Abstract: An ink contains a medium, a coloring agent, a fixing polymer, and one or more kinds of polymers other than the fixing polymer. The coloring agent is dissolved or dispersed in the medium. The fixing polymer has a glass-transition temperature higher than the ordinary temperature and is dispersed in the medium. The one or more kinds of polymers each have a glass-transition temperature higher than the ordinary temperature and are dissolved or dispersed in the medium. The fixing polymer is higher in glass-transition temperature than 80 mass % or more of the one or more kinds of polymers contained in the ink and each having a glass-transition temperature higher than the ordinary temperature.

Abstract: A printing apparatus includes an ink ejector, a dryer, and a melting device. The ink ejector ejects an ink to an object on which a printed record is to be produced. The ink contains a medium and a fixing polymer. The dryer heats the object to expedite evaporation of the medium. The melting device is configured to irradiate the ink on the object with ultraviolet rays to subject the ink to heat that causes the fixing polymer to melt and to fix the ink to the object accordingly.

Abstract: In a film with metal foil of the present invention, a metal foil is stuck to the surface of a resin film via an adhesive layer. The adhesive is formed by crosslinking an acrylic polymer obtained by the copolymerization of a (meth)acrylic acid ester with a carboxyl group-containing radically polymerizable monomer, with a polyfunctional compound having a functional group reactive with the carboxyl group. The film with metal foil is very useful for producing a multi-layer wiring board by the so-called transfer method. By using this film, there can be produced a multi-layer wiring board having a fine and highly dense wiring/circuit layer and having a very excellently flat surface.

Abstract: Disclosed is a multi-layer wiring board comprising insulating layers of a thermosetting resin having through-holes formed therein, conductor wiring layers buried in the surfaces of said insulating layers, and via-conductors formed by filling said through-holes with an electrically conducting paste, the via-conductors being electrically connected to said conductor wiring layers, wherein coupling layers comprising a silane coupling agent are formed in the interfaces between said conductor wiring layers and said via-conductors or said insulating layers. The multi-layer wiring board features an increased chemical affinity between the conductor wiring layer and the insulating layer, effectively suppressing the infiltration of water through the interface between the conductor wiring layer and the insulating layer or through the insulating resin, and effectively preventing deterioration in the properties under a high-temperature and high-humidity environment of an extended period of time.

Abstract: In a film with metal foil of the present invention, a metal foil is stuck to the surface of a resin film via an adhesive layer. The adhesive is formed by crosslinking an acrylic polymer obtained by the copolymerization of a (meth)acrylic acid ester with a carboxyl group-containing radically polymerizable monomer, with a polyfunctional compound having a functional group reactive with the carboxyl group. The film with metal foil is very useful for producing a multi-layer wiring board by the so-called transfer method. By using this film, there can be produced a multi-layer wiring board having a fine and highly dense wiring/circuit layer and having a very excellently flat surface.

Abstract: In a film with metal foil of the present invention, a metal foil is stuck to the surface of a resin film via an adhesive layer. The adhesive is formed by crosslinking an acrylic polymer obtained by the copolymerization of a (meth)acrylic acid ester with a carboxyl group-containing radically polymerizable monomer, with a polyfunctional compound having a functional group reactive with the carboxyl group. The film with metal foil is very useful for producing a multi-layer wiring board by the so-called transfer method. By using this film, there can be produced a multi-layer wiring board having a fine and highly dense wiring/circuit layer and having a very excellently flat surface.

Abstract: Wiring substrate including an insulating substrate made of glass ceramics and having Young's modulus of 120 GPa or less, and a wiring circuit layer made of a high-purity metal conductor in concentration of 99% by weight or more formed on the surface of the insulating substrate and/or inside thereof. This wiring substrate may be a multi-layer wiring substrate that has a plurality of wiring circuit layers. The wiring circuit layer is preferably made of a metal foil.

Abstract: A multilayer wiring board formed by laminating a plurality of circuit board units each including an insulating board containing at least a thermosetting resin, and a wiring circuit layer formed on the surface of said insulating board, wherein said insulating board is provided with via hole conducting passages so as to electrically connect the wiring circuit layers of the neighboring circuit board units, said via hole conducting passages are formed by filling via holes formed in the insulating board with a conducting paste, and said wiring circuit layer is buried in the surface of the insulating board in a manner that said insulating board possesses a flat surface. The multilayer wiring board has a satisfactory flatness required for mounting flip chips. Besides, the insulating board and the via hole conducting passages are not infiltrated by chemicals such as etching solution or plating solution.

Abstract: A steel slab containing not more than 0.005 wt % carbon, 1.0 to 4.0 wt % silicon, 0.1 to 1.0 wt % manganese, not more than 0.1 wt % phosphorus, not more than 0.005 wt % sulfur, and 0.1 to 2.0 wt % aluminum is directly sent to a hot rolling step without brief soaking, whereby Al and N are made soluble with respect to species other than AlN inevitably precipitated during hot rolling, and uniform and coarse AlN precipitation is formed by a subsequent annealing treatment in which the hot rolled plate is soaked at a temperature of 800.degree. to 1000.degree. C. for a period of time t defined as exp (-0.018T+19.4) .ltoreq.t.ltoreq.exp (-0.022T+25.4) wherein T is the soaking temperature (.degree.C.) and t is the soaking time (minutes). Uniform and satisfactory ferrite grain growth at the recrystallization annealing is provided thereby.

Abstract: A method of producing non-oriented electrical steel sheets having excellent magnetic properties which comprehends heating a steel at the low temperature for hot rolling, thereby to minimize re-solution of AlN particles when a slab is cooled, so that coarsening of AlN particles is facilitated during annealing the hot rolled sheet; and coiling at low temperatures for controlling the amount of scale generation. De-scaling is perfectly accomplished after the hot rolling, and the hot rolled sheet is annealed in a non-annealing atmosphere, thereby to control the oxidation and the nitriding to a minimum during annealing the hot rolled sheet, and the annealing conditions of the hot rolled sheet are specified for proper coarsening of the cohesion, taking into consideration the magnetic properties and the economics.

Abstract: A method for producing a non-oriented electrical steel sheet with precise thickness and homogeneous magnetic property comprising the steps of: making a steel ingot which has: 0.01 wt. % or less C, 0.003 wt. % or less N, 0.01 to 1.0 wt. % Mn, Al and Si satisfying, in wt. %, the formulas of: ##EQU1## provided that (Si %) represents the Si (wt. %) and (Al %) represents Al content (wt. %), and the balance being Fe and inevitable impurities to produce a steel slab; hot-rolling the slab at a finishing temperature of 700.degree. to 900.degree. C. into a steel strip and coiling the hot rolled strip; and cold-rolling the hot-rolled strip into a cold-rolled strip, followed by annealing the cold-rolled strip.

Abstract: Non-oriented electrical steel sheets having excellent magnetic properties are produced by carrying out a coiling at a low temperature for monitoring the amount of scale generation; de-scaling after hot rolling; and annealing the de-scaled hot rolled sheet in a non-oxidizing atmosphere to thereby minimize the oxidation and nitriding during annealing the hot rolled sheet. By determining a higher heating temperature for hot rolling, a magnetic property (magnetic flux density) is improved, and the hot rolled sheet is subjected to an open coil-annealing and annealing conditions therefor are specified in order to perfectly precipitate re-solute AlN particles by this heating and fully coarsen AlN particles.

Abstract: For enabling the manufacture of non-oriented steel strips by HDR, the amounts of AlN and MnS which precipitate on the way of HDR are decreased to such a level that they do not affect the magnetic properties by regulating the Al and S contents, and further unavoidable precipitating nitrides are precipitated as coarse BN. With regard to the steel composition, the amounts of C, Si and P are not only regulated, but also the amounts of Mn, Al, S and N are regulated from the above standpoint, and a proper amount of B is added if required. In addition, in regard to treatment conditions, in order to secure necessary finishing and coiling temperatures, the lower limit of the slab temperature at the starting time of HDR is specified. Moreover, to secure precipitation of BN and recrystallization of a ferrite structure, the lower limits of the finishing and coiling temperatures are specified.

Abstract: The present invention is to produce non-oriented electrical steel sheets having excellent magnetic property under low magnetic field by effectively checking thermal stress from introducing during cooling in a final annealing without decreasing productivity, for which when a silicon steel sheet having passed a cold rolling is cooled after a final continuous annealing, especial cooling conditions are specified only to a temperature range giving bad influences to the magnetic properties under the low magnetic field so as to prevent the introduction of the thermal strain.

Abstract: For enabling the making of non-oriented magnetic steel strips by direct rolling, the amounts of AlN and MnS which precipitate on the way of the direct rolling are decreased to such a level that they do not affect the magnetic properties by regulting the Al and S amounts, and further unavoidable precipitating nitrides are precipitated coarsely as BN. With regard to the steel composition, the amount of C, Si and P are not only regulated, but also the amounts of Mn, Al, S and N are regulated from the above standpoint, and a proper amount of B is added if required. In addition, in regard to treatment conditions, in order to secure necessary finishing and coiling temperatures, the lower limit of the slab temperature at the starting time of the direct rolling is specified. Moreover, to promote refining of ferrite, the upper limit of the finishing temperature is specified, and also to prevent non-uniform recrystallization after coiling, the upper limit of the coiling temperature is specified.

Abstract: A method for producing non-oriented electrical steel sheets comprising the steps of:making steel ingots comprising contents of:0.01 wt % and less C, 0.003 wt % and less N, 0.1 to 1.0 wt % Mn and 1.7 wt % and less Si;Si and Al satisfying the formulas of:(Al %).ltoreq.0.69 (Si %).sup.2 -2.29 (Si %)+1.90; and(Al %).gtoreq.0.10 (Si %).sup.2 -0.35 (Si %)+0.3, providing that (Si %) represents wt % Si content, and that (Al %) represents wt % Al content;other contents being Fe and impurities inevitable;hot-rolling slabs of the steel ingots at finishing temperature of 700.degree. to 900.degree. C. into hot-rolled steel strips to coil the hot-rolled steel strips; andcold-rolling the hot-rolled steel strips into cold-rolled steel strips, followed by annealing the cold-rolled strip sheets.