Patents by Inventor Akifumi Kamijima

Akifumi Kamijima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200316712
    Abstract: In a method of processing a substrate, in a second step, only some of a plurality of altered portions are exposed from an opening portion of a mask, and the remaining portions are not exposed. In this case, at the time of etching in a third step, an etching rate may be made different between the altered portions exposed from the opening portion of the mask and the altered portions which are not exposed. Accordingly, it becomes easier to obtain a desired processed shape by adjusting the altered portions exposed from the opening portion of the mask and the altered portions which are not exposed.
    Type: Application
    Filed: March 17, 2020
    Publication date: October 8, 2020
    Applicant: TDK Corporation
    Inventor: Akifumi KAMIJIMA
  • Patent number: 10687149
    Abstract: A MEMS microphone includes a substrate, and a first conversion portion and a second conversion portion provided on the substrate, the first conversion portion and the second conversion portion convert sound into an electrical signal, the first conversion portion includes a first through hole, a first membrane covering the first through hole, and a first back plate facing the first membrane via a first air gap, the second conversion portion includes a second through hole, a second membrane covering the second through hole, and a second back plate facing the second membrane via a second air gap, and an area of the second membrane is 1.21 times or more and 2.25 times or less an area of the first membrane when viewed in a thickness direction of the substrate.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: June 16, 2020
    Assignee: TDK CORPORATION
    Inventors: Akifumi Kamijima, Tohru Inoue
  • Patent number: 10679785
    Abstract: Provided is a coil component including a coil portion that has at least one layer of ring-shaped planar coil portion including a coil-wound portion and an insulative resin layer which covers the periphery of the coil-wound portion within the same layer as the coil-wound portion, and an insulative resin layer overlapping the planar coil portion; and a covering portion that covers the coil portion. The insulative resin layer has a superimposing region overlapping a forming region of the planar coil portion and a protrusion region protruding from at least any one of an inner peripheral edge and an outer peripheral edge of the superimposing region, when viewed in the direction of overlapping the planar coil portion.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: June 9, 2020
    Assignee: TDK CORPORATION
    Inventor: Akifumi Kamijima
  • Publication number: 20200077201
    Abstract: A MEMS microphone includes a substrate, and a first conversion portion and a second conversion portion provided on the substrate, the first conversion portion and the second conversion portion convert sound into an electrical signal, the first conversion portion includes a first through hole, a first membrane covering the first through hole, and a first back plate facing the first membrane via a first air gap, the second conversion portion includes a second through hole, a second membrane covering the second through hole, and a second back plate facing the second membrane via a second air gap, and an area of the second membrane is 1.21 times or more and 2.25 times or less an area of the first membrane when viewed in a thickness direction of the substrate.
    Type: Application
    Filed: July 12, 2019
    Publication date: March 5, 2020
    Applicant: TDK CORPORATION
    Inventors: Akifumi KAMIJIMA, Tohru INOUE
  • Publication number: 20200077202
    Abstract: MEMS microphone includes a substrate, and a first conversion portion and a second conversion portion provided on the substrate, the first conversion portion and the second conversion portion convert sound into an electrical signal, the first conversion portion includes a first through hole, a first membrane covering the first through hole, and a first back plate facing the first membrane via a first air gap, the second conversion portion includes a second through hole, a second membrane covering the second through hole, and a second back plate facing the second membrane via a second air gap, and a dimension of the second air gap is greater than a dimension of the first air gap in a thickness direction of the substrate.
    Type: Application
    Filed: July 12, 2019
    Publication date: March 5, 2020
    Applicant: TDK CORPORATION
    Inventors: Akifumi KAMIJIMA, Tohru INOUE
  • Patent number: 10460877
    Abstract: In a thin-film capacitor, a first extraction electrode provided along a side surface of a first groove portion is in contact with a first electrode layer and is not in contact with a second electrode layer. Also, a second extraction electrode provided along a side surface of a second groove portion is in contact with the second electrode layer exposed on the side surface of the second groove portion and is not in contact with the first electrode layer. Thus, a capacitor structure in which the first electrode layer in contact with the first extraction electrode and the second electrode layer in contact with the second extraction electrode are laminated with a dielectric layer therebetween is formed between the first groove portion and the second groove portion.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: October 29, 2019
    Assignee: TDK CORPORATION
    Inventors: Atsuhiro Tsuyoshi, Akifumi Kamijima
  • Publication number: 20190318893
    Abstract: A magnetically actuated MEMS switch 100 includes a first magnetic core portion 120, a first signal line 15, a first contact point 16, a second magnetic core portion 220, a second signal line 25, a second contact point 26, and a first coil portion 111 and a second coil portion 211 serving as a magnetic field applying portion that causes a current to flow in conductor coil to apply a magnetic field to the first magnetic core portion 120 and the second magnetic core portion 220. The first contact point 16 is displaced depending on the presence or absence of a magnetic field applied by the magnetic field applying portion. Connection and disconnection between the first contact point 16 and the second contact point 26 are switched in response to displacement of the first contact point 16.
    Type: Application
    Filed: April 8, 2019
    Publication date: October 17, 2019
    Applicant: TDK CORPORATION
    Inventors: Akifumi KAMIJIMA, Atsushi IIJIMA, Kyung-Ku CHOI, Katsunori OSANAI, Daisuke IWANAGA
  • Publication number: 20190229703
    Abstract: A component (B) comprising a carrier (TR), on which a functional structure (FS) is covered by a thin-layer covering (DSA) spanning across and resting on the carrier. On a planarization layer arranged above the thin-layer covering (DSA), a wiring level (M1, M2) is realized, which comprises structured conductor paths and which is connected via through-connections to the functional structure (FS).
    Type: Application
    Filed: June 26, 2017
    Publication date: July 25, 2019
    Inventors: Thomas METZGER, Akifumi KAMIJIMA
  • Patent number: 10153092
    Abstract: A thin-film capacitor including a stacked body having a lower electrode layer, a plurality of dielectric layers stacked on the lower electrode layer, one or more internal electrode layers interposed between the dielectric layers, and an upper electrode layer that is stacked on the opposite side of the lower electrode layer with the dielectric layers and the internal electrode layers interposed between, and a cover layer that covers the stacked body. The stacked body includes opening portions that have the lower electrode layer, opens upward in a stacking direction, and has a side surface formed to include an inclined surface. The cover layer is stacked on the inclined surface of the stacked body. A curved surface with a predetermined shape is formed on the inclined surface for each pair of layers including the dielectric layer forming the inclined surface and the electrode layer, forming the inclined surface.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: December 11, 2018
    Assignee: TDK CORPORATION
    Inventors: Michihiro Kumagae, Akifumi Kamijima, Norihiko Matsuzaka, Junki Nakamoto, Kazuhiro Yoshikawa, Kenichi Yoshida
  • Publication number: 20180102219
    Abstract: A thin-film capacitor including a stacked body having a lower electrode layer, a plurality of dielectric layers stacked on the lower electrode layer, one or more internal electrode layers interposed between the dielectric layers, and an upper electrode layer that is stacked on the opposite side of the lower electrode layer with the dielectric layers and the internal electrode layers interposed between, and a cover layer that covers the stacked body. The stacked body includes opening portions that have the lower electrode layer, opens upward in a stacking direction, and has a side surface formed to include an inclined surface. The cover layer is stacked on the inclined surface of the stacked body. A curved surface with a predetermined shape is formed on the inclined surface for each pair of layers including the dielectric layer forming the inclined surface and the electrode layer, forming the inclined surface.
    Type: Application
    Filed: October 5, 2017
    Publication date: April 12, 2018
    Applicant: TDK CORPORATION
    Inventors: Michihiro KUMAGAE, Akifumi KAMIJIMA, Norihiko MATSUZAKA, Junki NAKAMOTO, Kazuhiro YOSHIKAWA, Kenichi YOSHIDA
  • Publication number: 20170345576
    Abstract: In a thin-film capacitor, a first extraction electrode provided along a side surface of a first groove portion is in contact with a first electrode layer and is not in contact with a second electrode layer. Also, a second extraction electrode provided along a side surface of a second groove portion is in contact with the second electrode layer exposed on the side surface of the second groove portion and is not in contact with the first electrode layer. Thus, a capacitor structure in which the first electrode layer in contact with the first extraction electrode and the second electrode layer in contact with the second extraction electrode are laminated with a dielectric layer therebetween is formed between the first groove portion and the second groove portion.
    Type: Application
    Filed: May 24, 2017
    Publication date: November 30, 2017
    Applicant: TDK CORPORATION
    Inventors: Atsuhiro TSUYOSHI, Akifumi KAMIJIMA
  • Publication number: 20170316868
    Abstract: Provided is a coil component including a coil portion that has at least one layer of ring-shaped planar coil portion including a coil-wound portion and an insulative resin layer which covers the periphery of the coil-wound portion within the same layer as the coil-wound portion, and an insulative resin layer overlapping the planar coil portion; and a covering portion that covers the coil portion. The insulative resin layer has a superimposing region overlapping a forming region of the planar coil portion and a protrusion region protruding from at least any one of an inner peripheral edge and an outer peripheral edge of the superimposing region, when viewed in the direction of overlapping the planar coil portion.
    Type: Application
    Filed: April 24, 2017
    Publication date: November 2, 2017
    Applicant: TDK CORPORATION
    Inventor: Akifumi KAMIJIMA
  • Publication number: 20170316867
    Abstract: Provided is a coil component including a coil portion that has two ring-shaped planar coil portions individually including a coil-wound portion and an insulative resin layer which covers the periphery of the coil-wound portion within the same layer as the coil-wound portion, an insulative resin layer being interposed between the planar coil portions adjacent to each other in the stacking direction of the planar coil portions, and a pair of insulative resin layers being respectively positioned on one end side and the other end side of the two planar coil portions in the stacking direction; and a covering portion that covers the coil portion. In regard to the stacking direction, the thickness of the insulative resin layer is thinner than the thickness of each of the pair of insulative resin layers.
    Type: Application
    Filed: April 24, 2017
    Publication date: November 2, 2017
    Applicant: TDK CORPORATION
    Inventors: Akifumi KAMIJIMA, Masamichi TANIGUCHI, Makoto ENDO, Tohru INOUE
  • Patent number: 8470189
    Abstract: In the present invention, provided is a method of forming a mask pattern by which a fine thin film pattern may be formed more easily with higher resolution and precision. In the method of forming a mask pattern, a photoresist pattern having an opening is formed on a substrate, then, an inorganic film is formed so as to cover the upper surface of the photoresist pattern and the inside of the opening, then the inorganic film on the upper surface of the photoresist pattern is removed by a dry etching process. Subsequently, an inorganic mask pattern is formed by removing the photoresist pattern. The inorganic mask pattern thus formed hardly produces an issue of deformation such as physical displacement even when it is heated in the dry etching process.
    Type: Grant
    Filed: June 3, 2008
    Date of Patent: June 25, 2013
    Assignee: TDK Corporation
    Inventors: Akifumi Kamijima, Hideyuki Yatsu, Hitoshi Hatate
  • Patent number: 8247029
    Abstract: The micropattern formation of the invention comprises forming a resist pattern, and then forming a carbon-containing film on the surface of the resist pattern, followed by ashing of the carbon-containing film and a portion of the resist surface constituting the resist pattern. Thus, the discharge state of ashing just after the initiation of discharge is so stabilized that the ashing rate distribution can be improved, and sensitive pattern slimming can be implemented with ease and high precision.
    Type: Grant
    Filed: June 17, 2008
    Date of Patent: August 21, 2012
    Assignee: TDK Corporation
    Inventors: Akifumi Kamijima, Hideyuki Yatsu, Hitoshi Hatate
  • Patent number: 8094523
    Abstract: Provided is a magnetic recording medium that generates near-field light within itself and enables favorable heat-assisted magnetic recording with this near-field light. The medium comprises: a magnetic recording layer; and an optically changeable layer formed on the opposite side to a substrate relative to the magnetic recording layer, the optically changeable layer being made transparent or a refractive index of the layer being changed when irradiated by light with an intensity not less than a predetermined intensity. By the irradiation, a minute opening or a refractive-index-changed area is formed within the irradiated portion on the optically changeable layer. The light irradiation onto the minute opening or the refractive-index-changed area enables near-field light to be generated, which heats a portion of the magnetic recording layer. Thus, the anisotropic field of the portion is lowered to a writable value, which enables heat-assisted magnetic recording by applying write field.
    Type: Grant
    Filed: September 19, 2008
    Date of Patent: January 10, 2012
    Assignee: TDK Corporation
    Inventors: Akifumi Kamijima, Koji Shimazawa
  • Patent number: 8021829
    Abstract: Provided is a method of forming a photoresist pattern enabling the three dimensional shape of a photoresist pattern to be controlled sufficiently. A photoresist pattern for forming a main magnetic pole layer can be formed by forming a preparatory photoresist pattern having a projected part at a position corresponding to a flare point by selectively exposing and developing a photoresist film, and then heating the preparatory photoresist pattern. In the heating process, the presence of the projected part in the preparatory photoresist pattern relaxes the influence of thermal contraction, and hence the photoresist film is hard to be rounded at the position. Moreover, in the heating process, the preparatory photoresist pattern can be thermally flown and thermally contracted, so that the internal wall in the opening part can be inclined and the projected part can be retreated. Thus, the three dimensional shape of the photoresist pattern approaches a desired three dimensional shape.
    Type: Grant
    Filed: March 2, 2007
    Date of Patent: September 20, 2011
    Assignee: TDK Corporation
    Inventor: Akifumi Kamijima
  • Patent number: 7947434
    Abstract: The process of forming a plated film according to the invention is designed such that the surface asperities of the inorganic film formed by the tracing of a standing wave occurring at the inner wall surface of the first opening in the resist at the resist pattern-formation step are reduced or eliminated. It is thus possible to form, efficiently yet in a short period of time, a high aspect-ratio plated film portion having an aspect ratio of greater than 1. In addition, the formed plated film quality is extremely improved for the absence of pores (cavities).
    Type: Grant
    Filed: February 6, 2007
    Date of Patent: May 24, 2011
    Assignee: TDK Corporation
    Inventors: Akifumi Kamijima, Hitoshi Hatate, Hideyuki Yatsu
  • Patent number: 7947428
    Abstract: The present invention provides a method for forming a photosensitive polyimide pattern 38 on a metal conductor 32, comprising carrying out the following steps (A) to (E) in this order: (A) a step of forming an ester bond type photosensitive polyimide precursor layer 33 by applying an ester bond type photosensitive polyimide precursor composition onto the metal conductor 32; (B) a step of forming an ion bond type photosensitive polyimide precursor layer 34 by applying an ion bond type photosensitive polyimide precursor composition onto the precursor layer 33 until the thickness of the precursor layer 34 reaches a desired thickness; (C) a step of exposing through a mask 35 and transferring the mask pattern as a latent image 36 onto the precursor layers 33 and 34; (D) a step of developing; and (E) a step of forming a polyimide pattern 38 by curing the developed precursor layers 33 and 34.
    Type: Grant
    Filed: September 27, 2005
    Date of Patent: May 24, 2011
    Assignee: TDK Corporation
    Inventor: Akifumi Kamijima
  • Patent number: 7862737
    Abstract: Provided is a planarizing method in which a planarization with high flatness can be performed, without being restricted by the distribution of film thickness in the applied resist film. The planarizing method comprises the steps of: forming a resist film on a film to be planarized formed on a substrate; exposing the resist film with the amounts of exposure light in respective sections into which an area in which the film to be planarized is formed is divided, the amounts of exposure light being determined so as to realize film thicknesses to be left for planarization of the resist film in the respective sections; developing the exposed resist film, to form a resist film pattern with a controlled distribution of film thickness; and etching the resist film pattern and the film to be planarized, until eliminating the thickness amounts to be eliminated of the film to be planarized.
    Type: Grant
    Filed: August 10, 2007
    Date of Patent: January 4, 2011
    Assignee: TDK Corporation
    Inventors: Akifumi Kamijima, Hideyuki Yatsu, Hitoshi Hatate