Patents by Inventor Aki NAGAI

Aki NAGAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240017532
    Abstract: A packaging material film according to the present disclosure includes a first resin layer that contains a polyolefin resin and a porous filler. A ratio Y/X of an average particle size Y ?m of the porous filler to a thickness X ?m of the first resin layer is 0.02 to 3.5, and a content percentage of the porous filler in the first resin layer is 0.5 to 30 mass %. A packaging material according to the present disclosure includes a substrate and a packaging material film disposed on the substrate. In the packaging material, the packaging material film is formed of the above packaging material film, and a surface of the first resin layer of the packaging material film on a side opposite from the substrate is exposed.
    Type: Application
    Filed: November 18, 2021
    Publication date: January 18, 2024
    Applicant: TOPPAN INC.
    Inventors: Ryo TANAKA, Aki NAGAI, Hiroyuki WAKABAYASHI
  • Publication number: 20220411153
    Abstract: A method for manufacturing a packaging body according to the present disclosure includes the steps of: (A) preparing a packaging material that includes an innermost layer containing a resin composition containing a polypropylene resin and a filler dispersed in the resin composition, a ratio Y/X of an average particle diameter Y ?m of the filler to a thickness X ?m of the innermost layer being 0.02 to 3.5; (B) producing a packaging body that has the packaging material and an oil-in-water dispersion-type content hermetically housed by the packaging material; and (C) subjecting the packaging body to a heating treatment so as to absorb oil contained in the content into the innermost layer.
    Type: Application
    Filed: November 16, 2020
    Publication date: December 29, 2022
    Applicant: TOPPAN INC.
    Inventors: Aki NAGAI, Ryo TANAKA, Hitomi FUKUTAKE, Hiroyuki WAKABAYASHI
  • Publication number: 20210309428
    Abstract: A liquid-repellent layer forming resin composition comprises a polypropylene resin (A) and a silylated polyolefin (B), wherein the polypropylene resin (A) comprises a random polypropylene resin (Al) and a block polypropylene resin (A2) with a mass ratio (Mass of random polypropylene resin (A1)/Mass of block polypropylene resin (A2)) in the range of 20/80 to 80/20.
    Type: Application
    Filed: September 17, 2019
    Publication date: October 7, 2021
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Aki NAGAI, Ryo TANAKA, Kentaro KIMURA, Kosuke KINOSHITA, Hitomi FUKUTAKE
  • Publication number: 20210115231
    Abstract: A liquid-repellent layer forming resin composition comprises a polyolefin resin (A), a silylated polyolefin (B), and a compatibilizer (C) having a site compatible with the polyolefin resin (A) and a site compatible with the silylated polyolefin (B), wherein a polyolefin site of the silylated polyolefin (B) is incompatible with the polyolefin resin (A).
    Type: Application
    Filed: June 7, 2019
    Publication date: April 22, 2021
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Aki NAGAI, Ryo TANAKA, Kentaro KIMURA, Kosuke KINOSHITA