Patents by Inventor Akarsha Kadadevaramath

Akarsha Kadadevaramath has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240175640
    Abstract: A heat pipe, including: a variable dimension heat pipe exoskeleton formed of a heat-conductive material by blow molding or additive manufacturing, wherein the variable dimension heat pipe exoskeleton including: a first heat pipe exoskeleton portion with a dimension having a first value; and a second heat pipe exoskeleton portion with the dimension having a second value different from the first value. Further, a method of manufacturing a heat pipe, including: providing a heat-conductive material; and performing blow molding or additive manufacturing to form a variable dimension heat pipe exoskeleton of the heat-conductive material, wherein the heat pipe exoskeleton has a first heat pipe exoskeleton portion with a dimension having a first value, and a second heat pipe exoskeleton portion with the dimension having a second value different from the first value.
    Type: Application
    Filed: December 26, 2023
    Publication date: May 30, 2024
    Inventors: Santosh Gangal, Akarsha Kadadevaramath, Raghavendra S. Kanivihalli, Prakash Kurma Raju, Navneet Singh, Sarma Vmk Vedhanabhatla
  • Patent number: 11139553
    Abstract: Technologies for a metal chassis for an electronic device are disclosed. A manufacturer may manufacture a chassis of an electronic device by machining a recess into a chassis preform and perform an anodization of the chassis. The manufacturer may machine the side of the chassis preform opposite the recess to a predefined thickness, and then perform a subsequent anodization. The predefined thickness is selected so that, after the subsequent anodization, there is a single anodized layer between the surface of the recess and the chassis surface on the opposite side. The single anodized layer is non-conductive, allowing electromagnetic signals of an antenna to pass through.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: October 5, 2021
    Assignee: Intel Corporation
    Inventors: Jayprakash Thakur, Prakash Kurma Raju, Prasanna Pichumani, Akarsha Kadadevaramath
  • Publication number: 20190131692
    Abstract: Technologies for a metal chassis for an electronic device are disclosed. A manufacturer may manufacture a chassis of an electronic device by machining a recess into a chassis preform and perform an anodization of the chassis. The manufacturer may machine the side of the chassis preform opposite the recess to a predefined thickness, and then perform a subsequent anodization. The predefined thickness is selected so that, after the subsequent anodization, there is a single anodized layer between the surface of the recess and the chassis surface on the opposite side. The single anodized layer is non-conductive, allowing electromagnetic signals of an antenna to pass through.
    Type: Application
    Filed: December 27, 2018
    Publication date: May 2, 2019
    Inventors: Jayprakash Thakur, Prakash Kurma Raju, Prasanna Pichumani, Akarsha Kadadevaramath