Patents by Inventor Akihiko Nakamura
Akihiko Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250084092Abstract: An object of the present invention is to provide a pharmaceutical composition, in particular, a compound suitable for preventing and/or treating inflammatory diseases and/or neurodegenerative disease. The present inventors have conducted intensive studies to find a compound having an inhibitory effect on NLRP3 inflammasome activation and found that an annulated pyridazine compound has an inhibitory effect on NLRP3 inflammasome activation, thus completing the present invention. The annulated pyridazine compound of the present invention is expected to serve as a prophylactic and/or therapeutic agent for inflammatory diseases and/or neurodegenerative diseases.Type: ApplicationFiled: July 20, 2022Publication date: March 13, 2025Inventors: Yusuke Inagaki, Takuya Washio, Yuka Koizumi, Hiroki Toya, Yumi Yamashita, Ikumi Kuriwaki, Junko Maeda, Takanori Koike, Takashi Kamikubo, Susumu Yamaki, Kazuyuki Kuramoto, Kengo Saba, Hiroshi Tomiyama, Yoshinori Iwai, Akihiko Nakamura
-
Publication number: 20250071229Abstract: An image processing apparatus obtains image data that is defined as a first color gamut, transforms the image data into image data that is defined as a second color gamut, using color transformation information, and when, as a result of transformation, a first pair of color values included in the image data is transformed into a second pair of color values that have a color difference that is not perceived as different colors, generates second color transformation information such that the first pair of color values is transformed into a third pair of color values that have a color difference that is perceived as different colors as a result of transformation using the second color transformation information. A saturation difference of the third pair of color values is larger than a saturation difference of the second pair of color values.Type: ApplicationFiled: November 8, 2024Publication date: February 27, 2025Inventors: TAKASHI NAKAMURA, KOUTA MURASAWA, AKITOSHI YAMADA, AKIHIKO NAKATANI, HIDETSUGU KAGAWA
-
Publication number: 20250062272Abstract: A semiconductor module, including: a stacked substrate, which includes an insulating plate, and a plurality of circuit boards formed on an upper surface of the insulating plate; a semiconductor element formed on an upper surface of one of the plurality of circuit boards; and a metal wiring board formed on an upper surface of the semiconductor element. The metal wiring board has a plate-shaped bonding portion bonded to the upper surface of the semiconductor element via a bonding material. The plate-shaped bonding portion has a plurality of recessed portions formed on an upper surface thereof, each recessed portion is of a hexagonal shape in a plan view of the semiconductor module.Type: ApplicationFiled: October 31, 2024Publication date: February 20, 2025Applicant: FUJI ELECTRIC CO., LTD.Inventors: Tsubasa WATAKABE, Akihiko IWAYA, Yoko NAKAMURA, Yuta TAMAI, Mai SAITO
-
Publication number: 20250062271Abstract: A semiconductor module, including: a stacked substrate including a plurality of circuit boards formed on an upper surface of an insulating plate; a semiconductor element formed on an upper surface of one of the plurality of circuit boards; and a metal wiring board formed on an upper surface of the semiconductor element. The metal wiring board has a bonding portion bonded to the upper surface of the semiconductor element via a bonding material. The bonding portion includes a plate-shaped portion having an upper surface and a lower surface. The plate-shaped portion has a roughened region in which a plurality of recessed portions are formed on the upper surface of the plate-shaped portion. The plurality of recessed portions include a plurality of first recessed portions that each has a peeling suppressing portion protruding inward to thereby narrow a width of each first recessed portion.Type: ApplicationFiled: October 31, 2024Publication date: February 20, 2025Applicant: FUJI ELECTRIC CO., LTD.Inventors: Yoko NAKAMURA, Akihiko IWAYA, Mai SAITO, Tsubasa WATAKABE
-
Patent number: 12227517Abstract: A compound useful as an active ingredient of a pharmaceutical composition for treatment of cancer related to activation of immune cells or cancer having resistance to anti-PD-1 antibody/anti-PD-L1 antibody therapy is provided. The present inventors have conducted studies on a compound useful as an active ingredient of a pharmaceutical composition for treatment of cancer related to activation of immune cells or cancer having resistance to anti-PD-1 antibody/anti-PD-L1 antibody therapy, and found that a pyridazinyl-thiazolecarboxamide compound has DGK ? (DGKzeta) inhibitory effect, leading to completion of the present invention. The pyridazinyl-thiazolecarboxamide compound of the present invention has DGK ? inhibitory effect, and can be used as a therapeutic agent for treatment of cancer related to activation of immune cells or cancer having resistance to anti-PD-1 antibody/anti-PD-L1 antibody therapy.Type: GrantFiled: December 24, 2020Date of Patent: February 18, 2025Assignees: Astellas Pharma Inc., KOTOBUKI PHARMACEUTICAL CO., LTD.Inventors: Hideyuki Watanabe, Yohei Seki, Keiichiro Okuyama, Kazuo Kurosawa, Osamu Ikeda, Hiroshi Tomiyama, Yoshinori Iwai, Akihiko Nakamura, Kozo Miyasaka
-
Publication number: 20250054899Abstract: A semiconductor module, including: a stacked substrate including a plurality of circuit boards formed on an upper surface of an insulating plate; a semiconductor element formed on an upper surface of one of the plurality of circuit boards; and a metal wiring board formed on an upper surface of the semiconductor element. The metal wiring board has a bonding portion bonded to the upper surface of the semiconductor element via a bonding material. The bonding portion includes a plate-shaped portion having an upper surface and a lower surface. The plate-shaped portion has a roughened region in which a plurality of recessed portions are formed on the upper surface thereof. The plurality of recessed portions include a plurality of kinds, each kind differing in at least one of a size, a shape, and a depth of the recess portions therein from another kind.Type: ApplicationFiled: October 31, 2024Publication date: February 13, 2025Applicant: FUJI ELECTRIC CO., LTD.Inventors: Yuta TAMAI, Akihiko IWAYA, Mai SAITO, Tsubasa WATAKABE, Yoko NAKAMURA
-
Publication number: 20250054897Abstract: A semiconductor module includes a stacked substrate in which a plurality of circuit boards are arranged on an upper surface of an insulating plate, a semiconductor element arranged on an upper surface of at least one of the circuit boards, and a metal wiring board arranged on an upper surface of the semiconductor element. The metal wiring board has a first bonding portion bonded to the upper surface of the semiconductor element via a bonding material. The first bonding portion includes a plate-shaped portion having an upper surface and a lower surface, and at least one groove is provided along an outer periphery of the first bonding portion on the upper surface of the plate-shaped portion.Type: ApplicationFiled: October 31, 2024Publication date: February 13, 2025Applicant: FUJI ELECTRIC CO., LTD.Inventors: Mai SAITO, Yoko NAKAMURA, Tsubasa WATAKABE, Akihiko IWAYA
-
Patent number: 12202385Abstract: The present invention pertains to a seat slide device having: a lower rail fixed above a floor and extending in one direction; an upper rail connected to a seat and capable of moving along the lower rail; a drive pulley connected to a drive source and attached to the seat or the upper rail; an ended belt wound on the drive pulley so that one surface contacts the drive pulley, both ends of the ended belt being fixed to the floor or the lower rail; and a first and second pressing member attached to a position on the floor side of the seat or the upper rail closer than the drive pulley, each pressing member contacting the other surface of the ended belt, and the first pressing member, the drive pulley, and the second pressing member being disposed in the stated order along the one direction.Type: GrantFiled: April 24, 2019Date of Patent: January 21, 2025Assignees: Mitsuboshi Belting Ltd., Toyota Body Seiko Co., Ltd.Inventors: Akihiko Motozaki, Susumu Osaki, Motohisa Nakamura, Shin Shiraki, Takayuki Ogasawara
-
Publication number: 20250022833Abstract: A semiconductor module, including: a circuit board including a semiconductor element; a lead bonded to an electrode of the semiconductor element by a bonding material; and a sealing material sealing the semiconductor element and the lead. The lead includes: a bonding portion bonded to the electrode, and a roughening recess formed on an upper surface of the bonding portion. The roughening recess includes: a main recess having a first wall surfaces and a second wall surface opposite to each other, and a barbed portion formed on the first wall surface and protruding toward the second wall surface, and a sub-recess having: a center, which is located, in a plan view of the semiconductor module, outside the main recess and at a position away from the first wall surface by a predetermined distance, and an inclined surface that becomes shallower from the center toward an opening end of the main recess.Type: ApplicationFiled: September 30, 2024Publication date: January 16, 2025Applicant: FUJI ELECTRIC CO., LTD.Inventors: Yoko NAKAMURA, Akihiko IWAYA, Mai SAITO, Tsubasa WATAKABE, Yuta TAMAI
-
Publication number: 20250022832Abstract: A semiconductor module, including: a circuit board including a semiconductor element having an electrode on an upper surface thereof; a lead bonded to the electrode by a bonding material; and a sealing material that seals the semiconductor element and the lead. The lead includes: a bonding portion bonded to the electrode, the bonding portion having a lower surface facing the electrode, and an upper surface opposite to the lower surface, and a plurality of recesses formed on the upper surface of the bonding portion. In a plan view of the semiconductor module, the bonding portion has a plurality of sides, and each recess has a bottom surface of a planar shape, the planar shape having a side extending in a direction that is not orthogonal to any of the sides of the bonding portion. Each of the recesses a barbed portion protruding from a wall surface thereof.Type: ApplicationFiled: September 30, 2024Publication date: January 16, 2025Applicant: FUJI ELECTRIC CO., LTD.Inventors: Tsubasa WATAKABE, Akihiko IWAYA, Yoko NAKAMURA, Yuta TAMAI, Mai SAITO
-
Patent number: 12116381Abstract: From the viewpoint of a decrease in environmental impact in recent years, an object of the present invention is to effectively utilize lignin as a circulative biomass resource having high effect of reducing environmental impact. Specifically, the object is to provide a lignin derivative that can improve the dispersibility of various substances to be dispersed regardless of uses of cements, dyes, oil field drilling mud, and the like. The present invention provides a lignin derivative compound that is a reaction product of a lignin sulfonic acid-based compound with an aromatic water-soluble compound, and a dispersant containing the same. The lignin derivative compound preferably has an anionic functional group and/or a polyalkylene oxide chain.Type: GrantFiled: August 24, 2018Date of Patent: October 15, 2024Assignee: NIPPON PAPER INDUSTRIES CO., LTD.Inventors: Takuma Nakamura, Akihiko Nakamura, Sumio Tamura, Kanae Takahashi, Yoshito Nishimori
-
Patent number: 12109584Abstract: A rectifying device including a first flow channel member provided between an inner peripheral wall and an outer peripheral wall; a second flow channel member provided upstream of the first flow channel in a flowing direction of the fluid and being connected with the first flow channel along an entire circumference. The device includes an inflow section at the second flow channel member for fluid to flow into a circumferential area of the second flow channel; a first guide wall in the second flow channel at a position away from the inflow section in a circumferential direction and to guide the fluid flowing toward a first side in the circumferential direction through the second flow channel toward the first flow channel; and a second guide wall in the second flow channel adjacent the first guide wall in the circumferential direction.Type: GrantFiled: April 15, 2022Date of Patent: October 8, 2024Assignee: FUJIFILM Business Innovation Corp.Inventors: Akihiko Nakamura, Takaakira Sasaki
-
Patent number: 12077519Abstract: A compound useful as an active ingredient of a pharmaceutical composition for treatment of cancer related to activation of immune cells or cancer resistant to anti-PD-1 antibody/anti-PD-L1 antibody therapy is provided. The present inventors have conducted studies on a compound useful as an active ingredient of a pharmaceutical composition for treatment of cancer related to activation of immune cells or cancer resistant to anti-PD-1 antibody/anti-PD-L1 antibody therapy, and confirmed that a heteroaryl carboxamide compound has DGK ? (DGKzeta) inhibitory effect, leading to completion of the present invention. The heteroaryl carboxamide compound of the present invention has DGK ? inhibitory effect, and can be used as a therapeutic agent for treatment of cancer related to activation of immune cells or cancer resistant to anti-PD-1 antibody/anti-PD-L1 antibody therapy.Type: GrantFiled: November 28, 2023Date of Patent: September 3, 2024Assignees: Astellas Pharma Inc., KOTOBUKI PHARMACEUTICAL CO., LTD.Inventors: Hideyuki Watanabe, Takashi Kamikubo, Akio Kamikawa, Takuya Washio, Yohei Seki, Keiichiro Okuyama, Osamu Ikeda, Hiroshi Tomiyama, Yoshinori Iwai, Akihiko Nakamura, Kozo Miyasaka
-
Patent number: 12059702Abstract: A coating device includes: a coating liquid holding part provided with an upper opening portion and a lower opening portion and holding a coating liquid that is supplied from a coating liquid supply part; and an annular body that is disposed inside the coating liquid holding part, through which a cylindrical body penetrating the upper opening portion and the lower opening portion of the coating liquid holding part penetrates, and in which the coating liquid held by the coating liquid holding part flows in from an upper side and flows out from a lower side with a relative movement to the cylindrical body, the annular body being installed to be relatively displaceable along an installation surface intersecting a direction of the relative movement with respect to the coating liquid holding part.Type: GrantFiled: April 5, 2022Date of Patent: August 13, 2024Assignee: FUJIFILM Business Innovation Corp.Inventors: Hiroaki Ogawa, Masaru Agatsuma, Hiroshi Kimura, Akihiko Nakamura, Takaakira Sasaki
-
Publication number: 20240239758Abstract: An object of the present invention is to provide a pharmaceutical composition, particularly a compound suitable for preventing and/or treating an inflammatory disease and/or a neurodegenerative disease. The present inventors accomplished the present invention by conducting intensive studies to find a compound having an inhibitory effect on NLRP3 inflammasome activation, with the result that a substituted triazine compound is found to have the inhibitory effect on NLRP3 inflammasome activation. The substituted triazine compound of the present invention is expected to serve as a preventive and/or therapeutic drug for an inflammatory disease and/or a neurodegenerative disease.Type: ApplicationFiled: April 27, 2022Publication date: July 18, 2024Inventors: Yusuke Inagaki, Yumi Yamashita, Hiroki Toya, Takuya Washio, Fumie Takahashi, Kengo Saba, Hiroshi Tomiyama, Yoshinori lwai, Akihiko Nakamura
-
Publication number: 20240101532Abstract: A compound useful as an active ingredient of a pharmaceutical composition for treatment of cancer related to activation of immune cells or cancer resistant to anti-PD-1 antibody/anti-PD-L1 antibody therapy is provided. The present inventors have conducted studies on a compound useful as an active ingredient of a pharmaceutical composition for treatment of cancer related to activation of immune cells or cancer resistant to anti-PD-1 antibody/anti-PD-L1 antibody therapy, and confirmed that a heteroaryl carboxamide compound has DGK ? (DGKzeta) inhibitory effect, leading to completion of the present invention. The heteroaryl carboxamide compound of the present invention has DGK ? inhibitory effect, and can be used as a therapeutic agent for treatment of cancer related to activation of immune cells or cancer resistant to anti-PD-1 antibody/anti-PD-L1 antibody therapy.Type: ApplicationFiled: November 28, 2023Publication date: March 28, 2024Inventors: Hideyuki Watanabe, Takashi Kamikubo, Akio Kamikawa, Takuya Washio, Yohei Seki, Keiichiro Okuyama, Osamu Ikeda, Hiroshi Tomiyama, Yoshinori Iwai, Akihiko Nakamura, Kozo Miyasaka
-
Publication number: 20240043403Abstract: A compound useful as an active ingredient of a pharmaceutical composition for treatment of cancer related to activation of immune cells or cancer resistant to anti-PD-1 antibody/anti-PD-L1 antibody therapy is provided. The present inventors have conducted studies on a compound useful as an active ingredient of a pharmaceutical composition for treatment of cancer related to activation of immune cells or cancer resistant to anti-PD-1 antibody/anti-PD-L1 antibody therapy, and confirmed that a heteroaryl carboxamide compound has DGK ? (DGKzeta) inhibitory effect, leading to completion of the present invention. The heteroaryl carboxamide compound of the present invention has DGK ? inhibitory effect, and can be used as a therapeutic agent for treatment of cancer related to activation of immune cells or cancer resistant to anti-PD-1 antibody/anti-PD-L1 antibody therapy.Type: ApplicationFiled: November 29, 2021Publication date: February 8, 2024Inventors: Hideyuki Watanabe, Takashi Kamikubo, Akio Kamikawa, Takuya Washio, Yohei Seki, Keiichiro Okuyama, Osamu Ikeda, Hiroshi Tomiyama, Yoshinori Iwai, Akihiko Nakamura, Kozo Miyasaka
-
Patent number: 11873443Abstract: A composition including: a lignin sulfonic acid-based compound and a water-soluble compound; a lignin derivative that is a reaction product of the lignin sulfonic acid-based compound with an aromatic water-soluble compound; or the lignin sulfonic acid-based compound, the water-soluble compound, and the lignin derivative. The composition is a granular product or a liquid product.Type: GrantFiled: August 8, 2019Date of Patent: January 16, 2024Assignee: NIPPON PAPER INDUSTRIES CO., LTD.Inventors: Akihiko Nakamura, Kanae Takahashi, Takuma Nakamura, Sumio Tamura, Tubasa Kanenaka
-
Publication number: 20220362794Abstract: A coating device includes: a coating liquid holding part provided with an upper opening portion and a lower opening portion and holding a coating liquid that is supplied from a coating liquid supply part; and an annular body that is disposed inside the coating liquid holding part, through which a cylindrical body penetrating the upper opening portion and the lower opening portion of the coating liquid holding part penetrates, and in which the coating liquid held by the coating liquid holding part flows in from an upper side and flows out from a lower side with a relative movement to the cylindrical body, the annular body being installed to be relatively displaceable along an installation surface intersecting a direction of the relative movement with respect to the coating liquid holding part.Type: ApplicationFiled: April 5, 2022Publication date: November 17, 2022Applicant: FUJIFILM Business Innovation Corp.Inventors: Hiroaki OGAWA, Masaru AGATSUMA, Hiroshi KIMURA, Akihiko NAKAMURA, Takaakira SASAKI
-
Publication number: 20220362795Abstract: A rectifying device includes: a first flow channel member that has an annular first flow channel through which a fluid flows in an axial direction, the first flow channel being provided between an inner peripheral wall and an outer peripheral wall; a second flow channel member that has a second flow channel between the inner peripheral wall and the outer peripheral wall, the second flow channel being provided upstream of the first flow channel in a flowing direction of the fluid and being connected with the first flow channel along an entire circumference; an inflow section that is provided at the second flow channel member and that allows the fluid to flow into a circumferential area of the second flow channel located away from the first flow channel in the axial direction; a first guide wall that is provided within the second flow channel at a position located away from the inflow section in a circumferential direction and that guides the fluid flowing toward a first side in the circumferential direction thType: ApplicationFiled: April 15, 2022Publication date: November 17, 2022Applicant: FUJIFILM Business Innovation Corp.Inventors: Akihiko NAKAMURA, Takaakira SASAKI