Abstract: A silicon wafer obtained by etching by not less than 5 ?m and not more than 25 ?m per surface on either side a surface of crystalline silicon obtained by cutting a silicon crystal ingot, the silicon wafer having a surface with a facet having a width of not less than 10 ?m and not more than 150 ?m, and a semiconductor device having an electrode at that surface, are provided. Furthermore, a method for producing the silicon wafer and a method for producing the semiconductor device that include the step of etching a surface of the crystalline silicon with an aqueous solution of sodium hydroxide having a sodium hydroxide concentration of not less than 20% by mass and not more than 35% by mass by not less than 5 ?m and not more than 25 ?m per surface on either side, are also provided.

Abstract: A solar cell includes a semiconductor substrate having a first main surface. On the first main surface, a bus bar electrode and a plurality of linear finger electrodes extending from the bus bar electrode are provided. The bus bar electrode includes a first connecting portion to be connected to an interconnector and a first non-connecting portion without connected to the interconnector. The first connecting portion and the first non-connecting portion are alternately arranged. An interconnector-equipped solar cell, a solar cell string and a solar cell module use this solar cell.