Patents by Inventor Akemi Kinoshita

Akemi Kinoshita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4650691
    Abstract: An electroless copper plating bath is prepared by adding both a metal-cyano-complex used as a stabilizer and an agent for complexing the metal of the metal-cyano-complex to an electroless copper plating bath containing cupric ion, an agent for complexing the cupric ion and a reducing agent, and an article to be plated is immersed in the bath.
    Type: Grant
    Filed: September 24, 1984
    Date of Patent: March 17, 1987
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Akemi Kinoshita, Ken Araki, Hidemi Nawafune, Shozo Mizumoto
  • Patent number: 4541902
    Abstract: An analytical method for determining by potentiometric titration formaldehyde in an electroless copper plating bath, which comprises using a hydroxylamine salt such as hydroxylamine hydrochloride as the titrant and using a silver electrode as the indicator electrode. This method can determine free formaldehyde in low concentration which takes part in the plating reaction.
    Type: Grant
    Filed: November 7, 1984
    Date of Patent: September 17, 1985
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Akemi Kinoshita, Ken Araki, Hidemi Nawafune, Shozo Mizumoto
  • Patent number: D541681
    Type: Grant
    Filed: June 14, 2005
    Date of Patent: May 1, 2007
    Assignees: Sanyo Electric Co., Ltd., Tottori Sanyo Electric Co., Ltd.
    Inventors: Hajime Sekino, Yukio Uno, Takuya Yamano, Naoko Iguchi, Akemi Kinoshita, Satomi Yamada