configured to contact a second side of the polygonal prism opposite the first side of the rectangular prism, the second side of the rectangular prism formed by another one of the film capacitors. The first and second planar member are thermally conductive for dissipating heat generated by the film capacitors, are attached by an interconnect, and have sufficient rigidity to confine expansion of the film capacitors across the thicknesses thereof.Type: GrantFiled: December 29, 2011Date of Patent: July 7, 2015Assignee: Lear CorporationInventors: Nadir Sharaf, Slobodan Pavlovic, Dilip Daftuar, Ajmal Ansari
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Patent number: 9041502Abstract: An electromagnetic device arrangement includes a transformer assembly having a core, windings, and a housing disposed around at least a portion of the core and windings. An enclosure at least partially encloses the transformer assembly. The transformer assembly is mounted to a first portion of the enclosure such that heat is transferred from the transformer assembly to the first portion of the enclosure. A second portion of the enclosure has an extension extending therefrom such that the extension is placed in thermal contact with the transformer assembly to transfer heat from the transformer assembly to the extension.Type: GrantFiled: April 5, 2012Date of Patent: May 26, 2015Assignee: Lear CorporationInventors: Ajmal Ansari, Nadir Sharaf, Slobodan Pavlovic
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Publication number: 20130265129Abstract: An electromagnetic device arrangement includes a transformer assembly having a core, windings, and a housing disposed around at least a portion of the core and windings. An enclosure at least partially encloses the transformer assembly. The transformer assembly is mounted to a first portion of the enclosure such that heat is transferred from the transformer assembly to the first portion of the enclosure. A second portion of the enclosure has an extension extending therefrom such that the extension is placed in thermal contact with the transformer assembly to transfer heat from the transformer assembly to the extension.Type: ApplicationFiled: April 5, 2012Publication date: October 10, 2013Applicant: LEAR CORPORATIONInventors: Ajmal Ansari, Nadir Sharaf, Slobodan Pavlovic
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Publication number: 20130170269Abstract: A heat conductor for use with an inverter in an electric or hybrid-electric vehicle, the inverter including a direct current link capacitor having multiple film capacitors configured in a stack to form a substantially polygonal prism. Each film capacitor has orthotropic characteristics. The heat conductor has a first substantially planar member configured to contact a first side of the polygonal prism formed by one of the film capacitors, and a second substantially planar member configured to contact a second side of the polygonal prism opposite the first side of the rectangular prism, the second side of the rectangular prism formed by another one of the film capacitors. The first and second planar member are thermally conductive for dissipating heat generated by the film capacitors, are attached by an interconnect, and have sufficient rigidity to confine expansion of the film capacitors across the thicknesses thereof.Type: ApplicationFiled: December 29, 2011Publication date: July 4, 2013Applicant: LEAR CORPORATIONInventors: Nadir Sharaf, Slobodan Pavlovic, Dilip Daftuar, Ajmal Ansari