Abstract: A grounding strap for a process chamber includes a core layer. The grounding strap further includes an outer layer. The outer layer includes at least 99% aluminum.

Abstract: A cylindrical target assembly for use in a physical vapor deposition (PVD) processing chamber for magnetically enhanced sputtering applications. In embodiments disclosed herein, a cylindrical target, disposed around a rotatable backing tube, has one or more contoured ends that conform to a magnetic sputtering line located outside of a uniform magnetic field. The contoured ends prevent or substantially reduce the accumulation of redeposition material at either end of the cylindrical target assembly desirably reducing particle contamination in the process chamber and on the surfaces of substrates processed therein.

Abstract: A rotatable sputter target configured for rotation around an axis defining an axial direction is described.

Abstract: The present invention generally relates to a sputtering target comprised of zinc and a dopant. Zinc is utilized for metal oxide semiconductor materials, such as IGZO, zinc oxide and zinc oxynitride. The zinc may be delivered by sputtering a zinc target in a desired atmosphere. If a pure zinc sputtering target is used, a stable film cannot be produced unless mobility is sacrificed to below 10 cm2/V-s. By adding a dopant, such as gallium, not only can a stable film be deposited, but the film will have a mobility of greater than 30 cm2/V-s. The dopant can be incorporated directly into the zinc or as a separate sputtering target directly adjacent the zinc sputtering target.

Abstract: Embodiments of the present invention generally comprise a method and apparatus for preparing and bonding a cylindrical sputtering target tube to a backing tube to form a rotary target assembly. In one embodiment, a cylindrical target assembly includes bonding material that has a cylindrical surface and is substantially concentric to the backing tube. In one embodiment, a method for forming a cylindrical target assembly includes filling a gap defined between sputtering target tubes with a spacer. The method also includes removing the spacer after the sputtering target tubes are bonded to a backing tube. In one embodiment, an apparatus for fabricating a cylindrical target assembly comprises of a support tube, two end fittings, and a plurality of clamp elements operable to clamp the support tube between the two end fittings.