Abstract: There is provided an information processing device determining necessity/non-necessity of adjustment of conditions for inspecting molding defects of a molded composition on a substrate the information processing device including: an image acquiring unit configured to acquire an image of the molded composition; an inspection unit configured to perform inspection of the molding defects from the image using a machine learning model; an information acquiring unit configured to acquire information relating to a molding defect of the composition on a reference substrate; and a determination unit configured to compare an inspection result acquired by inspecting the molding defects on the reference substrate using the inspection unit with the information relating to a molding defect of the composition that is acquired by the information acquiring unit and determine necessity/non-necessity of the adjustment of the conditions of the inspection based on a result of the comparison.

Abstract: An information processing apparatus includes an acquisition unit configured to acquire a plurality of time-series data indicating changes in output values of a plurality of sensors from a monitoring target including the plurality of sensors, a model generation unit configured to generate one model indicating a relationship between the plurality of time-series data from each of a plurality of periods in the plurality of time-series data, thereby generating a plurality of models respectively corresponding to the plurality of periods, and a detection unit configured to detect an abnormality of the monitoring target based on the plurality of models and the plurality of time-series data. The plurality of periods can include two periods partially overlapping each other.

Abstract: There is provided an information processing device determining necessitynon-necessity of adjustment of conditions for inspecting molding defects of a molded composition on a substrate the information processing device including: an image acquiring unit configured to acquire an image of the molded composition; apt inspection unit configured to perform inspection of the molding defects from the image using a machine learning model; an information acquiring unit configured to acquire information relating to a molding defect of the composition on a reference substrate; and a determination, unit configured to compare an inspection result acquired by inspecting the molding defects on the reference substrate using the inspection unit with the information relating to a molding defect of the composition that is acquired by the information acquiring, unit and determine necessity/non-necessity of the adjustment of the conditions of the inspection based on a result of the comparison,

Abstract: The present invention provides a method of obtaining a position of a second shot region next to a first shot region, out of a plurality of shot regions formed on a substrate, comprising a first detection step of detecting a position of a first mark arranged in the first shot region, a second detection step of detecting a position of a mark more distant from the first mark, out of a second mark and a third mark arranged in the second shot region, and a determination step of determining the position of the second shot region based on a detection result in the first detection step and a detection result in the second detection step.

Abstract: Provided is a lithography apparatus that includes a plurality of patterning devices each of which is configured to perform patterning for a substrate supplied from a preprocessing apparatus; and a controller configured to control the plurality of patterning devices such that a plurality of substrates respectively belonging to a plurality of lots is subjected to parallel processings by the plurality of patterning devices based on a plurality of recipe information respectively corresponding to the plurality of lots, and transmit information regarding a schedule of the parallel processings to the preprocessing apparatus.

Abstract: Provided is a lithography apparatus that includes a plurality of patterning devices each of which is configured to perform patterning for a substrate supplied from a preprocessing apparatus; and a controller configured to control the plurality of patterning devices such that a plurality of substrates respectively belonging to a plurality of lots is subjected to parallel processings by the plurality of patterning devices based on a plurality of recipe information respectively corresponding to the plurality of lots, and transmit information regarding a schedule of the parallel processings to the preprocessing apparatus.

Abstract: Provided is a lithography apparatus that includes a plurality of patterning devices each of which is configured to perform patterning for a substrate supplied from a preprocessing apparatus; and a controller configured to control the plurality of patterning devices such that a plurality of substrates respectively belonging to a plurality of lots is subjected to parallel processings by the plurality of patterning devices based on a plurality of recipe information respectively corresponding to the plurality of lots, and transmit information regarding a schedule of the parallel processings to the preprocessing apparatus.

Abstract: A method of performing patterning of a substrate includes: obtaining, based on first alignment measurement with respect to first patterning, a first compensation value for second alignment measurement, with respect to the first patterning, in which number of alignment marks to be measured is smaller than number of alignment marks to be measured in the first alignment measurement; performing the second alignment measurement with respect to second patterning different from the first patterning; generating, based on a condition with respect to the second patterning and the first compensation value, a second compensation value for the second alignment measurement; and performing the second patterning of a substrate based on the second alignment measurement and the second compensation value.

Abstract: A method of performing patterning of a substrate includes: obtaining, based on first alignment measurement with respect to first patterning, a first compensation value for second alignment measurement, with respect to the first patterning, in which number of alignment marks to be measured is smaller than number of alignment marks to be measured in the first alignment measurement; performing the second alignment measurement with respect to second patterning different from the first patterning; generating, based on a condition with respect to the second patterning and the first compensation value, a second compensation value for the second alignment measurement; and performing the second patterning of a substrate based on the second alignment measurement and the second compensation value.

Abstract: The present invention provides a method of obtaining a position of a second shot region next to a first shot region, out of a plurality of shot regions formed on a substrate, comprising a first detection step of detecting a position of a first mark arranged in the first shot region, a second detection step of detecting a position of a mark more distant from the first mark, out of a second mark and a third mark arranged in the second shot region, and a determination step of determining the position of the second shot region based on a detection result in the first detection step and a detection result in the second detection step.

Abstract: Provided is a lithography apparatus that includes a plurality of patterning devices each of which is configured to perform patterning for a substrate supplied from a preprocessing apparatus; and a controller configured to control the plurality of patterning devices such that a plurality of substrates respectively belonging to a plurality of lots is subjected to parallel processings by the plurality of patterning devices based on a plurality of recipe information respectively corresponding to the plurality of lots, and transmit information regarding a schedule of the parallel processings to the preprocessing apparatus.