Patents by Inventor Aki Koukami
Aki Koukami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11798863Abstract: The problem to be solved by the invention is to provide a laminate capable of effectively enhancing thermal conductivity and adhesiveness, in spite of the relatively large thickness of a patterned metal layer. The laminate (1) according to the present invention includes a metal substrate (4), an insulating layer (2) laminated on one surface of the metal substrate (4), and a patterned metal layer (3) laminated on the surface of the insulating layer (2) on the side opposite to the metal substrate (4), the metal layer (3) is 300 ?m or more in thickness, and the insulating layer (2) includes boron nitride (12) and an inorganic filler (13) other than boron nitride.Type: GrantFiled: December 7, 2018Date of Patent: October 24, 2023Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Kouji Ashiba, Keigo Oowashi, Aki Koukami, Rui Zhang
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Publication number: 20200388551Abstract: The problem to be solved by the invention is to provide a laminate capable of effectively enhancing thermal conductivity and adhesiveness, in spite of the relatively large thickness of a patterned metal layer. The laminate (1) according to the present invention includes a metal substrate (4), an insulating layer (2) laminated on one surface of the metal substrate (4), and a patterned metal layer (3) laminated on the surface of the insulating layer (2) on the side opposite to the metal substrate (4), the metal layer (3) is 300 ?m or more in thickness, and the insulating layer (2) includes boron nitride (12) and an inorganic filler (13) other than boron nitride.Type: ApplicationFiled: December 7, 2018Publication date: December 10, 2020Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Kouji ASHIBA, Keigo OOWASHI, Aki KOUKAMI, Rui ZHANG
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Patent number: 10356946Abstract: The present invention provides a heat dissipation structure that does not cause problems such as contact failures in electronic components and that is applicable to electronic components with high heat densities. The present invention also provides a method for easily repairing an electronic device. The heat dissipation structure is obtained by filling and curing a thermally conductive curable resin composition in an electromagnetic shielding case on a substrate on which an electronic component with a heat density of 0.2 W/cm2 to 500 W/cm2 is mounted, the thermally conductive curable resin composition containing a curable liquid resin (I) and a thermally conductive filler (II), having a viscosity at 23° C. of 30 Pa·s to 3000 Pa·s and a thermal conductivity of 0.5 W/(m·K) or more, and being curable by moisture or heat.Type: GrantFiled: June 6, 2013Date of Patent: July 16, 2019Assignee: Kaneka CorporationInventors: Keisuke Oguma, Aki Koukami, Kazuo Hagiwara
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Patent number: 9826623Abstract: A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.Type: GrantFiled: December 12, 2013Date of Patent: November 21, 2017Assignee: KANEKA CORPORATIONInventors: Aki Koukami, Kazuo Hagiwara, Keisuke Oguma, Kazuhide Fujimoto
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Publication number: 20170090532Abstract: The electronic terminal equipment comprising an electronic substrate on which a heat-generating electronic component is mounted and an electromagnetic shield member attached in proximity to the heat-generating electronic component, the electronic substrate being filled with a cured product of a thermally-conductive curable liquid resin between the electromagnetic shield member and the electronic substrate, and a thermally-conductive film being disposed in contact with an upper surface of the electromagnetic shield member or facing the upper surface thereof so as to diffuse heat that came up through the cured thermally-conductive curable liquid resin.Type: ApplicationFiled: March 6, 2015Publication date: March 30, 2017Applicant: Kaneka CorporationInventors: Aki Koukami, Koichi Nishiura, Takeshi Nakagaki
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Publication number: 20160157334Abstract: A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.Type: ApplicationFiled: December 12, 2013Publication date: June 2, 2016Inventors: Aki KOUKAMI, Kazuo HAGIWARA, Keisuke OGUMA, Kazuhide FUJIMOTO
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Publication number: 20150351217Abstract: A heat dissipation structure including: (A) a printed circuit board; (B) a heat-generating element; (C) an electromagnetic shielding case; (D) a rubbery, thermally conductive resin layer with a tensile elastic modulus of 50 MPa or lower and a thermal conductivity of 0.5 W/mK or higher; and (E) a thermally non-conductive layer with a thermal conductivity of lower than 0.5 W/mK, the heat-generating element (B) being placed on the printed circuit board (A), the heat-generating element (B) and the thermally conductive resin layer (D) being in contact with each other, the thermally non-conductive layer (E) being provided between the heat-generating element (B) and the electromagnetic shielding case (C).Type: ApplicationFiled: November 20, 2013Publication date: December 3, 2015Inventors: Aki KOUKAMI, Kazuo HAGIWARA, Keisuke OGUMA
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Publication number: 20150163958Abstract: The present invention provides a heat dissipation structure that does not cause problems such as contact failures in electronic components and that is applicable to electronic components with high heat densities. The present invention also provides a method for easily repairing an electronic device. The heat dissipation structure is obtained by filling and curing a thermally conductive curable resin composition in an electromagnetic shielding case on a substrate on which an electronic component with a heat density of 0.2 W/cm2 to 500 W/cm2 is mounted, the thermally conductive curable resin composition containing a curable liquid resin (I) and a thermally conductive filler (II), having a viscosity at 23° C. of 30 Pa·s to 3000 Pa·s and a thermal conductivity of 0.5 W/(m·K) or more, and being curable by moisture or heat.Type: ApplicationFiled: June 6, 2013Publication date: June 11, 2015Inventors: Keisuke Oguma, Aki Koukami, Kazuo Hagiwara