Abstract: An evaluation apparatus includes a detected data acquisition unit that acquires photograph data of a bucket of a work equipment, a first display control unit that displays the photograph data on a display screen of a display device, a second display control unit that displays on the display screen a graphic representing at least part of an outline of the bucket as viewed from a side, and moves the graphic on the display screen by an operation of an input device, and an identification unit that distinguishes the bucket from excavated material above an opening end of the bucket on the display screen based on the graphic aligned with the bucket.

Abstract: An evaluation apparatus includes a detected data acquisition unit that acquires photograph data of a bucket of a work equipment, a first display control unit that displays the photograph data on a display screen of a display device, a second display control unit that displays on the display screen a graphic representing at least part of an outline of the bucket as viewed from a side, and moves the graphic on the display screen by an operation of an input device, and an identification unit that distinguishes the bucket from excavated material above an opening end of the bucket on the display screen based on the graphic aligned with the bucket.

Abstract: The invention provides a laser machining apparatus which can effectively machine a fine portion. Accordingly, in a laser machining apparatus which irradiates laser beams (11) onto a subject to be machined (37) so as to perform a machining, there are provided an injection locking type ultraviolet rays laser apparatus (1) having an unstable resonator (45, 46), a condenser array (29) having a plurality of condensers (28) arranged one to one in correspondence to an arrangement of machining positions (98) of the subject to be machined (37), and an intensity distribution converting optical part (25) for converting an intensity distribution of the laser beams (11).

Abstract: A pressure sensor including a semiconductor strain gauge and resistors for compensating temperature, a zero point or the like and made of the same material as that of said semiconductor strain gauge are formed on a metal diaphragm thereof. The resistors for the compensating circuit and the strain gauge are simultaneously formed by patterning a polycrystalline silicone thin film or the like laminated on the diaphragm. As a result, the number of the elements and the manufacturing processes such as a soldering process are reduced for the purpose of improving manufacturing yield. In order to widen the zero point compensating range, a plurality of zero-point compensating resistors, if formed, are disposed on a circumference relative to the center of the diaphragm so as to reduced the scattering in the level of the resistance of each of the resistors.

Abstract: This invention provides a semiconductor film pressure sensor in which the pressure-sensitive resistance layers are made of an n-type polycrystalline silicon layer, and a method of manufacturing the sensor. In the semiconductor film pressure sensor of the invention, the pressure-sensitive resistance layers are formed on a diaphragm, and in addition a coarsely adjusting pattern and a finely adjusting pattern for zero point adjustment and the resistors of a temperature compensating circuit are formed on the diaphragm using the same n-type polycrystalline silicone layer. In formation of the n-type polycrystalline silicone layer, the substrate temperature is held at 500.degree. to 600.degree. C. The coarsely adjusting pattern and finely adjusting pattern for zero point adjustment, and the resistors of the temperature compensating circuit are formed in the same step as the pressure-sensitive resistance layers.