Patents by Inventor Aki Shoukrun

Aki Shoukrun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10989670
    Abstract: A method for detecting defects in a thinned die, the method may include inspecting the thinned die with a two-dimensional inspection module, to find suspected defects that appear as non-reflecting regions that fulfill a size condition; measuring, using a depth measurement module, a depth of the suspected defects; and defining a suspected defects as a defects when the depth parameter exceeds a depth threshold.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: April 27, 2021
    Assignee: CAMTEK LTD.
    Inventor: Aki Shoukrun
  • Patent number: 8836780
    Abstract: A system and method for monitoring a manufacturing process of a fan-out wafer, the method may include acquiring a first set of images of dies after a completion of a first manufacturing stage of a manufacturing process of the fan-out wafer; processing the first set of images to detect defects; performing at least one corrective operation in response to at least one defect detected by processing the first set of images; acquiring a second set of images of dies after a completion of a second manufacturing stage of the manufacturing process of the fan-out wafer, the second manufacturing process follows the first manufacturing process; processing the second set of images to detect defects; and performing at least one corrective operation in response to at least one defect detected by processing the second set of images.
    Type: Grant
    Filed: March 15, 2011
    Date of Patent: September 16, 2014
    Assignee: Camtek Ltd.
    Inventors: Tommy Weiss, Nevo Laron, Thomas Molders, Aki Shoukrun, Nadav Wertsman
  • Publication number: 20110249111
    Abstract: A system and method for monitoring a manufacturing process of a fan-out wafer, the method may include acquiring a first set of images of dies after a completion of a first manufacturing stage of a manufacturing process of the fan-out wafer; processing the first set of images to detect defects; performing at least one corrective operation in response to at least one defect detected by processing the first set of images; acquiring a second set of images of dies after a completion of a second manufacturing stage of the manufacturing process of the fan-out wafer, the second manufacturing process follows the first manufacturing process; processing the second set of images to detect defects; and performing at least one corrective operation in response to at least one defect detected by processing the second set of images.
    Type: Application
    Filed: March 15, 2011
    Publication date: October 13, 2011
    Inventors: Tommy Weiss, Nevo Laron, Thomas Molders, Aki Shoukrun, Nadav Wertsman