Abstract: According to one embodiment, a method for generating a droplet recipe used in imprint lithography includes acquiring feature data for a pattern shape that has been formed on a template. The feature data is acquired by measuring the pattern shape of a pattern that has been formed on the template. A dispensing amount for resin to be dispensed on a substrate for filling of the pattern of the template during imprinting of the pattern of the template on the substrate is calculated, based on the acquired feature data. A dispensing amount for resin corresponding to a target thickness of a residual film formed on the substrate during the imprinting of the pattern of the template on the substrate is also calculated. A droplet recipe for dispensing of resin during imprinting of the pattern of the template is then generated based on the calculated dispensing amounts.

Abstract: A method of manufacturing a template, includes: covering a part of a first region of a substrate; processing another part of the first region to form a first pattern including a protrusion; covering the first region; and processing at least part of a second region of the substrate to form a second pattern including a depression.

Abstract: A mask inspection system 10 inspects an inspection object pattern while comparing an inspection object data obtained in such a way as to image the inspection object pattern with a reference pattern data. The mask inspection system 10 is provided with an inspection information preparing part 12 producing inspection algorithm and inspection sensitivity to the reference pattern data based on wafer simulation, a converting part 13 generating a reference graphic data with inspection information while adding the inspection information to the reference graphic data, and a defect judging part 16 judges propriety of an inspection object pattern data while comparing reference graphic data with an inspection object data in every pixel based on the inspection information added to the reference graphic data with inspection information.

Abstract: A mask inspection system 10 inspects an inspection object pattern while comparing an inspection object data obtained in such a way as to image the inspection object pattern with a reference pattern data. The mask inspection system 10 is provided with an inspection information preparing part 12 producing inspection algorithm and inspection sensitivity to the reference pattern data based on wafer simulation, a converting part 13 generating a reference graphic data with inspection information while adding the inspection information to the reference graphic data, and a defect judging part 16 judges propriety of an inspection object pattern data while comparing reference graphic data with an inspection object data in every pixel based on the inspection information added to the reference graphic data with inspection information.

Abstract: A pattern test device has a reference data generator for generating reference pattern data and setting a first sub-area or a second sub-area in a mask area depending on the accuracy for the pattern test. A threshold selecting section selects first or second threshold depending on the test location residing in the first sub-area or second sub-area, whereby the judgement section judges presence or absence of a defect in the mask area while using the first or second threshold to compare therewith difference data between the test pattern data and the reference pattern data.

Abstract: A pattern test device has a reference data generator for generating reference pattern data and setting a first sub-area or a second sub-area in a mask area depending on the accuracy for the pattern test- A threshold selecting section selects first or second threshold depending on the test location residing in the first sub-area or second sub-area, whereby the judgement section judges presence or absence of a defect in the mask area while using the first or second threshold to compare therewith difference data between the test pattern data and the reference pattern data.

Abstract: A signal to be measured is waveform-formatted to a square waveform that retains the frequency, duty ratio and jitter component of the original signal, and the leading (or trailing) edge of the waveform-formatted output is sampled by a sampling clock of a frequency slightly different from 1/N of the frequency fM of the signal to be measured. The samples are converted by an A/D converter to digital data Vn(t), which is stored in a memory. The difference between the stored digital data Vn(t) and the rise-up characteristic line V′(t) is calculated to detect jitter J′n(t).

Abstract: A signal to be measured is waveform-formatted to a square waveform that retains the frequency, duty ratio and jitter component of the original signal, and the leading (or trailing) edge of the waveform-formatted output is sampled by a sampling clock of a frequency slightly different from 1/N of the frequency fM of the signal to be measured. The samples are converted by an A/D converter to digital data Vn(t), which is stored in a memory. The difference between the stored digital data Vn(t) and the rise-up characteristic line V′(t) is calculated to detect jitter J′n(t).