Patents by Inventor Akash Agrawal

Akash Agrawal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12285373
    Abstract: A patient support apparatus and a method of notifying persons within a vicinity of the patient support apparatus are disclosed. The patient support apparatus includes a patient support structure for supporting a patient, an actuator for moving the patient, a notification system, and a controller coupled to the notification system and the actuator. The controller receives a selection of a remote control function via a communication network, generates a notification in response to receiving the selection of the remote control function, and transmits an output signal to the actuator based on the selection of the remote control function. The notification system executes the notification prior to the controller transmitting the output signal to the actuator.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: April 29, 2025
    Assignee: Stryker Corporation
    Inventors: Anuj Sidhu, Alexander Bodurka, Akash Agrawal, Brajesh Kumar, Sachin Pachauri, Chandra Bhanu Vats
  • Patent number: 12278172
    Abstract: In order to relieve the stress on the substrates in a 3D stacked electronic assembly, a substrate frame is divided into a plurality of frame sections that are separated by spaces between the frame sections. These separations allow the substrates to expand/contract in response to temperature variations and other environmental conditions, and generally allow the substrates to move in one or more axial directions. The separations between the substrate portions are design-specific for each substrate design. The placement of IC packages on either side of the substrate is analyzed to identify areas of maximal warpage through physical measurements, physical model simulations, or using a trained neural network. The spaces in the substrate frame are then be placed next to or aligned with the areas of maximal warpage to reduce the stress on the substrate.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: April 15, 2025
    Assignee: Applied Materials, Inc.
    Inventors: Akash Agrawal, Prashanth Ganeshbaabu
  • Publication number: 20240311524
    Abstract: The invention relates to method and system for identifying contact features of Boundary Representation (B-Rep)-based Computer Aided Design (CAD) models. The method includes determining body type associated with body from body types based on information extracted from boundary representation of body; identifying associated body pairs from valid bodies based on proximity between each two of valid bodies and predefined threshold proximity; for each of associated body pairs, identifying face pairs for each body of associated body pairs based on single-body criteria, and for each pair of associated body pairs based on multi-body criteria; and identifying contact features and corresponding contact parameters from each of face pairs based on plurality of user control parameters.
    Type: Application
    Filed: July 25, 2023
    Publication date: September 19, 2024
    Inventors: Budi Bharath Kumar, Hari Krishnan Elumalai, Akash Agrawal, Pankaj Panda
  • Publication number: 20240241997
    Abstract: The invention relates to method and system for classifying Boundary Representation (B-Rep)-based Computer Aided Design (CAD) models. The method includes extracting information corresponding to an input B-Rep-based CAD model; and determining a model type associated with the B-Rep-based CAD model from a set of model types based on the information. The set of model types includes valid model types and invalid model types. When the determined model type is one of the valid model types, the method may further include validating the B-Rep-based CAD model based on a set of user input parameters; upon successful validation, analysing, each of the set of faces of the B-Rep-based CAD model based on a reference face selected from the set of faces using a heuristic model; and labelling the B-Rep-based CAD model as one of a sheet metal body, a non-sheet metal body, or an unclassified body based on the analysis.
    Type: Application
    Filed: July 25, 2023
    Publication date: July 18, 2024
    Inventors: Hari Krishnan Elumalai, Akash Agrawal, Pankaj Panda, Rajesh Chakravarty
  • Publication number: 20230420351
    Abstract: In order to relieve the stress on the substrates in a 3D stacked electronic assembly, a substrate frame may be divided into a plurality of frame sections that are separated by spaces between the frame sections. These separations allow the substrates to expand/contract in response to temperature variations and other environmental conditions, and generally allow the substrates to move in one or more axial directions. The separations between the substrate portions may be design-specific for each substrate design. The placement of IC packages on either side of the substrate may be analyzed to identify areas of maximal warpage through physical measurements, physical model simulations, or using a trained neural network. The spaces in the substrate frame may then be placed next to or aligned with the areas of maximal warpage to reduce the stress on the substrate.
    Type: Application
    Filed: June 28, 2022
    Publication date: December 28, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Akash Agrawal, Prashanth Ganeshbaabu
  • Publication number: 20230297733
    Abstract: The invention relates to method and system for automatically identifying tube elements in a Boundary Representation (B-Rep)-based Computer Aided Design (CAD) model of a tube. The method includes extracting information corresponding to the B-Rep-based CAD model of the tube; validating geometrical features of the B-Rep based CAD model of the tube based on the extracted information; classifying each of a plurality of faces of the tube into one of a set of face types; determining one or more regions on the tube using a set of connected top faces of the tube; generating a plurality of primary tube elements and a set of secondary tube elements based on shapes of the plurality of regions; determining a plurality of element parameters for each of the plurality of tube elements of the tube; and determining a plurality of tube parameters for the tube based on the plurality of element parameters.
    Type: Application
    Filed: May 18, 2022
    Publication date: September 21, 2023
    Inventors: GIRISH RAMESH CHANDANKAR, HARI KRISHNAN ELUMALAI, PANKAJ GUPTA, RAJESH CHAKRAVARTY, AKASH AGRAWAL, PANKAJ PANDA
  • Publication number: 20230221016
    Abstract: The present disclosure relates to a heating, ventilation, and/or air conditioning (HVAC) system having a heat exchanger configured to thermally regulate a supply air flow, where the heat exchanger includes a thermoelectric device, a first plurality of fins coupled to the thermoelectric device, and a second plurality of fins coupled to the thermoelectric device. The first plurality of fins extend into a supply air flow path of the supply air flow to transfer thermal energy between the thermoelectric device and the supply air flow and the second plurality of fins convectively transfer thermal energy between the thermoelectric device and a working fluid exterior the supply air flow path.
    Type: Application
    Filed: January 10, 2023
    Publication date: July 13, 2023
    Inventors: Ankur Mishra, Tuhin Ranjan, Akash Agrawal, Sanjeev Kannan
  • Patent number: 11675611
    Abstract: A system may include multiple computing nodes, each including a hypervisor, a controller virtual machine and multiple virtual machines. The hypervisor may include a host agent configured to start a service and determine whether a performance of the service has met a criteria. If the performance of the service has met the criteria, the hypervisor may further determine whether the service has any pending critical operations, and if no critical operations are pending, stop the service. In some examples, each service may create a process configured to monitor the performance of the service. Examples of the performance of the service may include memory utilization and the service response time.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: June 13, 2023
    Assignee: Nutanix, Inc.
    Inventors: Akash Agrawal, Anupam Chakraborty
  • Publication number: 20220309389
    Abstract: Implementations disclosed herein are directed to systems and methods for evaluating on-device machine learning (ML) model(s) based on performance measure(s) of client device(s) and/or the on-device ML model(s). The client device(s) can include on-device memory that stores the on-device ML model(s) and a plurality of testing instances for the on-device ML model(s). When certain condition(s) are satisfied, the client device(s) can process, using the on-device ML model(s), the plurality of testing instances to generate the performance measure(s). The performance measure(s) can include, for example, latency measure(s), memory consumption measure(s), CPU usage measure(s), ML model measure(s) (e.g., precision and/or recall), and/or other measures. In some implementations, the on-device ML model(s) can be activated (or kept active) for use locally at the client device(s) based on the performance measure(s). In other implementations, the on-device ML model(s) can be sparsified based on the performance measure(s).
    Type: Application
    Filed: March 29, 2021
    Publication date: September 29, 2022
    Inventors: Dragan Zivkovic, Akash Agrawal, Françoise Beaufays, Tamar Lucassen
  • Publication number: 20220308975
    Abstract: Implementations disclosed herein are directed to systems and methods for evaluating new feature(s) for client device(s) based on performance measure(s) of the client device(s) and/or the new feature(s). The new feature(s) can include, for example, machine learning (ML) model(s), non-ML software-enabled functionality, non-ML hardware-enabled functionality, and/or ML or non-ML software application features for a given software application utilized by the client device(s). The client device(s) can generate the performance measure(s) by processing a plurality of testing instances for the new feature(s). The performance measure(s) can include, for example, latency measure(s), memory consumption measure(s), CPU usage measure(s), precision and/or recall measure(s), and/or other measures. In some implementations, the new feature(s) may be activated for use locally at the client device(s) based on the performance measure(s), and optionally at other client device(s) that share the same device characteristics.
    Type: Application
    Filed: April 11, 2022
    Publication date: September 29, 2022
    Inventors: Dragan Zivkovic, Harry Bleyan, Tamar Lucassen, Akash Agrawal
  • Patent number: 10983879
    Abstract: A method of distributed management of recovery of multi-controller NVMe drives includes detecting a path failure of a PCIe path from a first storage node to a first controller on the multi-controller NVMe drive, and initially attempting to correct the path failure using a controller level reset. If the controller level reset is unsuccessful, an alternative path to the controller is sought, and if that is unsuccessful a drive level reset operation is coordinated by all storage nodes with controllers executing on the NVMe drive. To coordinate reset of the NVMe drive, one storage node is elected master. Each node (both slave and master) initiates quiescing of IO operations on its respective controller, and after quiescing has completed, initiates shutdown of its respective controller. Once all controllers are shut down, the master initiates reset of the NVMe drive. Timeouts are used to constrain completion of the quiescing and shutdown operations.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: April 20, 2021
    Assignee: EMC IP Holding Company LLC
    Inventors: Akash Agrawal, Timothy Johnson, Jiahui Wang, Peng Yin, Stephen Richard Ives, Michael Garvey, Christopher Monti
  • Publication number: 20210106478
    Abstract: A patient support apparatus and a method of notifying persons within a vicinity of the patient support apparatus are disclosed. The patient support apparatus includes a patient support structure for supporting a patient, an actuator for moving the patient, a notification system, and a controller coupled to the notification system and the actuator. The controller receives a selection of a remote control function via a communication network, generates a notification in response to receiving the selection of the remote control function, and transmits an output signal to the actuator based on the selection of the remote control function. The notification system executes the notification prior to the controller transmitting the output signal to the actuator.
    Type: Application
    Filed: December 17, 2020
    Publication date: April 15, 2021
    Applicant: Stryker Corporation
    Inventors: Anuj Sidhu, Alexander Bodurka, Akash Agrawal, Brajesh Kumar, Sachin Pachauri, Chandra Bhanu Vats
  • Patent number: 10905611
    Abstract: A patient support apparatus and a method of notifying persons within a vicinity of the patient support apparatus are disclosed. The patient support apparatus includes a patient support structure for supporting a patient, an actuator for moving the patient, a notification system, and a controller coupled to the notification system and the actuator. The controller receives a selection of a remote control function via a communication network, generates a notification in response to receiving the selection of the remote control function, and transmits an output signal to the actuator based on the selection of the remote control function. The notification system executes the notification prior to the controller transmitting the output signal to the actuator.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: February 2, 2021
    Assignee: Stryker Corporation
    Inventors: Anuj Sidhu, Alexander Bodurka, Akash Agrawal, Brajesh Kumar, Sachin Pachauri, Chandra Bhanu Vats
  • Patent number: 10790222
    Abstract: A microelectronic assembly including first and second laminated microelectronic elements is provided. A patterned bonding layer is disposed on a face of each of the first and second laminated microelectronic elements. The patterned bonding layers are mechanically and electrically bonded to form the microelectronic assembly.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: September 29, 2020
    Assignee: Invensas Corporation
    Inventors: Javier A. Delacruz, Belgacem Haba, Wael Zohni, Liang Wang, Akash Agrawal
  • Publication number: 20200133701
    Abstract: A system may include multiple computing nodes, each including a hypervisor, a controller virtual machine and multiple virtual machines. The hypervisor may include a host agent configured to start a service and determine whether a performance of the service has met a criteria. If the performance of the service has met the criteria, the hypervisor may further determine whether the service has any pending critical operations, and if no critical operations are pending, stop the service. In some examples, each service may create a process configured to monitor the performance of the service. Examples of the performance of the service may include memory utilization and the service response time.
    Type: Application
    Filed: October 29, 2018
    Publication date: April 30, 2020
    Applicant: Nutanix, Inc.
    Inventors: Akash Agrawal, Anupam Chakraborty
  • Publication number: 20200056795
    Abstract: The present disclosure relates to a heating, ventilation, and/or air conditioning (HVAC) system having a heat exchanger configured to thermally regulate a supply air flow, where the heat exchanger includes a thermoelectric device, a first plurality of fins coupled to the thermoelectric device, and a second plurality of fins coupled to the thermoelectric device. The first plurality of fins extend into a supply air flow path of the supply air flow to transfer thermal energy between the thermoelectric device and the supply air flow and the second plurality of fins convectively transfer thermal energy between the thermoelectric device and a working fluid exterior the supply air flow path.
    Type: Application
    Filed: August 21, 2018
    Publication date: February 20, 2020
    Inventors: Ankur Mishra, Tuhin Ranjan, Akash Agrawal, Sanjeev Kannan
  • Publication number: 20190221510
    Abstract: A microelectronic assembly including first and second laminated microelectronic elements is provided. A patterned bonding layer is disposed on a face of each of the first and second laminated microelectronic elements. The patterned bonding layers are mechanically and electrically bonded to form the microelectronic assembly.
    Type: Application
    Filed: March 21, 2019
    Publication date: July 18, 2019
    Applicant: Invensas Corporation
    Inventors: Javier A. Delacruz, Belgacem Haba, Wael Zohni, Liang Wang, Akash Agrawal
  • Patent number: 10354945
    Abstract: Multi-surface edge pads for vertical mount packages and methods of making package stacks are provided. Example substrates for vertical surface mount to a motherboard have multi-surface edge pads. The vertical mount substrates may be those of a laminate-based FlipNAND. The multi-surface edge pads have cutouts or recesses that expose more surfaces and more surface area of the substrate for bonding with the motherboard. The cutouts in the edge pads allow more solder to be used between the attachment surface of the substrate and the motherboard. The placement and geometry of the resulting solder joint is stronger and has less internal stress than conventional solder joints for vertical mounting. In an example process, blind holes can be drilled into a thickness of a substrate, and the blind holes plated with metal. The substrate can be cut in half though the plated holes to provide two substrates with plated multi-surface edge pads including the cutouts for mounting to the motherboard.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: July 16, 2019
    Assignee: Invensas Corporation
    Inventors: Rajesh Katkar, Min Tao, Javier A. Delacruz, Hoki Kim, Akash Agrawal
  • Publication number: 20190192368
    Abstract: A patient support apparatus and a method of notifying persons within a vicinity of the patient support apparatus are disclosed. The patient support apparatus includes a patient support structure for supporting a patient, an actuator for moving the patient, a notification system, and a controller coupled to the notification system and the actuator. The controller receives a selection of a remote control function via a communication network, generates a notification in response to receiving the selection of the remote control function, and transmits an output signal to the actuator based on the selection of the remote control function. The notification system executes the notification prior to the controller transmitting the output signal to the actuator.
    Type: Application
    Filed: December 6, 2018
    Publication date: June 27, 2019
    Inventors: Anuj Sidhu, Alexander Bodurka, Akash Agrawal, Brajesh Kumar, Sachin Pachauri, Chandra Bhanu Vats
  • Patent number: 10283445
    Abstract: A microelectronic assembly including first and second laminated microelectronic elements is provided. A patterned bonding layer is disposed on a face of each of the first and second laminated microelectronic elements. The patterned bonding layers are mechanically and electrically bonded to form the microelectronic assembly.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: May 7, 2019
    Assignee: Invensas Corporation
    Inventors: Javier A. Delacruz, Belgacem Haba, Wael Zohni, Liang Wang, Akash Agrawal