Patents by Inventor Akihiko Oguri

Akihiko Oguri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955739
    Abstract: A connection structure between a printed circuit board and a terminal block includes: an insertion portion at one end of the printed circuit board with a pattern disposed thereon; a terminal-block main body including a receiving port that receives the insertion portion; a nut held in the terminal-block main body; and a screw tightened into the nut. The pattern is interposed between the screw and the nut when the insertion portion is inserted into the receiving port.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: April 9, 2024
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Kazunari Fukagawa, Hironori Ogawa, Akihiko Oguri, Ryuuichi Toyota, Natsuko Kitagawa
  • Publication number: 20220037814
    Abstract: A connection structure between a printed circuit board and a terminal block includes: an insertion portion at one end of the printed circuit board with a pattern disposed thereon; a terminal-block main body including a receiving port that receives the insertion portion; a nut held in the terminal-block main body; and a screw tightened into the nut. The pattern is interposed between the screw and the nut when the insertion portion is inserted into the receiving port.
    Type: Application
    Filed: October 21, 2019
    Publication date: February 3, 2022
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Kazunari Fukagawa, Hironori Ogawa, Akihiko Oguri, Ryuuichi Toyota, Natsuko Kitagawa
  • Patent number: 9877410
    Abstract: A cooler is placed on a power module to cool the power module with refrigerant through a refrigerant pipe, and includes a heat transfer plate having a groove into which a cooling pipe is fitted, and a presser plate configured to press the cooling pipe against the groove. The cooler includes a hinge mechanism configured to rotatably attach the presser plate to the heat transfer plate such that the presser plate is switched between an open position at which the groove is exposed and a closed position at which the presser plate covers the groove.
    Type: Grant
    Filed: April 26, 2013
    Date of Patent: January 23, 2018
    Assignee: Daikin Industries, Ltd.
    Inventors: Junichi Teraki, Akihiko Oguri, Masanobu Kita
  • Patent number: 9769955
    Abstract: A printed board on which a power module is mounted, a cooling pipe that is a refrigerant pipe of a refrigerant circuit, and a cooler attached to the power module and the cooling pipe are disposed in a casing. A support member by which the cooler is attached to the printed board and supported on the printed board, and a fixing member by which the printed board is fixed to the casing and supported on the casing are used.
    Type: Grant
    Filed: April 26, 2013
    Date of Patent: September 19, 2017
    Assignee: Daikin Industries, Ltd.
    Inventors: Junichi Teraki, Akihiko Oguri
  • Patent number: 9523529
    Abstract: In a refrigeration apparatus, a main surface of a printed wiring board has a heavy electric region, which is a region in the lower part of the printed wiring board where a heavy electric component group is disposed, and a light electric region, which is a region positioned above the heavy electric region, where a light electric component group is disposed. A refrigerant jacket contacts a power device which is disposed in the heavy electric region. A liquid pipe of the refrigerant pipe includes a portion that extends upwards towards the refrigerant jacket, and a cooling portion contacts the refrigerant jacket.
    Type: Grant
    Filed: April 8, 2013
    Date of Patent: December 20, 2016
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Akihiko Oguri, Junichi Teraki, Masanobu Kita, Hiroshi Doumae, Motonobu Ikeda, Masahide Fujiwara
  • Patent number: 9377237
    Abstract: A facing surface of a refrigerant jacket includes a contact portion which contacts a device main body, a first recessed portion which faces a first lead section and secures an insulation distance to the first lead section due to being positioned further away from a power device than the contact portion, and a second recessed portion which faces the second lead section and secures an insulation distance to the second lead section due to being positioned further away from the power device than the contact portion.
    Type: Grant
    Filed: April 8, 2013
    Date of Patent: June 28, 2016
    Assignee: Daikin Industries, Ltd.
    Inventors: Akihiko Oguri, Junichi Teraki, Masanobu Kita, Hiroshi Doumae, Motonobu Ikeda, Masahide Fujiwara
  • Publication number: 20150128631
    Abstract: In a refrigeration apparatus, a main surface of a printed wiring board has a heavy electric region, which is a region in the lower part of the printed wiring board where a heavy electric component group is disposed, and a light electric region, which is a region positioned above the heavy electric region, where a light electric component group is disposed. A refrigerant jacket contacts a power device which is disposed in the heavy electric region. A liquid pipe of the refrigerant pipe includes a portion that extends upwards towards the refrigerant jacket, and a cooling portion contacts the refrigerant jacket.
    Type: Application
    Filed: April 8, 2013
    Publication date: May 14, 2015
    Inventors: Akihiko Oguri, Junichi Teraki, Masanobu Kita, Hiroshi Doumae, Motonobu Ikeda, Masahide Fujiwara
  • Publication number: 20150114021
    Abstract: A facing surface of a refrigerant jacket includes a contact portion which contacts a device main body, a first recessed portion which faces a first lead section and secures an insulation distance to the first lead section due to being positioned further away from a power device than the contact portion, and a second recessed portion which faces the second lead section and secures an insulation distance to the second lead section due to being positioned further away from the power device than the contact portion.
    Type: Application
    Filed: April 8, 2013
    Publication date: April 30, 2015
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Akihiko Oguri, Junichi Teraki, Masanobu Kita, Hiroshi Doumae, Motonobu Ikeda, Masahide Fujiwara
  • Publication number: 20150082823
    Abstract: A cooler is placed on a power module to cool the power module with refrigerant through a refrigerant pipe, and includes a heat transfer plate having a groove into which a cooling pipe is fitted, and a presser plate configured to press the cooling pipe against the groove. The cooler includes a hinge mechanism configured to rotatably attach the presser plate to the heat transfer plate such that the presser plate is switched between an open position at which the groove is exposed and a closed position at which the presser plate covers the groove.
    Type: Application
    Filed: April 26, 2013
    Publication date: March 26, 2015
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Junichi Teraki, Akihiko Oguri, Masanobu Kita
  • Publication number: 20150082822
    Abstract: A printed board on which a power module is mounted, a cooling pipe that is a refrigerant pipe of a refrigerant circuit, and a cooler attached to the power module and the cooling pipe are disposed in a casing. A support member by which the cooler is attached to the printed board and supported on the printed board, and a fixing member by which the printed board is fixed to the casing and supported on the casing are used.
    Type: Application
    Filed: April 26, 2013
    Publication date: March 26, 2015
    Inventors: Junichi Teraki, Akihiko Oguri