Patents by Inventor Aki Takahashi
Aki Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230398654Abstract: Provided is a workpiece grinding method that is applied when a circular plate-shaped workpiece which has a first surface and a second surface on an opposite side of the first surface is to be ground. The workpiece grinding method includes a first grinding step of grinding the workpiece to form a circular plate-shaped first thin plate portion and an annular first thick plate portion that surrounds the first thin plate portion and that has an inner side surface at least part of which is inclined with respect to the second surface, and a second grinding step of grinding the workpiece to form a circular plate-shaped second thin plate portion that is larger in diameter but thinner than the first thin plate portion and an annular second thick plate portion that surrounds the second thin plate portion.Type: ApplicationFiled: May 30, 2023Publication date: December 14, 2023Inventors: Aki TAKAHASHI, Takuya MIHARA
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Publication number: 20230086792Abstract: To provide a vehicle window structure in which a light emitting device can be disposed outside the laminated glass. A vehicle window structure to be installed at an opening of a vehicle, which comprises a first glass plate and a light emitting device, wherein at least a part of the light emitting device is disposed in a space formed between the first glass plate, an adhesive bonding the first glass plate and a body flange of the vehicle, and an interior material of the vehicle.Type: ApplicationFiled: November 30, 2022Publication date: March 23, 2023Applicant: AGC Inc.Inventors: Takayuki KIMURA, Aki TAKAHASHI, Kenichiro SHIMO, Takafumi INOUE, Takashi TAKADA, Youta OOWA, Takashi SASAKI, Naoya INOUE
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Patent number: 10507657Abstract: A liquid discharge head includes a nozzle plate, a channel substrate, a common-liquid-chamber substrate, an adhesive, and a sealant. The nozzle plate includes a plurality of nozzles to discharge liquid. The channel substrate includes a plurality of individual liquid chambers communicated with the plurality of nozzles. The common-liquid-chamber substrate includes a common liquid chamber to supply the liquid to the plurality of individual liquid chambers. The adhesive bonds two of the nozzle plate, the channel substrate, and the common-liquid-chamber substrate. The adhesive faces a channel through which the liquid flows. The sealant surrounds the adhesive at an opposite side of the channel relative to the adhesive.Type: GrantFiled: November 29, 2016Date of Patent: December 17, 2019Assignee: RICOH COMPANY, LTD.Inventors: Aki Takahashi, Hitoshi Usami, Masaki Kato, Masataka Yoshiike
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Publication number: 20170151782Abstract: A liquid discharge head includes a nozzle plate, a channel substrate, a common-liquid-chamber substrate, an adhesive, and a sealant. The nozzle plate includes a plurality of nozzles to discharge liquid. The channel substrate includes a plurality of individual liquid chambers communicated with the plurality of nozzles. The common-liquid-chamber substrate includes a common liquid chamber to supply the liquid to the plurality of individual liquid chambers. The adhesive bonds two of the nozzle plate, the channel substrate, and the common-liquid-chamber substrate. The adhesive faces a channel through which the liquid flows. The sealant surrounds the adhesive at an opposite side of the channel relative to the adhesive.Type: ApplicationFiled: November 29, 2016Publication date: June 1, 2017Applicant: RICOH COMPANY, LTD.Inventors: Aki TAKAHASHI, Hitoshi USAMI, Masaki KATO, Masataka YOSHllKE
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Patent number: 9505214Abstract: A liquid discharge head includes a plurality of nozzles to discharge liquid droplets; a plurality of individual liquid chambers to which the plurality of nozzles communicates; a common liquid chamber, to supply a liquid to the plurality of individual liquid chambers, including a wall disposed opposite a side of an individual liquid chamber and formed of a deformable damper; a frame forming the common liquid chamber and a damper chamber disposed opposite the common liquid chamber with the damper in between, in which the frame accommodates a damper member including the damper and includes a concave portion that serves as the damper chamber; and an opening opposite the damper and a support member to support the damper member, in which the opening and the support member is disposed on a bottom of the concave portion facing the common liquid chamber.Type: GrantFiled: June 25, 2015Date of Patent: November 29, 2016Assignee: RICOH COMPANY, LTD.Inventor: Aki Takahashi
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Publication number: 20150375505Abstract: A liquid discharge head includes a plurality of nozzles to discharge liquid droplets; a plurality of individual liquid chambers to which the plurality of nozzles communicates; a common liquid chamber, to supply a liquid to the plurality of individual liquid chambers, including a wall disposed opposite a side of an individual liquid chamber and formed of a deformable damper; a frame forming the common liquid chamber and a damper chamber disposed opposite the common liquid chamber with the damper in between, in which the frame accommodates a damper member including the damper and includes a concave portion that serves as the damper chamber; and an opening opposite the damper and a support member to support the damper member, in which the opening and the support member is disposed on a bottom of the concave portion facing the common liquid chamber.Type: ApplicationFiled: June 25, 2015Publication date: December 31, 2015Applicant: RICOH COMPANY, LTD.Inventor: Aki Takahashi
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Patent number: 8029335Abstract: In a wafer processing method, rough grinding using a first grinding stone is divided into first and second steps. In the first step, a wafer is processed into a concave shape at a first transfer rate with a reinforcing rib area slightly left. Thereafter, as primary rough grinding in the second step, the grinding stone is positioned slightly on the inner circumferential side and the wafer is further processed into the concave portion at a second transfer rate faster than the first transfer rate. Since the first transfer rate is suppressed to a rate not to cause a burst chipping, a burst chipping resulting from the second step fast in the processing rate to ensure productivity will occur at the stepped edge portion on the inside of the reinforcing rib area surface. Thus, the flatness of the reinforcing rib area can be ensured.Type: GrantFiled: January 7, 2009Date of Patent: October 4, 2011Assignee: Disco CorporationInventors: Aki Takahashi, Masaaki Nagashima
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Publication number: 20090186563Abstract: In a wafer processing method, rough grinding using a first grinding stone is divided into first and second steps. In the first step, a wafer is processed into a concave shape at a first transfer rate with a reinforcing rib area slightly left. Thereafter, as primary rough grinding in the second step, the grinding stone is positioned slightly on the inner circumferential side and the wafer is further processed into the concave portion at a second transfer rate faster than the first transfer rate. Since the first transfer rate is suppressed to a rate not to cause a burst chipping, a burst chipping resulting from the second step fast in the processing rate to ensure productivity will occur at the stepped edge portion on the inside of the reinforcing rib area surface. Thus, the flatness of the reinforcing rib area can be ensured.Type: ApplicationFiled: January 7, 2009Publication date: July 23, 2009Applicant: DISCO CORPORATIONInventors: Aki Takahashi, Masaaki Nagashima
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Publication number: 20020094069Abstract: A program execution device is connected with a predetermined communication terminal, and signals a call arrival when a call has arrived in the communication terminal during an execution of a program. With this arrangement, the program execution device securely informs the user about the call arrival in the communication terminal, even during the execution of the program. When necessary, the user can respond to the arrived call.Type: ApplicationFiled: November 1, 2001Publication date: July 18, 2002Inventors: Aki Takahashi, Toru Hasumi