Patents by Inventor Akihide Shimoda

Akihide Shimoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7619020
    Abstract: The present invention provides a polyacetal resin composition having excellent mechanical characteristics with reduced generation of formaldehyde. To 100 parts by weight of (A1) a polyacetal resin having substantially straight chain molecular structure, there are added 0.1-20 parts by weight of (A2) a polyacetal resin having a branched or cross-linked molecular structure, 3-200 parts by weight of (B) a glass-base inorganic filler, and 0.001 to 3 parts by weight of (C) a boric acid compound.
    Type: Grant
    Filed: August 8, 2007
    Date of Patent: November 17, 2009
    Assignee: Polyplastics Co., Ltd.
    Inventors: Akihide Shimoda, Hiraku Iketani
  • Publication number: 20090143508
    Abstract: Provided is a polyacetal resin molded article having an excellent acid resistance, used for parts contacting with a liquid containing an acidic substance. Specifically, a molded article having excellent durability under direct contact with a liquid containing an acidic component is obtained by molding the composition of (A) 100 parts by weight of a polyacetal resin, (B) 0.01 to 5 parts by weight of an antioxidant, and (C) 0.01 to 10 parts by weight of a metal salt of fatty acid.
    Type: Application
    Filed: November 25, 2008
    Publication date: June 4, 2009
    Inventors: Minoru Bessho, Akihide Shimoda
  • Publication number: 20080039567
    Abstract: The present invention provides a polyacetal resin composition having excellent mechanical characteristics with reduced generation of formaldehyde. To 100 parts by weight of (A1) a polyacetal resin having substantially straight chain molecular structure, there are added 0.1-20 parts by weight of (A2) a polyacetal resin having a branched or cross-linked molecular structure, 3-200 parts by weight of (B) a glass-base inorganic filler, and 0.001 to 3 parts by weight of (C) a boric acid compound.
    Type: Application
    Filed: August 8, 2007
    Publication date: February 14, 2008
    Applicant: Polyplastics Co., Ltd.
    Inventors: Akihide Shimoda, Hiraku Iketani
  • Publication number: 20050260372
    Abstract: A wholly aromatic polyester amide liquid crystal resin including repeating units of: (I) a 6-hydroxy-2-naphthoic acid residue: 1 to 15 mol %, (II) a 4-hydroxybenzoic acid residue: 40 to 70 mol %, (III) an aromatic diol residue: 5 to 28.5 mol %, (IV) a 4-aminophenol residue: 1 to 20 mol %, and (V) an aromatic dicarboxylic acid residue: 6 to 29.5 mol %, and having a melting point of 270° C. to 370° C., and having a melt viscosity of 60 Pa.s to 200 Pa.s at a shear rate of 1000/sec at a temperature higher by 10° C. to 20° C. than this melting point is molten at a temperature of the melting point +40° C., and extruded at a rate of 0.3 kg/min or more and less than 5 kg/min to form a parison. A pair of molds arranged with the parison interposed there between are closed under a prescribed mold closing pressure, so that air is blown into the interior of the parison.
    Type: Application
    Filed: July 29, 2005
    Publication date: November 24, 2005
    Inventors: Seiichi Matsuoka, Shigeru Nezu, Akihide Shimoda, Masato Suzuki
  • Patent number: 5183623
    Abstract: A process for producing a transparent and heat-resistant container includes forming a sheet from a melt of a polyester resin having at least 80 mole % ester units derived from 1,3-propanediol and terephthalic acid or an ester-forming derivative thereof. The formed sheet is quenched and solidified so as to have relatively low crystallinity (i.e., less than 50%). The solidified low crystallinity film is then aged and shaped by thermoforming to obtain a container having relatively high crystallinity (i.e., greater than 50%, and preferably greater than 80%). The aging step is most preferably conducted at a temperature which satisfies the relationship represented by the following equation (1):Ta.ltoreq.Tccwherein Ta is the aging temperature (.degree.C.), and Tcc is the cold crystallization temperature (.degree.C.) as determined by differential thermal analysis at a rate of temperature increase of 10.degree. C./min.
    Type: Grant
    Filed: October 4, 1991
    Date of Patent: February 2, 1993
    Assignee: Polyplastics Co., Ltd.
    Inventors: Kuniaki Kawaguichi, Toshio Nakane, Akihide Shimoda, Kenji Hijikata