Patents by Inventor Akifumi HONDA

Akifumi HONDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radio frequency module and communication device
    Patent number: 11139231
    Abstract: A radio frequency module includes: a multilayer substrate that includes a plurality of insulator layers; an amplifying circuit that is provided on the multilayer substrate and amplifies a radio frequency signal; a power supply circuit that is provided on the multilayer substrate and supplies power to the amplifying circuit; a ground conductor that is a first conductor pattern having a ground potential and used in the amplifying circuit; and a ground conductor that is a second conductor pattern having a ground potential and used in the power supply circuit. The ground conductors are physically separated from each other and provided in internal layers of the multilayer substrate.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: October 5, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Akifumi Honda
  • High frequency module and communication device
    Patent number: 11043924
    Abstract: A high frequency module includes a first amplifier circuit, a second amplifier circuit, a first matching circuit connected to the first amplifier circuit, and a second matching circuit connected to the second amplifier circuit, wherein the first matching circuit and the second matching circuit are arranged adjacent to each another. The first matching circuit may be provided on an output side of the first amplifier circuit.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: June 22, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Akifumi Honda
  • RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE
    Publication number: 20200035592
    Abstract: A radio frequency module includes: a multilayer substrate that includes a plurality of insulator layers; an amplifying circuit that is provided on the multilayer substrate and amplifies a radio frequency signal; a power supply circuit that is provided on the multilayer substrate and supplies power to the amplifying circuit; a ground conductor that is a first conductor pattern having a ground potential and used in the amplifying circuit; and a ground conductor that is a second conductor pattern having a ground potential and used in the power supply circuit. The ground conductors are physically separated from each other and provided in internal layers of the multilayer substrate.
    Type: Application
    Filed: October 3, 2019
    Publication date: January 30, 2020
    Inventor: Akifumi HONDA
  • HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
    Publication number: 20200014341
    Abstract: A high frequency module includes a first amplifier circuit, a second amplifier circuit, a first matching circuit connected to the first amplifier circuit, and a second matching circuit connected to the second amplifier circuit, wherein the first matching circuit and the second matching circuit are arranged adjacent to each another. The first matching circuit may be provided on an output side of the first amplifier circuit.
    Type: Application
    Filed: September 16, 2019
    Publication date: January 9, 2020
    Inventor: Akifumi HONDA