Patents by Inventor Akifumi Kamijima
Akifumi Kamijima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11551896Abstract: A magnetically actuated MEMS switch 100 includes a first magnetic core portion 120, a first signal line 15, a first contact point 16, a second magnetic core portion 220, a second signal line 25, a second contact point 26, and a first coil portion 111 and a second coil portion 211 serving as a magnetic field applying portion that causes a current to flow in conductor coil to apply a magnetic field to the first magnetic core portion 120 and the second magnetic core portion 220. The first contact point 16 is displaced depending on the presence or absence of a magnetic field applied by the magnetic field applying portion. Connection and disconnection between the first contact point 16 and the second contact point 26 are switched in response to displacement of the first contact point 16.Type: GrantFiled: June 22, 2021Date of Patent: January 10, 2023Assignee: TDK CORPORATIONInventors: Akifumi Kamijima, Atsushi Iijima, Kyung-Ku Choi, Katsunori Osanai, Daisuke Iwanaga
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Patent number: 11478874Abstract: In a method of processing a substrate, in a second step, only some of a plurality of altered portions are exposed from an opening portion of a mask, and the remaining portions are not exposed. In this case, at the time of etching in a third step, an etching rate may be made different between the altered portions exposed from the opening portion of the mask and the altered portions which are not exposed. Accordingly, it becomes easier to obtain a desired processed shape by adjusting the altered portions exposed from the opening portion of the mask and the altered portions which are not exposed.Type: GrantFiled: March 17, 2020Date of Patent: October 25, 2022Assignee: TDK CORPORATIONInventor: Akifumi Kamijima
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Patent number: 11350221Abstract: A MEMS microphone includes a substrate, and a first conversion portion and a second conversion portion provided on the substrate, the first conversion portion and the second conversion portion convert sound into an electrical signal, the first conversion portion includes a first through hole, a first membrane covering the first through hole, and a first back plate facing the first membrane via a first air gap, the second conversion portion includes a second through hole, a second membrane covering the second through hole, and a second back plate facing the second membrane via a second air gap, and a dimension of the second air gap is greater than a dimension of the first air gap in a thickness direction of the substrate.Type: GrantFiled: January 7, 2021Date of Patent: May 31, 2022Assignee: TDK CORPORATIONInventors: Akifumi Kamijima, Tohru Inoue
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Patent number: 11296673Abstract: A component (B) comprising a carrier (TR), on which a functional structure (FS) is covered by a thin-layer covering (DSA) spanning across and resting on the carrier. On a planarization layer arranged above the thin-layer covering (DSA), a wiring level (M1, M2) is realized, which comprises structured conductor paths and which is connected via through-connections to the functional structure (FS).Type: GrantFiled: June 26, 2017Date of Patent: April 5, 2022Assignee: SnapTrack, Inc.Inventors: Thomas Metzger, Akifumi Kamijima
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Publication number: 20210313130Abstract: A magnetically actuated MEMS switch 100 includes a first magnetic core portion 120, a first signal line 15, a first contact point 16, a second magnetic core portion 220, a second signal line 25, a second contact point 26, and a first coil portion 111 and a second coil portion 211 serving as a magnetic field applying portion that causes a current to flow in conductor coil to apply a magnetic field to the first magnetic core portion 120 and the second magnetic core portion 220. The first contact point 16 is displaced depending on the presence or absence of a magnetic field applied by the magnetic field applying portion. Connection and disconnection between the first contact point 16 and the second contact point 26 are switched in response to displacement of the first contact point 16.Type: ApplicationFiled: June 22, 2021Publication date: October 7, 2021Applicant: TDK CORPORATIONInventors: Akifumi KAMIJIMA, Atsushi IIJIMA, Kyung-Ku CHOI, Katsunori OSANAI, Daisuke IWANAGA
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Patent number: 11075041Abstract: A magnetically actuated MEMS switch 100 includes a first magnetic core portion 120, a first signal line 15, a first contact point 16, a second magnetic core portion 220, a second signal line 25, a second contact point 26, and a first coil portion 111 and a second coil portion 211 serving as a magnetic field applying portion that causes a current to flow in conductor coil to apply a magnetic field to the first magnetic core portion 120 and the second magnetic core portion 220. The first contact point 16 is displaced depending on the presence or absence of a magnetic field applied by the magnetic field applying portion. Connection and disconnection between the first contact point 16 and the second contact point 26 are switched in response to displacement of the first contact point 16.Type: GrantFiled: April 8, 2019Date of Patent: July 27, 2021Assignee: TDK CORPORATIONInventors: Akifumi Kamijima, Atsushi Iijima, Kyung-Ku Choi, Katsunori Osanai, Daisuke Iwanaga
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Publication number: 20210127214Abstract: A MEMS microphone includes a substrate, and a first conversion portion and a second conversion portion provided on the substrate, the first conversion portion and the second conversion portion convert sound into an electrical signal, the first conversion portion includes a first through hole, a first membrane covering the first through hole, and a first back plate facing the first membrane via a first air gap, the second conversion portion includes a second through hole, a second membrane covering the second through hole, and a second back plate facing the second membrane via a second air gap, and a dimension of the second air gap is greater than a dimension of the first air gap in a thickness direction of the substrate.Type: ApplicationFiled: January 7, 2021Publication date: April 29, 2021Applicant: TDK CORPORATIONInventors: Akifumi KAMIJIMA, Tohru INOUE
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Patent number: 10917728Abstract: A MEMS microphone includes a substrate, and a first conversion portion and a second conversion portion provided on the substrate, the first conversion portion and the second conversion portion convert sound into an electrical signal, the first conversion portion includes a first through hole, a first membrane covering the first through hole, and a first back plate facing the first membrane via a first air gap, the second conversion portion includes a second through hole, a second membrane covering the second through hole, and a second back plate facing the second membrane via a second air gap, and a dimension of the second air gap is greater than a dimension of the first air gap in a thickness direction of the substrate.Type: GrantFiled: July 12, 2019Date of Patent: February 9, 2021Assignee: TDK CORPORATIONInventors: Akifumi Kamijima, Tohru Inoue
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Publication number: 20200316712Abstract: In a method of processing a substrate, in a second step, only some of a plurality of altered portions are exposed from an opening portion of a mask, and the remaining portions are not exposed. In this case, at the time of etching in a third step, an etching rate may be made different between the altered portions exposed from the opening portion of the mask and the altered portions which are not exposed. Accordingly, it becomes easier to obtain a desired processed shape by adjusting the altered portions exposed from the opening portion of the mask and the altered portions which are not exposed.Type: ApplicationFiled: March 17, 2020Publication date: October 8, 2020Applicant: TDK CorporationInventor: Akifumi KAMIJIMA
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Patent number: 10687149Abstract: A MEMS microphone includes a substrate, and a first conversion portion and a second conversion portion provided on the substrate, the first conversion portion and the second conversion portion convert sound into an electrical signal, the first conversion portion includes a first through hole, a first membrane covering the first through hole, and a first back plate facing the first membrane via a first air gap, the second conversion portion includes a second through hole, a second membrane covering the second through hole, and a second back plate facing the second membrane via a second air gap, and an area of the second membrane is 1.21 times or more and 2.25 times or less an area of the first membrane when viewed in a thickness direction of the substrate.Type: GrantFiled: July 12, 2019Date of Patent: June 16, 2020Assignee: TDK CORPORATIONInventors: Akifumi Kamijima, Tohru Inoue
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Patent number: 10679785Abstract: Provided is a coil component including a coil portion that has at least one layer of ring-shaped planar coil portion including a coil-wound portion and an insulative resin layer which covers the periphery of the coil-wound portion within the same layer as the coil-wound portion, and an insulative resin layer overlapping the planar coil portion; and a covering portion that covers the coil portion. The insulative resin layer has a superimposing region overlapping a forming region of the planar coil portion and a protrusion region protruding from at least any one of an inner peripheral edge and an outer peripheral edge of the superimposing region, when viewed in the direction of overlapping the planar coil portion.Type: GrantFiled: April 24, 2017Date of Patent: June 9, 2020Assignee: TDK CORPORATIONInventor: Akifumi Kamijima
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Publication number: 20200077202Abstract: MEMS microphone includes a substrate, and a first conversion portion and a second conversion portion provided on the substrate, the first conversion portion and the second conversion portion convert sound into an electrical signal, the first conversion portion includes a first through hole, a first membrane covering the first through hole, and a first back plate facing the first membrane via a first air gap, the second conversion portion includes a second through hole, a second membrane covering the second through hole, and a second back plate facing the second membrane via a second air gap, and a dimension of the second air gap is greater than a dimension of the first air gap in a thickness direction of the substrate.Type: ApplicationFiled: July 12, 2019Publication date: March 5, 2020Applicant: TDK CORPORATIONInventors: Akifumi KAMIJIMA, Tohru INOUE
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Publication number: 20200077201Abstract: A MEMS microphone includes a substrate, and a first conversion portion and a second conversion portion provided on the substrate, the first conversion portion and the second conversion portion convert sound into an electrical signal, the first conversion portion includes a first through hole, a first membrane covering the first through hole, and a first back plate facing the first membrane via a first air gap, the second conversion portion includes a second through hole, a second membrane covering the second through hole, and a second back plate facing the second membrane via a second air gap, and an area of the second membrane is 1.21 times or more and 2.25 times or less an area of the first membrane when viewed in a thickness direction of the substrate.Type: ApplicationFiled: July 12, 2019Publication date: March 5, 2020Applicant: TDK CORPORATIONInventors: Akifumi KAMIJIMA, Tohru INOUE
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Patent number: 10460877Abstract: In a thin-film capacitor, a first extraction electrode provided along a side surface of a first groove portion is in contact with a first electrode layer and is not in contact with a second electrode layer. Also, a second extraction electrode provided along a side surface of a second groove portion is in contact with the second electrode layer exposed on the side surface of the second groove portion and is not in contact with the first electrode layer. Thus, a capacitor structure in which the first electrode layer in contact with the first extraction electrode and the second electrode layer in contact with the second extraction electrode are laminated with a dielectric layer therebetween is formed between the first groove portion and the second groove portion.Type: GrantFiled: May 24, 2017Date of Patent: October 29, 2019Assignee: TDK CORPORATIONInventors: Atsuhiro Tsuyoshi, Akifumi Kamijima
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Publication number: 20190318893Abstract: A magnetically actuated MEMS switch 100 includes a first magnetic core portion 120, a first signal line 15, a first contact point 16, a second magnetic core portion 220, a second signal line 25, a second contact point 26, and a first coil portion 111 and a second coil portion 211 serving as a magnetic field applying portion that causes a current to flow in conductor coil to apply a magnetic field to the first magnetic core portion 120 and the second magnetic core portion 220. The first contact point 16 is displaced depending on the presence or absence of a magnetic field applied by the magnetic field applying portion. Connection and disconnection between the first contact point 16 and the second contact point 26 are switched in response to displacement of the first contact point 16.Type: ApplicationFiled: April 8, 2019Publication date: October 17, 2019Applicant: TDK CORPORATIONInventors: Akifumi KAMIJIMA, Atsushi IIJIMA, Kyung-Ku CHOI, Katsunori OSANAI, Daisuke IWANAGA
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Publication number: 20190229703Abstract: A component (B) comprising a carrier (TR), on which a functional structure (FS) is covered by a thin-layer covering (DSA) spanning across and resting on the carrier. On a planarization layer arranged above the thin-layer covering (DSA), a wiring level (M1, M2) is realized, which comprises structured conductor paths and which is connected via through-connections to the functional structure (FS).Type: ApplicationFiled: June 26, 2017Publication date: July 25, 2019Inventors: Thomas METZGER, Akifumi KAMIJIMA
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Patent number: 10153092Abstract: A thin-film capacitor including a stacked body having a lower electrode layer, a plurality of dielectric layers stacked on the lower electrode layer, one or more internal electrode layers interposed between the dielectric layers, and an upper electrode layer that is stacked on the opposite side of the lower electrode layer with the dielectric layers and the internal electrode layers interposed between, and a cover layer that covers the stacked body. The stacked body includes opening portions that have the lower electrode layer, opens upward in a stacking direction, and has a side surface formed to include an inclined surface. The cover layer is stacked on the inclined surface of the stacked body. A curved surface with a predetermined shape is formed on the inclined surface for each pair of layers including the dielectric layer forming the inclined surface and the electrode layer, forming the inclined surface.Type: GrantFiled: October 5, 2017Date of Patent: December 11, 2018Assignee: TDK CORPORATIONInventors: Michihiro Kumagae, Akifumi Kamijima, Norihiko Matsuzaka, Junki Nakamoto, Kazuhiro Yoshikawa, Kenichi Yoshida
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Publication number: 20180102219Abstract: A thin-film capacitor including a stacked body having a lower electrode layer, a plurality of dielectric layers stacked on the lower electrode layer, one or more internal electrode layers interposed between the dielectric layers, and an upper electrode layer that is stacked on the opposite side of the lower electrode layer with the dielectric layers and the internal electrode layers interposed between, and a cover layer that covers the stacked body. The stacked body includes opening portions that have the lower electrode layer, opens upward in a stacking direction, and has a side surface formed to include an inclined surface. The cover layer is stacked on the inclined surface of the stacked body. A curved surface with a predetermined shape is formed on the inclined surface for each pair of layers including the dielectric layer forming the inclined surface and the electrode layer, forming the inclined surface.Type: ApplicationFiled: October 5, 2017Publication date: April 12, 2018Applicant: TDK CORPORATIONInventors: Michihiro KUMAGAE, Akifumi KAMIJIMA, Norihiko MATSUZAKA, Junki NAKAMOTO, Kazuhiro YOSHIKAWA, Kenichi YOSHIDA
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Publication number: 20170345576Abstract: In a thin-film capacitor, a first extraction electrode provided along a side surface of a first groove portion is in contact with a first electrode layer and is not in contact with a second electrode layer. Also, a second extraction electrode provided along a side surface of a second groove portion is in contact with the second electrode layer exposed on the side surface of the second groove portion and is not in contact with the first electrode layer. Thus, a capacitor structure in which the first electrode layer in contact with the first extraction electrode and the second electrode layer in contact with the second extraction electrode are laminated with a dielectric layer therebetween is formed between the first groove portion and the second groove portion.Type: ApplicationFiled: May 24, 2017Publication date: November 30, 2017Applicant: TDK CORPORATIONInventors: Atsuhiro TSUYOSHI, Akifumi KAMIJIMA
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Publication number: 20170316868Abstract: Provided is a coil component including a coil portion that has at least one layer of ring-shaped planar coil portion including a coil-wound portion and an insulative resin layer which covers the periphery of the coil-wound portion within the same layer as the coil-wound portion, and an insulative resin layer overlapping the planar coil portion; and a covering portion that covers the coil portion. The insulative resin layer has a superimposing region overlapping a forming region of the planar coil portion and a protrusion region protruding from at least any one of an inner peripheral edge and an outer peripheral edge of the superimposing region, when viewed in the direction of overlapping the planar coil portion.Type: ApplicationFiled: April 24, 2017Publication date: November 2, 2017Applicant: TDK CORPORATIONInventor: Akifumi KAMIJIMA