Abstract: A surface acoustic wave device which occupies a small mounting area and has a low profile, yet having an improved reliability, and can be made available at low cost. The surface acoustic wave device comprises a piezoelectric substrate, a function region formed of comb-like electrodes for exciting surface acoustic wave provided on a main surface of the piezoelectric substrate, a space formation member covering the function region, a plurality of bump electrodes provided on a main surface of the piezoelectric substrate and a terminal electrode provided opposed to the main surface of piezoelectric substrate. The bump electrode and the terminal electrode are having a direct electrical connection, and a space between piezoelectric substrate and terminal electrode is filled with resin.

Abstract: Concerns lithium-doped diamond: Low-resistivity n-type semiconductor diamond doped with lithium and nitrogen, and a method of manufacturing such diamond are provided. Low-resistivity n-type semiconductor diamond containing 1017 cm?3 or more of lithium atoms and nitrogen atoms together, in which are respectively doped lithium atoms into carbon-atom interstitial lattice sites, and nitrogen atoms into carbon-atom substitutional sites, with the lithium and the nitrogen holding arrangements that neighbor each other. To obtain low-resistivity n-type semiconductor diamond, in a method for the vapor synthesis of diamond, photodissociating source materials by photoexcitation utilizing vacuum ultraviolet light and irradiating a lithium source material with an excimer laser to scatter and supply lithium atoms enables the diamond to be produced.

Abstract: An n-type diamond epitaxial layer 20 is formed by processing a single-crystalline {100} diamond substrate 10 so as to form a {111} plane, and subsequently by causing diamond to epitaxially grow while n-doping the diamond {111} plane. Further, a combination of the n-type semiconductor diamond, p-type semiconductor diamond, and non-doped diamond, obtained in the above-described way, as well as the use of p-type single-crystalline {100} diamond substrate allow for a pn junction type, a pnp junction type, an npn junction type and a pin junction type semiconductor diamond to be obtained.

Abstract: The present invention relates to an electron emitting device having a structure for efficiently emitting electrons. The electron emitting device has a substrate comprised of an n-type diamond, and a pointed projection provided on the substrate. The projection comprises a base provided on the substrate side, and an electron emission portion provided on the base and emitting electrons from the tip thereof. The base is comprised of an n-type diamond. The electron emission portion is comprised of a p-type diamond. The length from the tip of the projection (electron emission portion) to the interface between the base and the electron emission portion is preferably 100 nm or less.

Abstract: An electronic component includes a substrate; a piezoelectric material layer supported directly or indirectly by the substrate; a first electrode arranged on a surface of the piezoelectric material layer on an opposite side of the substrate; and a second electrode arranged on a surface of the piezoelectric material layer on the substrate side. The piezoelectric material layer is sandwiched between the first electrode and the second electrode. The first electrode has a smaller surface area than the piezoelectric material layer. A portion where the piezoelectric material layer is exposed from the first electrode includes a portion that is thinner than a thickness of the piezoelectric material layer between the first electrode and the second electrode.

Abstract: A surface acoustic wave device which occupies a small mounting area and has a low profile, yet having an improved reliability, and can be made available at low cost. The surface acoustic wave device comprises a piezoelectric substrate 1, a function region 2 formed of comb-like electrodes for exciting surface acoustic wave provided on a main surface of the piezoelectric substrate 1, a space formation member 3 covering the function region 2, a plurality of bump electrodes 4 provided on a main surface of the piezoelectric substrate 1 and a terminal electrode 5 provided opposed to the main surface of piezoelectric substrate 1. The bump electrode 4 and the terminal electrode 5 are having a direct electrical connection, and a space between piezoelectric substrate 1 and terminal electrode 5 is filled with resin 6.

Abstract: A surface acoustic wave (SAW) device having improved moisture resistance is provided. The device includes a piezoelectric substrate, an interdigital transducer (IDT) electrode on a first surface of the piezoelectric substrate, and a resin coating for covering the IDT electrode. After a piece of resin material of the resin coating is dipped in an amount of pure water as solvent having a mass as 10 times great as the piece of resin material at 120° C.

Abstract: An electronic component includes a projection electrode to be bonded to a circuit board. The projection electrode is prevented from being contaminated or oxidized during a period from manufacturing of the electronic component until mounting of the component to the circuit board. Methods of manufacturing the electronic component and an electronic circuit device are also provided. The electronic component includes the projection electrode formed on a connection terminal on a substrate having a circuit element and a protective film for covering the circuit element and the projection electrode. The projection electrode is prevented from being contaminated or oxidized since the manufacturing of the electronic component until mounting thereof to the circuit board, and reliable bonding of the projection electrode to a connection terminal of the circuit board can be realized.

Abstract: A variable dot ink-jet printer having an ejection flow passage with a decrease in sectional area from an ejection port toward the interior of the flow passage and up to a boundary. A draw-in part draws an ink front position in the interior of the flow passage. A push-out part pushes out the ink front position outside the flow passage. When ejecting a small ink drop, the ink front position is drawn at a place having an increase in sectional area by the draw-in part. The ink is pushed outward by the push-out part at such a speed as to exit from an edge of an area of the boundary on the ejection port side.

Abstract: A liquid injection device has a liquid pressurizing chamber having one or a plurality of apertures, a liquid injection port provided at a part of the liquid pressurizing chamber, a liquid pressurizing member arranged adjacent to the liquid pressurizing chamber, a liquid passage arranged adjacent to the liquid pressurizing chamber; wherein within the aperture(s), a peripheral edge portion of the aperture(s) located at a position opposite to the liquid pressurizing member and the liquid pressurizing member are arranged to be apart from each other at a gap with a predetermined size; further wherein liquid is injected through the liquid injection port by driving the liquid pressurizing member to thereby pressurize the liquid supplied from the liquid passage into the liquid pressurizing chamber.

Abstract: An electronic component includes a projection electrode to be bonded to a circuit board. The projection electrode is prevented from being contaminated or oxidized during a period from manufacturing of the electronic component until mounting of the component to the circuit board. Methods of manufacturing the electronic component and an electronic circuit device are also provided. The electronic component includes the projection electrode formed on a connection terminal on a substrate having a circuit element and a protective film for covering the circuit element and the projection electrode. The projection electrode is prevented from being contaminated or oxidized since the manufacturing of the electronic component until mounting thereof to the circuit board, and reliable bonding of the projection electrode to a connection terminal of the circuit board can be realized.

Abstract: A liquid jetting apparatus has a concave casing having an opened flat face, and a piezoelectric drive element for at least partly sealing the opened flat face to form a liquid reservoir to store a liquid, such as ink. The reservoir has a liquid injection port for injecting a liquid and a liquid jet port for jetting the stored liquid. The piezoelectric drive element is directly bonded to the open flat face.

Abstract: Disclosed is a SAW element with a propagation substrate that is a piezoelectric substrate. An auxiliary substrate is laminated on one surface of the propagation substrate by way of direct bonding, and a comb-shaped electrode is formed on another surface of the propagation substrate that is opposite the surface with the auxiliary substrate. The electrode excites an acoustic wave. The propagation substrate and the auxiliary substrate are not bonded to each other in at least a region immediately below a region where the comb-shaped electrode is formed. A coefficient of thermal expansion in a propagation direction of the acoustic wave of the auxiliary substrate is smaller than a coefficient of thermal expansion in a propagation direction of the acoustic wave of the propagation substrate.

Abstract: A surface acoustic wave device has a main substrate; a comb-like electrode formed on one of the main surfaces of said main substrate; and a supplementary substrate joined with the other main surface of said main substrate, wherein said supplementary substrate has a smaller thermal expansion coefficient and a larger thickness than said main substrate.

Abstract: A piezoelectric device is manufactured by: (1) mirror finishing surfaces of a first substrate and a second substrate made of a piezoelectric element; (2) forming grooves on at least one of the two surfaces of the first and second substrates; (3) joining the mirror-finished surfaces of the first substrate and the second substrate; (4) applying heat to the joined substrates and bonding them; (5) forming an opening on the first substrate so that a part of the exposed areas of the second substrate is exposed through the opening; (6) forming piezoelectric devices by forming electrodes on at least one of the second substrate through the opening and a corresponding area to the exposed area on the rear side of the second substrate; and (7) dividing the bonded substrates into portions each having one of the piezoelectric devices. Through this manufacturing method, piezoelectric devices with high yield ratios and high reliability can be obtained.

Abstract: A method of manufacturing a composite substrate and the composite substrate manufactured thereby wherein surfaces of first and second substrates having different thermal expansion coefficients are mirror finished and layered on each other. A first heat treatment is applied after which a part of the second substrate is removed to a depth sufficient to expose the first substrate. A final second heat treatment directly bonds the substrates.

Abstract: A piezoelectric device is manufactured by: (1) mirror finishing surfaces of a first substrate and a second substrate made of a piezoelectric element; (2) forming grooves on at least one of the two surfaces of the first and second substrates; (3) joining the mirror-finished surfaces of the first substrate and the second substrate; (4) applying heat to the joined substrates and bonding them; (5) forming an opening on the first substrate so that a part of the exposed areas of the second substrate is exposed through the opening; (6) forming piezoelectric devices by forming electrodes on at least one of the second substrate through the opening and a corresponding area to the exposed area on the rear side of the second substrate; and (7) dividing the bonded substrates into portions each having one of the piezoelectric devices. Through this manufacturing method, piezoelectric devices with high yield ratios and high reliability can be obtained.

Abstract: A method of manufacturing a composite substrate and the composite substrate manufactured thereby wherein surfaces of first and second substrates having different thermal expansion coefficients are mirror finished and layered on each other. A first heat treatment is applied after which a part of the second substrate is removed to a depth sufficient to expose the first substrate. A final second heat treatment directly bonds the substrates.