Patents by Inventor Aki KOUMA

Aki KOUMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230056185
    Abstract: A thermally conductive sheet has a thermally conductive resin composition layer, wherein the thermally conductive resin composition layer is made of a thermally conductive resin composition (1) including an inorganic filler and a binder resin (3). The inorganic filler includes a boron nitride particle (2), the content of the inorganic filler in the thermally conductive resin composition layer is 65% by volume or more, and the boron nitride particle (2) has an average aspect ratio of 7 or less, which is calculated from a major axis and a minor axis of a primary particle measured by a specific method. The thermally conductive resin composition layer has a thickness of 200 ?m or less.
    Type: Application
    Filed: January 19, 2021
    Publication date: February 23, 2023
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Shohei MIZUNO, Aki KOUMA, Takashi SHINJOU, Kaoru SHIBUTA
  • Patent number: 11548264
    Abstract: An electrical insulation sheet comprising a resin composition layer, wherein one surface side has a higher relative permittivity at a frequency of 1 MHz than the relative permittivity of an other surface side, and a circuit pattern is formed on the one surface side, a laminated body comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein a circuit pattern is formed on the metal plate, and a substrate comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein the metal plate has a circuit pattern.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: January 10, 2023
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Rui Zhang, Keigo Oowashi, Kouji Ashiba, Aki Kouma, Shohei Mizuno
  • Publication number: 20210008839
    Abstract: An electrical insulation sheet comprising a resin composition layer, wherein one surface side has a higher relative permittivity at a frequency of 1 MHz than the relative permittivity of an other surface side, and a circuit pattern is formed on the one surface side, a laminated body comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein a circuit pattern is formed on the metal plate, and a substrate comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein the metal plate has a circuit pattern.
    Type: Application
    Filed: April 17, 2019
    Publication date: January 14, 2021
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Rui ZHANG, Keigo OOWASHI, Kouji ASHIBA, Aki KOUMA, Shohei MIZUNO