Patents by Inventor Akihiko Nakagawa

Akihiko Nakagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110086582
    Abstract: An annular retaining groove is formed on the inner circumferential portion of the disk-shaped rotating tool, and a ringlike cushioning member is fitted in this annular retaining groove so as to be partially exposed. Both sides of the inner circumferential portion of the disk-shaped rotating tool are held by first and second holding members through the annular cushioning member. An axial portion of the first holding member is engaged with an output shaft of an electric rotary machine so that the disk-shaped rotating tool is rotated through the first holding member by the output shaft.
    Type: Application
    Filed: June 10, 2010
    Publication date: April 14, 2011
    Inventors: Sokichi Takemura, Akihiko Nakagawa
  • Patent number: 7603999
    Abstract: A metal bonded drilling and boring tool which can prevent the separation of abrasive grains during drilling and boring to maintain a stable working performance for a long period of time without the need for tool exchange. The tool includes a rod-shaped body having a substantially semispherical front end portion and numerous abrasive grains bonded to an outer circumferential surface of the rod-shaped body at the front end portion and at a portion having a given length from the front end portion by a bond member formed primarily of copper alloy. The bond member contains a material selected from the group consisting of Ti, Al, and a mixture thereof. The copper alloy is selected from the group consisting of bronze containing 10 to 33 wt % of Sn, brass containing 5 to 20 wt % of Zn, and aluminum bronze containing 5 to 20 wt % of Al.
    Type: Grant
    Filed: December 28, 2004
    Date of Patent: October 20, 2009
    Assignee: Tenryu Seiko Kabushiki Kaisha
    Inventors: Sokichi Takemura, Yoshikazu Kusachi, Akihiko Nakagawa
  • Publication number: 20050155593
    Abstract: A metal bonded drilling and boring tool which can prevent the separation of abrasive grains during drilling and boring to maintain a stable working performance for a long period of time without the need for tool exchange. The tool includes a rod-shaped body having a substantially semispherical front end portion and numerous abrasive grains bonded to an outer circumferential surface of the rod-shaped body at the front end portion and at a portion having a given length from the front end portion by a bond member formed primarily of copper alloy. The bond member contains a material selected from the group consisting of Ti, Al, and a mixture thereof. The copper alloy is selected from the group consisting of bronze containing 10 to 33 wt % of Sn, brass containing 5 to 20 wt % of Zn, and aluminum bronze containing 5 to 20 wt % of Al.
    Type: Application
    Filed: December 28, 2004
    Publication date: July 21, 2005
    Inventors: Sokichi Takemura, Yoshikazu Kusachi, Akihiko Nakagawa
  • Patent number: 6851418
    Abstract: A metal bonded drilling and boring tool which can prevent the separation of abrasive grains during drilling and boring to maintain a stable working performance for a long period of time without the need for tool exchange. The tool includes a rod-shaped body having a substantially semispherical front end portion and numerous abrasive grains bonded to an outer circumferential surface of the rod-shaped body at the front end portion and at a portion having a given length from the front end portion by a bond member formed primarily of copper alloy. The bond member contains a material selected from the group consisting of Ti, Al, and a mixture thereof. The copper alloy is selected from the group consisting of bronze containing 10 to 33 wt % of Sn, brass containing 5 to 20 wt % of Zn, and aluminum bronze containing 5 to 20 wt % of Al.
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: February 8, 2005
    Assignee: Tenryu Seikyo Kabushiki Kaisha
    Inventors: Sokichi Takemura, Yoshikazu Kusachi, Akihiko Nakagawa
  • Patent number: 6620522
    Abstract: A metal bonded drilling tool which is improved in grinding performance with a long life and can drill a hole in a dry condition without the need for water. The metal bonded drilling tool includes a cylindrical body having an open front end portion, a shank integral with the cylindrical body and having a threaded hole for use in mounting the tool to a rotary tool, and numerous abrasive grains bonded to a front edge of the cylindrical body and to inner and outer cylindrical surfaces of the front end portion of the cylindrical body by a bond member formed primarily of copper alloy.
    Type: Grant
    Filed: September 26, 2001
    Date of Patent: September 16, 2003
    Assignee: Tenryu Seikyo Kabushiki Kaisha
    Inventors: Yoshikazu Kusachi, Akihiko Nakagawa
  • Publication number: 20020073813
    Abstract: A metal bonded drilling and boring tool which can prevent the separation of abrasive grains during drilling and boring to maintain a stable working performance for a long period of time without the need for tool exchange. The tool includes a rod-shaped body having a substantially semispherical front end portion and numerous abrasive grains bonded to an outer circumferential surface of the rod-shaped body at the front end portion and at a portion having a given length from the front end portion by a bond member formed primarily of copper alloy. The bond member contains a material selected from the group consisting of Ti, Al, and a mixture thereof. The copper alloy is selected from the group consisting of bronze containing 10 to 33 wt % of Sn, brass containing 5 to 20 wt % of Zn, and aluminum bronze containing 5 to 20 wt % of Al.
    Type: Application
    Filed: December 13, 2001
    Publication date: June 20, 2002
    Applicant: TENRYU SEIKYO KABUSHIKI KAISHA
    Inventors: Sokichi Takemura, Yoshikazu Kusachi, Akihiko Nakagawa
  • Patent number: 6391903
    Abstract: Compounds of the following formula (I) and pharmaceutically acceptable esters and salts thereof: Ar is a phenyl group which may optionally be substituted by from 1 to 3 substituents selected from the group consisting of halogen atoms and trifluoromethyl groups. Said compounds (and pharmaceutically acceptable esters and salts thereof) have excellent antifungal activity.
    Type: Grant
    Filed: September 6, 2000
    Date of Patent: May 21, 2002
    Assignee: Sankyo Company, Limited
    Inventors: Toshiyuki Konosu, Sadao Oida, Makoto Mori, Takuya Uchida, Satoshi Ohya, Akihiko Nakagawa
  • Publication number: 20020035890
    Abstract: A metal bonded drilling tool which is improved in grinding performance with a long life and can drill a hole in a dry condition without the need for water. The metal bonded drilling tool includes a cylindrical body having an open front end portion, a shank integral with the cylindrical body and having a threaded hole for use in mounting the tool to a rotary tool, and numerous abrasive grains bonded to a front edge of the cylindrical body and to inner and outer cylindrical surfaces of the front end portion of the cylindrical body by a bond member formed primarily of copper alloy.
    Type: Application
    Filed: September 26, 2001
    Publication date: March 28, 2002
    Applicant: Tenryu Seikyo Kabushiki Kaisha
    Inventors: Yoshikazu Kusachi, Akihiko Nakagawa
  • Patent number: 6337403
    Abstract: Compounds of the following formula (I) and pharmaceutically acceptable esters and salts thereof: Ar is a phenyl group which may optionally be substituted by from 1 to 3 substituents selected from the group consisting of halogen atoms and trifluoromethyl groups. The compounds (and pharmaceutically acceptable esters and salts thereof) have excellent antifungal activity.
    Type: Grant
    Filed: June 1, 2001
    Date of Patent: January 8, 2002
    Assignee: Sankyo Company, Limited
    Inventors: Toshiyuki Konosu, Sadao Oida, Makoto Mori, Takuya Uchida, Satoshi Ohya, Akihiko Nakagawa