Patents by Inventor Akif Ali

Akif Ali has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10580109
    Abstract: One embodiment provides for a processor comprising a three-dimensional (3D) integrated circuit stack including multiple graphics processor cores and interconnect logic to interconnect the graphics processor cores of the 3D integrated circuit stack to enable data distribution between the graphics processor cores over a virtual channel including multiple programmatically pre-assigned traffic classifications.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: March 3, 2020
    Assignee: Intel Corporation
    Inventors: Altug Koker, Lakshminarayanan Striramassarma, Akif Ali
  • Publication number: 20190272615
    Abstract: One embodiment provides for a processor comprising a three-dimensional (3D) integrated circuit stack including multiple graphics processor cores and interconnect logic to interconnect the graphics processor cores of the 3D integrated circuit stack to enable data distribution between the graphics processor cores over a virtual channel including multiple programmatically pre-assigned traffic classifications.
    Type: Application
    Filed: May 21, 2019
    Publication date: September 5, 2019
    Applicant: Intel Corporation
    Inventors: Altug Koker, Lakshminarayanan Striramassarma, Akif Ali
  • Patent number: 10346946
    Abstract: In on embodiment, a hybrid fabric interconnects multiple graphics processor cores within a processor. The hybrid fabric interconnect includes multiple data channels, including programmable virtual data channels. The virtual data channels carry multiple traffic classes of packet-based messages. The virtual data channels and multiple traffic classes may be assigned one of multiple priorities. The virtual data channels may be arbitrated independently. The hybrid fabric is scalable and can support multiple topologies, including multiple stacked integrated circuit topologies.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: July 9, 2019
    Assignee: Intel Corporation
    Inventors: Altug Koker, Lakshminarayanan Striramassarma, Akif Ali
  • Publication number: 20190012762
    Abstract: In on embodiment, a hybrid fabric interconnects multiple graphics processor cores within a processor. The hybrid fabric interconnect includes multiple data channels, including programmable virtual data channels. The virtual data channels carry multiple traffic classes of packet-based messages. The virtual data channels and multiple traffic classes may be assigned one of multiple priorities. The virtual data channels may be arbitrated independently. The hybrid fabric is scalable and can support multiple topologies, including multiple stacked integrated circuit topologies.
    Type: Application
    Filed: July 19, 2018
    Publication date: January 10, 2019
    Applicant: Intel Corporation
    Inventors: Altug Koker, Lakshminarayanan Striramassarma, Akif Ali
  • Patent number: 10102604
    Abstract: In on embodiment, a hybrid fabric interconnects multiple graphics processor cores within a processor. The hybrid fabric interconnect includes multiple data channels, including programmable virtual data channels. The virtual data channels carry multiple traffic classes of packet-based messages. The virtual data channels and multiple traffic classes may be assigned one of multiple priorities. The virtual data channels may be arbitrated independently. The hybrid fabric is scalable and can support multiple topologies, including multiple stacked integrated circuit topologies.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: October 16, 2018
    Assignee: Intel Corporation
    Inventors: Altug Koker, Lakshminarayanan Striramassarma, Akif Ali
  • Publication number: 20160284046
    Abstract: In on embodiment, a hybrid fabric interconnects multiple graphics processor cores within a processor. The hybrid fabric interconnect includes multiple data channels, including programmable virtual data channels. The virtual data channels carry multiple traffic classes of packet-based messages. The virtual data channels and multiple traffic classes may be assigned one of multiple priorities. The virtual data channels may be arbitrated independently. The hybrid fabric is scalable and can support multiple topologies, including multiple stacked integrated circuit topologies.
    Type: Application
    Filed: March 29, 2016
    Publication date: September 29, 2016
    Applicant: Intel Corporation
    Inventors: Altug Koker, Lakshminarayanan Striramassarma, Akif Ali
  • Patent number: 9330433
    Abstract: In on embodiment, a hybrid fabric interconnects multiple graphics processor cores within a processor. The hybrid fabric interconnect includes multiple data channels, including programmable virtual data channels. The virtual data channels carry multiple traffic classes of packet-based messages. The virtual data channels and multiple traffic classes may be assigned one of multiple priorities. The virtual data channels may be arbitrated independently. The hybrid fabric is scalable and can support multiple topologies, including multiple stacked integrated circuit topologies.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: May 3, 2016
    Assignee: Intel Corporation
    Inventors: Altug Koker, Lakshminarayanan Striramassarma, Akif Ali
  • Publication number: 20150379670
    Abstract: In on embodiment, a hybrid fabric interconnects multiple graphics processor cores within a processor. The hybrid fabric interconnect includes multiple data channels, including programmable virtual data channels. The virtual data channels carry multiple traffic classes of packet-based messages. The virtual data channels and multiple traffic classes may be assigned one of multiple priorities. The virtual data channels may be arbitrated independently. The hybrid fabric is scalable and can support multiple topologies, including multiple stacked integrated circuit topologies.
    Type: Application
    Filed: June 30, 2014
    Publication date: December 31, 2015
    Inventors: Altug Koker, Lakshminarayanan Striramassarma, Akif Ali