Abstract: A semiconductor wafer surface protection sheet which can prevent breakage of a semiconductor wafer even when a circuit-formed surface of the semiconductor wafer has a significant unevenness, and a method for protecting the semiconductor wafer by using such protection sheet. The semiconductor wafer surface protection sheet includes at least one resin layer (A) satisfying a relationship of G? (60)/G? (25)<0.1, where G? (25) is a storage elastic modulus at 25° C., and G? (60) is a storage elastic modulus at 60° C. The semiconductor wafer protecting method using such sheet is also provided.

Abstract: There is provided a transparent conductive film comprising: a substrate(A), and a transparent conductive layer(B) formed on one main surface of the substrate(A), wherein the layer(B) mainly comprises indium, tin and oxygen atoms, and a resistance variation rate of the layer(B) is 5% or less after 60% to 70% of the surface area of the layer(B) is covered with a 28 wt % aqueous ammonia solution for five hours.

Abstract: A transparent heater panel having a transparent substrate, a transparent conductive layer formed on the transparent substrate, electrodes formed on the transparent conductive layer and a transparent protective layer formed on the transparent conductive layer except portions reserved for the electrodes with the end faces of the transparent conductive layer corrosion treated with a transparent protective plastic member or an anticorrosive; and a process for producing the same. The heater panel has improved durability against pollutants, environmental durability, reliability and light transmission.