Patents by Inventor Akhmadi Wardoyo

Akhmadi Wardoyo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding structure and bonding method for cemented carbide element and diamond element, cutting tip and cutting element for drilling tool, and drilling tool
    Patent number: 8147573
    Abstract: A cutting tip for a drilling tool includes a cemented carbide cutting base, a diamond element supported by the cutting base, and a bonding layer formed between the cutting base and the diamond element in order to bond them. The bonding layer includes diffusion layers and in which one or two or more metals selected from a group consisting of Fe, Ni, Co, Ti, Zr, W, V, Nb, Ta, Cr, Mo, and Hf diffuses into at least one of the diamond or the cement carbide.
    Type: Grant
    Filed: October 7, 2009
    Date of Patent: April 3, 2012
    Assignee: Mitsubishi Materials Corporation
    Inventors: Kazuo Yamamoto, Tadakazu Ohashi, Akhmadi Wardoyo
  • Bonding structure and bonding method for cemented carbide element and diamond element, cutting tip and cutting element for drilling tool, and drilling tool
    Patent number: 7621974
    Abstract: A cutting tip for a drilling tool includes a cemented carbide cutting base, a diamond element supported by the cutting base, and a bonding layer formed between the cutting base and the diamond element in order to bond them. The bonding layer includes diffusion layers and in which one or two or more metals selected from a group consisting of Fe, Ni, Co, Ti, Zr, W, V, Nb, Ta, Cr, Mo, and Hf diffuses into at least one of the diamond or the cement carbide.
    Type: Grant
    Filed: March 27, 2007
    Date of Patent: November 24, 2009
    Assignee: Mitsubishi Materials Corporation
    Inventors: Kazuo Yamamoto, Tadakazu Ohashi, Akhmadi Wardoyo
  • BONDING STRUCTURE AND BONDING METHOD FOR CEMENTED CARBIDE ELEMENT AND DIAMOND ELEMENT, CUTTING TIP AND CUTTING ELEMENT FOR DRILLING TOOL, AND DRILLING TOOL
    Publication number: 20070187154
    Abstract: A cutting tip for a drilling tool includes a cemented carbide cutting base 11, a diamond element 12 supported by the cutting base 11, and a bonding layer formed between the cutting base 11 and the diamond element 12 in order to bond them. The bonding layer 13 includes diffusion layers S1 and S2 in which one or two or more metals selected from a group consisting of Fe, Ni, Co, Ti, Zr, W, V, Nb, Ta, Cr, Mo, and Hf diffuses into at least one of the cemented carbide or the diamond.
    Type: Application
    Filed: March 27, 2007
    Publication date: August 16, 2007
    Applicant: Mitsubishi Materials Corporation
    Inventors: Kazuo Yamamoto, Tadakazu Ohashi, Akhmadi Wardoyo
  • Bonding structure and bonding method for cemented carbide element and diamond element, cutting tip and cutting element for drilling tool, and drilling tool
    Publication number: 20040094333
    Abstract: A cutting tip for a drilling tool includes a cemented carbide cutting base 11, a diamond element 12 supported by the cutting base 11, and a bonding layer formed between the cutting base 11 and the diamond element 12 in order to bond them. The bonding layer 13 includes diffusion layers S1 and S2 in which one or two or more metals selected from a group consisting of Fe, Ni, Co, Ti, Zr, W, V, Nb, Ta, Cr, Mo, and Hf diffuses into at least one of the cemented carbide or the diamond.
    Type: Application
    Filed: July 25, 2003
    Publication date: May 20, 2004
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kazuo Yamamoto, Tadakazu Ohashi, Akhmadi Wardoyo