Patents by Inventor Akemi Nozaki

Akemi Nozaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame, method for manufacturing the same and semiconductor device
    Patent number: 8304872
    Abstract: A lead frame includes a lead frame body 21 having a die pad 24 to which a semiconductor chip 12 is bonded and a plurality of leads 25 arranged around the die pad 24 and made of Cu or an alloy containing Cu, and a metallic film formed on the lead frame body 21 and to connected to a metallic wire 15 connected to the electrode pad 36 of the semiconductor chip 12. The metallic film is an Ag-plated film 22 with nanoparticles 34 arranged in gaps 33 among Ag crystal grains 31.
    Type: Grant
    Filed: November 25, 2009
    Date of Patent: November 6, 2012
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Kazumitsu Seki, Muneaki Kure, Akemi Nozaki
  • LEAD FRAME, METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE
    Publication number: 20100127369
    Abstract: A lead frame includes a lead frame body 21 having a die pad 24 to which a semiconductor chip 12 is bonded and a plurality of leads 25 arranged around the die pad 24 and made of Cu or an alloy containing Cu, and a metallic film formed on the lead frame body 21 and to connected to a metallic wire 15 connected to the electrode pad 36 of the semiconductor chip 12. The metallic film is an Ag-plated film 22 with nanoparticles 34 arranged in gaps 33 among Ag crystal grains 31.
    Type: Application
    Filed: November 25, 2009
    Publication date: May 27, 2010
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Kazumitsu Seki, Muneaki Kure, Akemi Nozaki