Abstract: A system and method for managing network traffic in a distributed environment. the system including: a plurality of logic modules configured to determine policy data related to bandwidth management and at least one split criteria for a basis for shaping network traffic; a control processor associated with each one of the plurality of logic modules, each control processor configured to determine data associated with each of a plurality of traffic flows at the associated logic module and to coordinate traffic actions over the plurality of logic modules; a packet processor associated with each control processor and configured to determine a traffic action based on each traffic flow and received policy data; and at least two shaper objects configured to receive a split of the traffic flows and enforce the determined traffic action on their respective traffic flow.

Abstract: In order to relieve the stress on the substrates in a 3D stacked electronic assembly, a substrate frame may be divided into a plurality of frame sections that are separated by spaces between the frame sections. These separations allow the substrates to expand/contract in response to temperature variations and other environmental conditions, and generally allow the substrates to move in one or more axial directions. The separations between the substrate portions may be design-specific for each substrate design. The placement of IC packages on either side of the substrate may be analyzed to identify areas of maximal warpage through physical measurements, physical model simulations, or using a trained neural network. The spaces in the substrate frame may then be placed next to or aligned with the areas of maximal warpage to reduce the stress on the substrate.

Abstract: The invention relates to method and system for automatically identifying tube elements in a Boundary Representation (B-Rep)-based Computer Aided Design (CAD) model of a tube. The method includes extracting information corresponding to the B-Rep-based CAD model of the tube; validating geometrical features of the B-Rep based CAD model of the tube based on the extracted information; classifying each of a plurality of faces of the tube into one of a set of face types; determining one or more regions on the tube using a set of connected top faces of the tube; generating a plurality of primary tube elements and a set of secondary tube elements based on shapes of the plurality of regions; determining a plurality of element parameters for each of the plurality of tube elements of the tube; and determining a plurality of tube parameters for the tube based on the plurality of element parameters.

Abstract: The present disclosure relates to a heating, ventilation, and/or air conditioning (HVAC) system having a heat exchanger configured to thermally regulate a supply air flow, where the heat exchanger includes a thermoelectric device, a first plurality of fins coupled to the thermoelectric device, and a second plurality of fins coupled to the thermoelectric device. The first plurality of fins extend into a supply air flow path of the supply air flow to transfer thermal energy between the thermoelectric device and the supply air flow and the second plurality of fins convectively transfer thermal energy between the thermoelectric device and a working fluid exterior the supply air flow path.

Abstract: A system may include multiple computing nodes, each including a hypervisor, a controller virtual machine and multiple virtual machines. The hypervisor may include a host agent configured to start a service and determine whether a performance of the service has met a criteria. If the performance of the service has met the criteria, the hypervisor may further determine whether the service has any pending critical operations, and if no critical operations are pending, stop the service. In some examples, each service may create a process configured to monitor the performance of the service. Examples of the performance of the service may include memory utilization and the service response time.

Abstract: Implementations disclosed herein are directed to systems and methods for evaluating new feature(s) for client device(s) based on performance measure(s) of the client device(s) and/or the new feature(s). The new feature(s) can include, for example, machine learning (ML) model(s), non-ML software-enabled functionality, non-ML hardware-enabled functionality, and/or ML or non-ML software application features for a given software application utilized by the client device(s). The client device(s) can generate the performance measure(s) by processing a plurality of testing instances for the new feature(s). The performance measure(s) can include, for example, latency measure(s), memory consumption measure(s), CPU usage measure(s), precision and/or recall measure(s), and/or other measures. In some implementations, the new feature(s) may be activated for use locally at the client device(s) based on the performance measure(s), and optionally at other client device(s) that share the same device characteristics.

Abstract: Implementations disclosed herein are directed to systems and methods for evaluating on-device machine learning (ML) model(s) based on performance measure(s) of client device(s) and/or the on-device ML model(s). The client device(s) can include on-device memory that stores the on-device ML model(s) and a plurality of testing instances for the on-device ML model(s). When certain condition(s) are satisfied, the client device(s) can process, using the on-device ML model(s), the plurality of testing instances to generate the performance measure(s). The performance measure(s) can include, for example, latency measure(s), memory consumption measure(s), CPU usage measure(s), ML model measure(s) (e.g., precision and/or recall), and/or other measures. In some implementations, the on-device ML model(s) can be activated (or kept active) for use locally at the client device(s) based on the performance measure(s). In other implementations, the on-device ML model(s) can be sparsified based on the performance measure(s).

Abstract: A method of distributed management of recovery of multi-controller NVMe drives includes detecting a path failure of a PCIe path from a first storage node to a first controller on the multi-controller NVMe drive, and initially attempting to correct the path failure using a controller level reset. If the controller level reset is unsuccessful, an alternative path to the controller is sought, and if that is unsuccessful a drive level reset operation is coordinated by all storage nodes with controllers executing on the NVMe drive. To coordinate reset of the NVMe drive, one storage node is elected master. Each node (both slave and master) initiates quiescing of IO operations on its respective controller, and after quiescing has completed, initiates shutdown of its respective controller. Once all controllers are shut down, the master initiates reset of the NVMe drive. Timeouts are used to constrain completion of the quiescing and shutdown operations.

Abstract: A patient support apparatus and a method of notifying persons within a vicinity of the patient support apparatus are disclosed. The patient support apparatus includes a patient support structure for supporting a patient, an actuator for moving the patient, a notification system, and a controller coupled to the notification system and the actuator. The controller receives a selection of a remote control function via a communication network, generates a notification in response to receiving the selection of the remote control function, and transmits an output signal to the actuator based on the selection of the remote control function. The notification system executes the notification prior to the controller transmitting the output signal to the actuator.

Abstract: A patient support apparatus and a method of notifying persons within a vicinity of the patient support apparatus are disclosed. The patient support apparatus includes a patient support structure for supporting a patient, an actuator for moving the patient, a notification system, and a controller coupled to the notification system and the actuator. The controller receives a selection of a remote control function via a communication network, generates a notification in response to receiving the selection of the remote control function, and transmits an output signal to the actuator based on the selection of the remote control function. The notification system executes the notification prior to the controller transmitting the output signal to the actuator.

Abstract: A microelectronic assembly including first and second laminated microelectronic elements is provided. A patterned bonding layer is disposed on a face of each of the first and second laminated microelectronic elements. The patterned bonding layers are mechanically and electrically bonded to form the microelectronic assembly.

Abstract: A system may include multiple computing nodes, each including a hypervisor, a controller virtual machine and multiple virtual machines. The hypervisor may include a host agent configured to start a service and determine whether a performance of the service has met a criteria. If the performance of the service has met the criteria, the hypervisor may further determine whether the service has any pending critical operations, and if no critical operations are pending, stop the service. In some examples, each service may create a process configured to monitor the performance of the service. Examples of the performance of the service may include memory utilization and the service response time.

Abstract: The present disclosure relates to a heating, ventilation, and/or air conditioning (HVAC) system having a heat exchanger configured to thermally regulate a supply air flow, where the heat exchanger includes a thermoelectric device, a first plurality of fins coupled to the thermoelectric device, and a second plurality of fins coupled to the thermoelectric device. The first plurality of fins extend into a supply air flow path of the supply air flow to transfer thermal energy between the thermoelectric device and the supply air flow and the second plurality of fins convectively transfer thermal energy between the thermoelectric device and a working fluid exterior the supply air flow path.

Abstract: A microelectronic assembly including first and second laminated microelectronic elements is provided. A patterned bonding layer is disposed on a face of each of the first and second laminated microelectronic elements. The patterned bonding layers are mechanically and electrically bonded to form the microelectronic assembly.

Abstract: Multi-surface edge pads for vertical mount packages and methods of making package stacks are provided. Example substrates for vertical surface mount to a motherboard have multi-surface edge pads. The vertical mount substrates may be those of a laminate-based FlipNAND. The multi-surface edge pads have cutouts or recesses that expose more surfaces and more surface area of the substrate for bonding with the motherboard. The cutouts in the edge pads allow more solder to be used between the attachment surface of the substrate and the motherboard. The placement and geometry of the resulting solder joint is stronger and has less internal stress than conventional solder joints for vertical mounting. In an example process, blind holes can be drilled into a thickness of a substrate, and the blind holes plated with metal. The substrate can be cut in half though the plated holes to provide two substrates with plated multi-surface edge pads including the cutouts for mounting to the motherboard.

Abstract: A patient support apparatus and a method of notifying persons within a vicinity of the patient support apparatus are disclosed. The patient support apparatus includes a patient support structure for supporting a patient, an actuator for moving the patient, a notification system, and a controller coupled to the notification system and the actuator. The controller receives a selection of a remote control function via a communication network, generates a notification in response to receiving the selection of the remote control function, and transmits an output signal to the actuator based on the selection of the remote control function. The notification system executes the notification prior to the controller transmitting the output signal to the actuator.

Abstract: A microelectronic assembly including first and second laminated microelectronic elements is provided. A patterned bonding layer is disposed on a face of each of the first and second laminated microelectronic elements. The patterned bonding layers are mechanically and electrically bonded to form the microelectronic assembly.

Abstract: An apparatus relates generally to a microelectronic package. In such an apparatus, a microelectronic die has a first surface, a second surface opposite the first surface, and a sidewall surface between the first and second surfaces. A plurality of wire bond wires with proximal ends thereof are coupled to either the first surface or the second surface of the microelectronic die with distal ends of the plurality of wire bond wires extending away from either the first surface or the second surface, respectively, of the microelectronic die. A portion of the plurality of wire bond wires extends outside a perimeter of the microelectronic die into a fan-out (“FO”) region. A molding material covers the first surface, the sidewall surface, and portions of the plurality of the wire bond wires from the first surface of the microelectronic die to an outer surface of the molding material.

Abstract: A microelectronic assembly including first and second laminated microelectronic elements is provided. A patterned bonding layer is disposed on a face of each of the first and second laminated microelectronic elements. The patterned bonding layers are mechanically and electrically bonded to form the microelectronic assembly.

Abstract: Multi-surface edge pads for vertical mount packages and methods of making package stacks are provided. Example substrates for vertical surface mount to a motherboard have multi-surface edge pads. The vertical mount substrates may be those of a laminate-based FlipNAND. The multi-surface edge pads have cutouts or recesses that expose more surfaces and more surface area of the substrate for bonding with the motherboard. The cutouts in the edge pads allow more solder to be used between the attachment surface of the substrate and the motherboard. The placement and geometry of the resulting solder joint is stronger and has less internal stress than conventional solder joints for vertical mounting. In an example process, blind holes can be drilled into a thickness of a substrate, and the blind holes plated with metal. The substrate can be cut in half though the plated holes to provide two substrates with plated multi-surface edge pads including the cutouts for mounting to the motherboard.