Abstract: A non-transitory, computer-readable recording medium having stored therein a program for causing a computer to execute a process that includes: obtaining a heat generation amount of a component via an interface; calculating a unit heat-generation amount using the heat-generation amount of a component, and a unit size that is one of a volume of the component and a surface area of the component, the unit heat-generation amount being the heat-generation amount per the unit size; determining whether the unit heat-generation amount is greater than a threshold value; and causing an output device to output a signal for indicating that consideration of heat dissipation measures is desired for the component for which the unit heat-generation amount is determined to be greater than the threshold value.

Abstract: An electronic device includes a board having a first surface on which a heating element is mounted, a heat sink plate disposed to face the first surface of the board, and a heat pipe disposed between the board and the heat sink plate such that one end of the heat pipe is disposed at a position where the one end is in contact with the heating element, and the other end of the heat pipe is disposed to be in contact with the heat sink plate, wherein the heat sink plate has a stacking structure of a first heat sink plate of which a front surface faces the board, and a second heat sink plate disposed on a rear surface of the heat sink plate, and a through hole is formed at a position on the first heat sink plate.

Abstract: An electronic device includes a board having a first surface on which a heating element is mounted, a heat sink plate disposed to face the first surface of the board, and a heat pipe disposed between the board and the heat sink plate such that one end of the heat pipe is disposed at a position where the one end is in contact with the heating element, and the other end of the heat pipe is disposed to be in contact with the heat sink plate, wherein the heat sink plate has a stacking structure of a first heat sink plate of which a front surface faces the board, and a second heat sink plate disposed on a rear surface of the heat sink plate, and a through hole is formed at a position on the first heat sink plate.

Abstract: A disclosed setting method includes: in response to an instruction to replace a first component with a second component, determining whether or not data that correlates a surface of the first component with a surface of a third component has been set; upon determining that the data that correlates the surface of the first component with the surface of the third component has been set, extracting a surface of the second component, which corresponds to the surface of the first component; and correlating the extracted surface of the second component with the surface of the third component instead of the surface of the first component in the data.

Abstract: A mesh number prediction method obtains a mesh length for a case in which a mesh having an arbitrary shape is created by approximating an entire analyzing target by a three-dimensional (3D) mesh model based on data of a 3D surface model of the analyzing target, obtains a mesh number of each part forming the analyzing target for a case in which a mesh having an arbitrary shape is created by approximating each part by a 3D mesh model based on the mesh length, and obtains a predicted total mesh number of the entire analyzing target from a ratio of volumes of the entire analyzing target and each part based on the mesh number.

Abstract: A disclosed setting method includes: in response to an instruction to replace a first component with a second component, determining whether or not data that correlates a surface of the first component with a surface of a third component has been set; upon determining that the data that correlates the surface of the first component with the surface of the third component has been set, extracting a surface of the second component, which corresponds to the surface of the first component; and correlating the extracted surface of the second component with the surface of the third component instead of the surface of the first component in the data.

Abstract: A mesh number prediction method obtains a mesh length for a case in which a mesh having an arbitrary shape is created by approximating an entire analyzing target by a three-dimensional (3D) mesh model based on data of a 3D surface model of the analyzing target, obtains a mesh number of each part forming the analyzing target for a case in which a mesh having an arbitrary shape is created by approximating each part by a 3D mesh model based on the mesh length, and obtains a predicted total mesh number of the entire analyzing target from a ratio of volumes of the entire analyzing target and each part based on the mesh number.

Abstract: A magnet unit for a magnetron sputtering system includes a base plate and a plurality of magnet parts each including a first magnet and a first supporting member. The first supporting member supports the first magnet and fixes the first magnet to the base plate. The magnet parts confine a plasma.

Abstract: According to an aspect of an embodiment, a magnet unit for a magnetron sputtering system includes a base board, an inner magnet fixed to the base board and an outer magnet fixed to the base board. The outer magnet is fixed surround the inner magnet. At least one of a portion of the inner magnet or a portion of the outer magnet is displaceable on the base board.

Abstract: A magnet unit for a magnetron sputtering system includes a base plate and a plurality of magnet parts each including a first magnet and a first supporting member. The first supporting member supports the first magnet and fixes the first magnet to the base plate. The magnet parts confine a plasma.

Abstract: According to an aspect of an embodiment, a magnetron sputtering apparatus sputtering a target by a plasma includes a plurality of magnets that are arranged in the vicinity of a position where the target is disposed. The plurality of magnets form a magnetic field for confining the plasma; and a rotating mechanism rotates the plurality of magnets around a rotation center.

Abstract: A static magnetic field structure data is read, a cross section which is parallel with the target surface and in which plasma is generated is specified at an arbitrary position, and an erosion center line segment having an endless shape which goes through the center of a region in which the magnetic field vertical to the plane of the specified cross section is zero is calculated. The static erosion rate distribution in the specified cross section of the magnetic field structure data is calculated based on the erosion rate of the erosion center line segment, the rotational erosion rate distribution caused along with rotation of the magnet is calculated, and the film formation rate distribution on the objective material is calculated by using the rotational erosion rate distribution.

Abstract: In a semiconductor device cooling apparatus which cools a semiconductor device uniformly with a simple structure, a coolant is supplied from a supply port to the center of a heat transmission plate on which a semiconductor device is disposed in intimate contact therewith, is radially flown toward the peripheral edge portion of the heat transmission plate through a gap-shaped flow path which is formed by a gap forming plate composed of two thin plate members of a gap interval plate acting as a spacer and a gap top plate disposed on the gap interval plate and has a small height, is collected by a collection groove formed around the peripheral edge portion, and is discharged from a discharge port.

Abstract: In a semiconductor device cooling apparatus which cools a semiconductor device uniformly with a simple structure, a coolant is supplied from a supply port to the center of a heat transmission plate on which a semiconductor device is disposed in intimate contact therewith, is radially flown toward the peripheral edge portion of the heat transmission plate through a gap-shaped flow path which is formed by a gap forming plate composed of two thin plate members of a gap interval plate acting as a spacer and a gap top plate disposed on the gap interval plate and has a small height, is collected by a collection groove formed around the peripheral edge portion, and is discharged from a discharge port.

Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

Abstract: A dehumidifier includes a circular rotor accommodating a humidity absorbing material, a disc member provided on each one of two circular end surfaces of the rotor and having a diameter identical to or greater than a diameter of the rotor, and a plurality of openings formed in the disc members, wherein the rotor rotates through a dehumidification zone and a recycle zone formed by a dividing plate disposed so as to project from each one of the disc members, the rotor circulating a first flow of air of relatively high humidity through the dehumidification zone so as to dehumidify and recycle the first flow of air, the rotor circulating a second flow of air of relatively low humidity through the recycle zone so as to dehumidify the humidity absorbing material. The openings in the disc members have an identical substantially fan shape and are disposed so as to radiate from a center of the disc member, thus exposing the humidity absorbing material accommodated therein.

Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

Abstract: A semiconductor element cooling apparatus adapted to cool at least one semiconductor element mounted on a circuit substrate. The semiconductor element cooling apparatus includes a first mechanism for generating a coolant flow by flowing a coolant over a top surface of the semiconductor element, and a second mechanism for obliquely obstructing the coolant flowing over the semiconductor element from an upstream side towards a downstream side of the coolant flow.

Abstract: In a cooling structure for cooling circuit element modules that are mounted on a circuit board and has heat sinks, there are provided a main duct to which the circuit element modules are connected, and a coolant supplying device which is connected to the main duct and supplies a coolant to the main duct.