Abstract: An optical semiconductor device can have a first lead for an optical semiconductor chip to be mounted on and a second lead for joining to a wire extending from the optical semiconductor chip. The device can be configured to be capable of reducing the possibility of a break of the wire even under a thermal shock and the like. The optical semiconductor device can include a first lead for an optical semiconductor chip to be mounted on, a second lead for joining to a wire (for example, gold wire) extending from the optical semiconductor chip mounted on the first lead; a holder part for supporting the first lead and the second lead at two locations each; a lens part; and a light-transmitting sealing part. The second lead can be separated into two lead pieces with a predetermined gap (?0) therebetween as seen in a plan view, or with certain bend configurations as shown in side views, within the inside space of the holder part by which the second lead is supported at two locations.

Abstract: A reliable optical semiconductor device can include an optical semiconductor chip sealed in a surrounding soft resin and in a hard resin that is harder than the soft resin. The hard resin can include an aperture that is configured to relieve a state of hermetic sealing for the soft resin (allows the soft resin to expand during volume change due to temperature fluctuations, etc.) and can be formed in a direction that imposes substantially no optical influence on a function of the optical semiconductor chip. The soft resin and the hard resin can be employed for double sealing to form the highly reliable optical semiconductor device without requiring additional space. This is effective to solve a problem caused in a conventional optical semiconductor device associated with double sealing by soft and hard resins, which requires a space between both resins and results in deteriorated performance, for example, a reduced amount of light.

Abstract: An optical semiconductor device can have a first lead for an optical semiconductor chip to be mounted on and a second lead for joining to a wire extending from the optical semiconductor chip. The device can be configured to be capable of reducing the possibility of a break of the wire even under a thermal shock and the like. The optical semiconductor device can include a first lead for an optical semiconductor chip to be mounted on, a second lead for joining to a wire (for example, gold wire) extending from the optical semiconductor chip mounted on the first lead; a holder part for supporting the first lead and the second lead at two locations each; a lens part; and a light-transmitting sealing part. The second lead can be separated into two lead pieces with a predetermined gap (?0) therebetween as seen in a plan view, or with certain bend configurations as shown in side views, within the inside space of the holder part by which the second lead is supported at two locations.

Abstract: The present invention is directed to a highly reliable optical semiconductor device (1), which comprises an optical semiconductor chip (2) sealed in a surrounding soft resin (3) and in a hard resin (4) harder than the soft resin. The hard resin (4) has an aperture (7b) configured to relieve a state of hermetic sealing for the soft resin (3) and formed in a direction that imposes no optical influence on a function of the optical semiconductor chip (2). The soft resin (3) and the hard resin (4) are employed for double sealing to form the highly reliable optical semiconductor device (1) without providing any space. This is effective to solve a problem caused in a conventional optical semiconductor device associated with double sealing by soft and hard resins to increase reliability, which requires a space between both resins and results in deteriorated performance, for example, a reduced amount of light.

Abstract: A reliable optical semiconductor device can include an optical semiconductor chip sealed in a surrounding soft resin and in a hard resin that is harder than the soft resin. The hard resin can include an aperture that is configured to relieve a state of hermetic sealing for the soft resin (allows the soft resin to expand during volume change due to temperature fluctuations, etc.) and can be formed in a direction that imposes substantially no optical influence on a function of the optical semiconductor chip. The soft resin and the hard resin can be employed for double sealing to form the highly reliable optical semiconductor device without requiring additional space. This is effective to solve a problem caused in a conventional optical semiconductor device associated with double sealing by soft and hard resins, which requires a space between both resins and results in deteriorated performance, for example, a reduced amount of light.

Abstract: The present invention is directed to a highly reliable optical semiconductor device (1), which comprises an optical semiconductor chip (2) sealed in a surrounding soft resin (3) and in a hard resin (4) harder than the soft resin. The hard resin (4) has an aperture (7b) configured to relieve a state of hermetic sealing for the soft resin (3) and formed in a direction that imposes no optical influence on a function of the optical semiconductor chip (2). The soft resin (3) and the hard resin (4) are employed for double sealing to form the highly reliable optical semiconductor device (1) without providing any space. This is effective to solve a problem caused in a conventional optical semiconductor device associated with double sealing by soft and hard resins to increase reliability, which requires a space between both resins and results in deteriorated performance, for example, a reduced amount of light.