Abstract: A heat dissipation film for a display module, and a preparation method of a display device. The heat dissipation film comprises a composite structure layer and a removable protective film disposed on the composite structure layer. The composite structure layer has a first side surface and a second side surface disposed opposite to each other, and is provided with a preconfigured hole passing through the first side surface and the second side surface. The first side surface of the composite structure layer adheres to a side of the display module facing away from a display side. The protective film is attached to the second side surface of the composite structure layer. The protective film is provided with a shielding region covering the preconfigured hole. The shielding region and the rest of the protective film can all be independently torn off from the composite structure layer.

Abstract: Provided is a display panel. The display panel is divided into a display region and a non-display region disposed on a periphery of the display region. The display panel includes: a plurality of touch units and a plurality of light-emitting devices that are within the display region; and a plurality of touch signal leads and a plurality of data signal leads that are within the non-display region, wherein the touch signal lead is electrically connected to the touch unit, and the data signal lead is electrically connected to the light-emitting device; wherein in the non-display region, a region where at least a portion of the touch signal leads are disposed and a region where the plurality of data signal leads are disposed are respectively on different sides of the display region.

Abstract: A display module includes a display panel and a peripheral region. The peripheral region includes a bendable fan-out region including a panel bonding portion and a driving chip; a flexible circuit board, including a first and a second conductive layers, and a substrate. The first conductive layer includes a first and a second bonding portions, and a connection portion; the second conductive layer is located on a side of the first conductive layer and at least partially overlaps with the first bonding portion; the first and the second conductive layers are connected through a via hole penetrating through the substrate; an end of the flexible circuit board is bonded to the panel bonding portion through the first bonding portion, and the second bonding portion is bonded to a control circuit board; and a conductive protection layer, covering the driving chip and connected to the second conductive layer.

Abstract: Provided is a support member of a flexible display module. The support member includes: a body portion and a plurality of outward protrusion portions. The plurality of outward protrusion portions are at least distributed at two opposite sides of the body portion and protrude outwards relative to the sides of the body portion. A positioning hole is formed in each of the outward protrusion portions.

Abstract: A display panel and a preparation method therefor, and a display device. The display panel comprises an active area and a peripheral area, which is arranged at the periphery of the active area and comprises a bending zone (410), wherein an edge of the peripheral area is provided with a protrusion (500), and the protrusion (500) has an alignment mark (400) for the bending zone (410).

Abstract: A display module and a display device are provided. The display module includes: a display panel including a display area and a non-display area surrounding the display area; an optical adhesive layer (2) located on a light emitting side of the display panel and covering the display area; and a cover plate, located on a side of the optical adhesive layer facing away from the display panel and covering the display panel and the optical adhesive layer. A limiting groove used for preventing an edge of the optical adhesive layer from overflowing is formed on a side of the cover plate facing the optical adhesive layer. A least the edge of the optical adhesive layer is in the limiting groove.

Abstract: A circuit board structure and a display device, the circuit board structure includes a first circuit board, a second circuit board, a filling portion and an electromagnetic shield layer. The second circuit board has a thickness greater than that of the first circuit board. At least one corner portion forms at a joint of the first circuit board and the second circuit board. A connection line forms at a joint of the second circuit board and the first circuit board. The connection line is located at the corner portion. The filling portion fills the corner portion, an extending direction of the filling portion is identical to an extending direction of the corner portion. The extending direction is identical to a direction of the connection line. A thickness of a cross section of the filling portion perpendicular to the extending direction increases as a distance from the second circuit board decreases.

Abstract: A flexible support plate is configured to support a display panel, and is provided with a bendable region. The bendable region has at least one boundary line extending in a first direction, and the boundary line is part of a side of the flexible support plate. A plurality of hollows are arranged at intervals in the bendable region, the plurality of hollows are divided into a plurality of hollow groups arranged in the first direction, and each hollow group includes at least one hollow. For any boundary line, any one of the plurality of hollow groups has one boundary point, the boundary point is disposed on a contour line of a hollow in the hollow group to which the boundary point belongs, and the boundary point has a smallest distance from a corresponding boundary line in the contour line to which the boundary point belongs.

Abstract: Provided is a display panel, including: a substrate, the substrate comprising a display area and a non-display area, the non-display area comprising a bonding area located at a side of the display area, the bonding area comprising a plurality of bonding pads, wherein the display panel further comprises a first insulating protective film layer, a detection pad is provided between at least two of the plurality of bonding pads, and the first insulating protective film layer is located at a side of the detection pad away from the substrate. A display device is further provided.

Abstract: A flexible support plate is configured to support a display panel, and is provided with a bendable region. The bendable region has at least one boundary line extending in a first direction, and the boundary line is part of a side of the flexible support plate. A plurality of hollows are arranged at intervals in the bendable region, the plurality of hollows are divided into a plurality of hollow groups arranged in the first direction, and each hollow group includes at least one hollow. For any boundary line, any one of the plurality of hollow groups has one boundary point, the boundary point is disposed on a contour line of a hollow in the hollow group to which the boundary point belongs, and the boundary point has a smallest distance from a corresponding boundary line in the contour line to which the boundary point belongs.

Abstract: A displaying module includes a transparent cover plate, a display panel and a heat dissipating film layer; the transparent cover plate covers a first surface of the display panel, an area of the display panel is less than an area of the transparent cover plate, and the first surface refers to a surface of the display panel where a light ray exits; and the heat dissipating film layer covers a second surface of the display panel, and at least part of an edge position of the heat dissipating film layer contacts an inner surface of the transparent cover plate, wherein the second surface refers to a surface of the display panel that is opposite to the first surface, the inner surface of the transparent cover plate refers to a surface of the transparent cover plate that contacts the display panel, and the heat dissipating film layer is electrically conductive.

Abstract: A flexible support plate is configured to support a display panel, and is provided with a bendable region. The bendable region has at least one boundary line extending in a first direction, and the boundary line is part of a side of the flexible support plate. A plurality of hollows are arranged at intervals in the bendable region, the plurality of hollows are divided into a plurality of hollow groups arranged in the first direction, and each hollow group includes at least one hollow. For any boundary line, any one of the plurality of hollow groups has one boundary point, the boundary point is disposed on a contour line of a hollow in the hollow group to which the boundary point belongs, and the boundary point has a smallest distance from a corresponding boundary line in the contour line to which the boundary point belongs.

Abstract: A display module includes a display panel, a flexible circuit board, a driving control chip, a touch control chip and a protective structure. The flexible circuit board is bonded to the display panel. The driving control chip is located on the display panel or the flexible circuit board. The touch control chip is located on the flexible circuit board or the display panel. The protective structure covers the driving control chip and/or the touch control chip. And the protective structure includes a first insulating layer, a heat dissipation layer and an electromagnetic shielding layer that are sequentially disposed away from the display panel.

Abstract: A heat dissipation film for a display module, and a preparation method of a display device. The heat dissipation film comprises a composite structure layer and a removable protective film disposed on the composite structure layer. The composite structure layer has a first side surface and a second side surface disposed opposite to each other, and is provided with a preconfigured hole passing through the first side surface and the second side surface. The first side surface of the composite structure layer adheres to a side of the display module facing away from a display side. The protective film is attached to the second side surface of the composite structure layer. The protective film is provided with a shielding region covering the preconfigured hole. The shielding region and the rest of the protective film can all be independently torn off from the composite structure layer.

Abstract: A Chip-On-Film structure, a displaying base plate and a displaying device, wherein the Chip-On-Film structure includes a first substrate; a plurality of driving chips provided on one side of the first substrate, and a plurality of first leads that are connected to the plurality of driving chips; and the plurality of first leads are for binding a displaying base plate, and a quantity of the first leads is greater than or equal to a sum of quantities of channels of the plurality of driving chips.

Abstract: A display module includes a display panel, a flexible circuit board, a driving control chip, a touch control chip and a protective structure. The flexible circuit board is bonded to the display panel. The driving control chip is located on the display panel or the flexible circuit board. The touch control chip is located on the flexible circuit board or the display panel. The protective structure covers the driving control chip and/or the touch control chip. And the protective structure includes a first insulating layer, a heat dissipation layer and an electromagnetic shielding layer that are sequentially disposed away from the display panel.

Abstract: A Chip-On-Film structure, a displaying base plate and a displaying device, wherein the Chip-On-Film structure includes a first substrate; a plurality of driving chips provided on one side of the first substrate, and a plurality of first leads that are connected to the plurality of driving chips; and the plurality of first leads are for binding a displaying base plate, and a quantity of the first leads is greater than or equal to a sum of quantities of channels of the plurality of driving chips.