Abstract: A method for producing SiC/SiC composite material according to the present invention includes impregnating a substrate with a slurry containing particles of a flaky lubricant to obtain an impregnated body, drying out a solvent of the slurry from the impregnated body, forming an interface layer on surfaces of the SiC fibers by bending the impregnated body, and transferring the particles of the flaky lubricant to the surfaces of the SiC fibers while stretching the particles, and forming a SiC matrix inside the substrate on which the interface layer is formed. Since a thin interface layer of the flaky lubricant can be formed on the surfaces of the SiC fibers by transferring the flaky lubricant to the surfaces of the SiC fibers, the interface layer reaching inside of the substrate can be easily formed.

Abstract: A method for producing SiC/SiC composite material according to the present invention includes impregnating a substrate with a slurry containing particles of a flaky lubricant to obtain an impregnated body, drying out a solvent of the slurry from the impregnated body, forming an interface layer on surfaces of the SiC fibers by bending the impregnated body, and transferring the particles of the flaky lubricant to the surfaces of the SiC fibers while stretching the particles, and forming a SiC matrix inside the substrate on which the interface layer is formed. Since a thin interface layer of the flaky lubricant can be formed on the surfaces of the SiC fibers by transferring the flaky lubricant to the surfaces of the SiC fibers, the interface layer reaching inside of the substrate can be easily formed.

Abstract: A wiring board includes a core substrate, a first laminated structure formed on a surface of the substrate and including conductive and insulation layers, and a second laminated structure formed on the opposite surface of the substrate and including conductive and insulation layers. The substrate has a connection conductor made of a plating. The insulation layers of the first laminated structure have connection conductors stacked one over another and made of platings. The insulation layers of the second laminated structure have connection conductors stacked one over another and made of platings. The connection conductors of the laminated structures are stacked on the connection conductor of the substrate. The connection conductors of the laminated structures include outer-layer connection conductors which have positions shifted in a substantially same direction from the position of the connection conductor of the substrate.

Abstract: A wiring board including a core insulation layer having a connection conductor formed in a hole of the core layer, and an interlayer insulation layer laminated on one side of the core layer. The conductor of the core layer includes plating filling the hole of the core layer. The interlayer layer has a connection conductor formed in a hole of the interlayer layer. The conductor of the interlayer layer includes plating filling the hole of the interlayer layer. The conductor of the interlayer layer is stacked on the conductor of the core insulation layer. The conductors of the core and interlayer layers have lands formed on the core and interlayer layers and including metal foils and plating on the foils. The foil of the land on the core layer has a thickness which is thicker than a thickness of the foil of the land on the interlayer layer.

Abstract: A wiring board includes a core substrate, a first laminated structure formed on a surface of the substrate and including conductive and insulation layers, and a second laminated structure formed on the opposite surface of the substrate and including conductive and insulation layers. The substrate has a connection conductor made of a plating. The insulation layers of the first laminated structure have connection conductors stacked one over another and made of platings. The insulation layers of the second laminated structure have connection conductors stacked one over another and made of platings. The connection conductors of the laminated structures are stacked on the connection conductor of the substrate. The connection conductors of the laminated structures include outer-layer connection conductors which have positions shifted in a substantially same direction from the position of the connection conductor of the substrate.

Abstract: A wiring board includes a core substrate, a first laminated structure formed on a surface of the substrate and including conductive and insulation layers, and a second laminated structure formed on the opposite surface of the substrate and including conductive and insulation layers. The substrate has a connection conductor made of a plating. The insulation layers of the first laminated structure have connection conductors stacked one over another and made of platings. The insulation layers of the second laminated structure have connection conductors stacked one over another and made of platings. The connection conductors of the laminated structures are stacked on the connection conductor of the substrate. The connection conductors of the laminated structures include outer-layer connection conductors which have positions shifted in a substantially same direction from the position of the connection conductor of the substrate.

Abstract: A wiring board including a core insulation layer having a connection conductor formed in a hole of the core layer, and an interlayer insulation layer laminated on one side of the core layer. The conductor of the core layer includes plating filling the hole of the core layer. The interlayer layer has a connection conductor formed in a hole of the interlayer layer. The conductor of the interlayer layer includes plating filling the hole of the interlayer layer. The conductor of the interlayer layer is stacked on the conductor of the core insulation layer. The conductors of the core and interlayer layers have lands formed on the core and interlayer layers and including metal foils and plating on the foils. The foil of the land on the core layer has a thickness which is thicker than a thickness of the foil of the land on the interlayer layer.