Patents by Inventor Akihiko OIDE

Akihiko OIDE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240120142
    Abstract: The electronic component includes an element body, an internal conductor, a cover layer, and a conductor layer. The internal conductor is disposed in the element body. The cover layer is disposed on an outer surface of the element body and has an electrical insulation property. The conductor layer is disposed on the cover layer and is electrically connected to the internal conductor. The conductor layer includes a portion. The portion protrudes toward the element body through the cover layer and is physically and electrically connected to the internal conductor. The conductor layer is electrically connected to the internal conductor.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 11, 2024
    Applicant: TDK CORPORATION
    Inventors: Yoji TOZAWA, Masashi SHIMOYASU, Akihiko OIDE, Daiki KATO, Makoto YOSHINO, Takashi ENDO, Takuya KODAMA, Akira AKASAKA, Ken ITOH
  • Patent number: 11894195
    Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.
    Type: Grant
    Filed: November 8, 2021
    Date of Patent: February 6, 2024
    Assignee: TDK CORPORATION
    Inventors: Yoji Tozawa, Masashi Shimoyasu, Makoto Yoshino, Takuo Abe, Akihiko Oide, Tsutomu Ono, Shinichi Sato, Makoto Morita, Shinichi Sato, Hidekazu Sato
  • Publication number: 20230317351
    Abstract: An electronic component has an element body; and an external electrode having a main body portion covering at least the second surface and a first wrapping-around portion wrapping around the third surface in the element body. The wrapping-around portion of the external electrode has a first part having a first distance, a second part having a second distance, a third part having a third distance, a fourth part having a fourth distance, and a fifth part having a fifth distance in the second direction in order from one side to the other side in the first direction. The second distance is longer than the first distance and the third distance. The fourth distance is longer than the third distance and the fifth distance.
    Type: Application
    Filed: March 23, 2023
    Publication date: October 5, 2023
    Applicant: TDK CORPORATION
    Inventors: Masashi SHIMOYASU, Yoji TOZAWA, Akihiko OIDE, Daiki KATO, Midori KISHIMOTO, Satoshi TAKASU, Yo SAITO, Rui TAKAHASHI, Kenta SASAKI, Makoto YOSHINO, Kazuhiro EBINA
  • Publication number: 20230005656
    Abstract: An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.
    Type: Application
    Filed: September 15, 2022
    Publication date: January 5, 2023
    Applicant: TDK CORPORATION
    Inventors: Shinichi SATO, Yohei TADAKI, Akihiko OIDE, Yuma ISHIKAWA, Hidekazu SATO, Kazuhiro EBINA, Hiroyuki TANOUE
  • Patent number: 11482371
    Abstract: An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: October 25, 2022
    Assignee: TDK CORPORATION
    Inventors: Shinichi Sato, Yohei Tadaki, Akihiko Oide, Yuma Ishikawa, Hidekazu Sato, Kazuhiro Ebina, Hiroyuki Tanoue
  • Publication number: 20220319766
    Abstract: In the multi-layer coil component, the via conductor electrically connecting the coil layers adjacent to each other in the stacking direction of the element body protrudes from the coil region toward the side surface of the element body when viewed from the stacking direction of the element body. Therefore, the coil has a concave-convex portion. When a force is applied to the multi-layer coil component from the outside, the force is dispersed in the concave-convex portion of the coil, and thus defects are less likely to occur in the coil than in a coil in which the side of the side surfaces is flat.
    Type: Application
    Filed: March 22, 2022
    Publication date: October 6, 2022
    Applicant: TDK CORPORATION
    Inventors: Akihiko OIDE, Makoto YOSHINO, Tomoki OKADA, Hideki SAITOU, Seiji OSADA, Kazuhiro EBINA, Kunio ODA, Takashi ABE, Akio SHIBATA, Kazuo IWAI
  • Publication number: 20220306541
    Abstract: A ferrite composition comprises a main component and a subcomponent. The main component includes 32.0 to 46.4 mol % of iron oxide in terms of Fe2O3, 4.4 to 14.0 mol % of copper oxide in terms of CuO, and 8.4 to 56.9 mol % of zinc oxide in terms of ZnO. The subcomponent includes 0.53 to 11.00 parts by weight of a silicon compound in terms of SiO2, 0.1 to 12.8 parts by weight of a tin compound in terms of SnO2, and 0.5 to 7.0 parts by weight of a bismuth compound in terms of Bi2O3, with respect to 100 parts by weight of the main component.
    Type: Application
    Filed: March 21, 2022
    Publication date: September 29, 2022
    Applicant: TDK CORPORATION
    Inventors: Kouichi KAKUDA, Takashi SUZUKI, Yukio TAKAHASHI, Kunihiko KAWASAKI, Hiroyuki TANOUE, Takehiro ISHII, Takuya NIIBORI, Takahiro SATO, Akihiko OIDE, Yasuhiro ITO, Takashi ENDO, Kunio ODA
  • Publication number: 20220310301
    Abstract: In the multi-layer inductor, all of the plurality of through conductors are not aligned in a straight line, and the distance between the through conductors can be sufficiently kept in the element body having a predetermined dimensional standard. Therefore, the through conductor as a heat source is apart from each other, and the heat of the through conductor can be efficiently radiated to the outside of the element body.
    Type: Application
    Filed: March 16, 2022
    Publication date: September 29, 2022
    Applicant: TDK Corporation
    Inventors: Akihiko OIDE, Makoto YOSHINO, Tomoki OKADA, Seiji OSADA, Yuuki OKAZAKI, Takeshi SASAKI, Mitsuru ITO, Kenta SASAKI, Kazuhiro EBINA, Takashi ABE, Hiroshi ONO
  • Publication number: 20220310299
    Abstract: In the multi-layer inductor, the internal electrode includes the auxiliary conductor, and the auxiliary conductor is jointed to the external electrode at the end face. Therefore, when a defect occurs in a part of the through conductors, a current flows through the remaining through conductor(s) and a current also flows through the auxiliary conductor. Therefore, overheating at the joint surface between the remaining through conductor(s) and the external electrode can be prevented, and cutting and/or fusion starting from the joint surface can be prevented.
    Type: Application
    Filed: March 17, 2022
    Publication date: September 29, 2022
    Applicant: TDK Corporation
    Inventors: Akihiko OIDE, Makoto YOSHINO, Tomoki OKADA, Seiji OSADA, Yuuki OKAZAKI, Takeshi SASAKI, Mitsuru ITO, Kenta SASAKI, Kazuhiro EBINA, Takashi ABE, Hiroshi ONO
  • Publication number: 20220310312
    Abstract: In the multi-layer coil component, the lead conductor is exposed from the end surface of the element body and is connected to the external electrode provided on the end surface. When the lead conductor is led out to the end surface of the element body, the lead area can be easily increased as compared with the case where the lead conductor is led out to the side surface of the element body. Therefore, by connecting the coil and the external electrode via the lead conductor, high connectivity between the coil and the external electrode is achieved.
    Type: Application
    Filed: March 18, 2022
    Publication date: September 29, 2022
    Applicant: TDK CORPORATION
    Inventors: Akihiko OIDE, Makoto YOSHINO, Tomoki OKADA, Hideki SAITOU, Seiji OSADA, Kazuhiro EBINA, Kunio ODA, Takashi ABE, Akio SHIBATA, Kazuo IWAI
  • Publication number: 20220301761
    Abstract: In the multi-layer inductor, a through conductor provided in a sintered element body includes a pair of extracting conductors and a pair of internal conductors, and an end portion of the extracting conductor and an end portion of the internal conductor overlap each other in a stacking direction of the element body. Thus, the amount of shrinkage of each conductor during sintering of the element body is reduced, and internal stress generated in the element body after sintering is prevented.
    Type: Application
    Filed: March 14, 2022
    Publication date: September 22, 2022
    Applicant: TDK CORPORATION
    Inventors: Akihiko OIDE, Makoto YOSHINO, Tomoki OKADA, Masashi SHIMOYASU, Daiki KATO, Hideki SAITOU, Seiji OSADA, Kazuhiro EBINA
  • Publication number: 20220068565
    Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.
    Type: Application
    Filed: November 8, 2021
    Publication date: March 3, 2022
    Applicant: TDK CORPORATION
    Inventors: Yoji TOZAWA, Masashi SHIMOYASU, Makoto YOSHINO, Takuo ABE, Akihiko OIDE, Tsutomu ONO, Shinichi SATO, Makoto MORITA, Shinichi SATO, Hidekazu SATO
  • Patent number: 11227721
    Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.
    Type: Grant
    Filed: November 24, 2017
    Date of Patent: January 18, 2022
    Assignee: TDK CORPORATION
    Inventors: Yoji Tozawa, Masashi Shimoyasu, Makoto Yoshino, Takuo Abe, Akihiko Oide, Tsutomu Ono, Shinichi Sato, Makoto Morita, Shinichi Sato, Hidekazu Sato, Masashi Kitazaki, Naoki Uchida, Masahiro Kato
  • Publication number: 20210383960
    Abstract: A multilayer conductor component includes an element body, an internal conductor, and an external electrode. The external electrode includes a sintered metal layer. The sintered metal layer is disposed on an end surface, a pair of side surfaces, a first main surface, and a second main surface of the element body. An electrode length, which is a length in the first direction from an edge of the sintered metal layer to a reference plane including the end surface, at a central portion of the first main surface in the third direction, is shorter than the electrode length at each of the ridge portions. The electrode length at a central portion of each of the pair of side surfaces in the second direction is equal to or less than the electrode length at each of the ridge portions.
    Type: Application
    Filed: June 3, 2021
    Publication date: December 9, 2021
    Applicant: TDK CORPORATION
    Inventors: Daiki KATO, Masashi SHIMOYASU, Yoji TOZAWA, Seiichi NAKAGAWA, Akihiko OIDE, Makoto YOSHINO, Kazuhiro EBINA
  • Publication number: 20210375527
    Abstract: A multilayer inductor component includes an element body, an internal conductor, and an external electrode. The internal conductor is disposed in the element body. The external electrode is disposed on a surface of the element body and electrically connected to the internal conductor. The external electrode includes a sintered metal layer and a plating layer. The sintered metal layer is disposed on the surface of the element body. The plating layer covers the sintered metal layer. The sintered metal layer includes a thick portion and thin portions. The thick portion covers the surface of the element body. A plurality of glass particles is dispersed in the thick portion. The thin portions cover glass particles exposed on a surface of the thick portion among the plurality of glass particles and being in contact with the plating layer.
    Type: Application
    Filed: May 25, 2021
    Publication date: December 2, 2021
    Applicant: TDK CORPORATION
    Inventors: Masashi SHIMOYASU, Daiki KATO, Yoji TOZAWA, Takashi ENDO, Seiichi NAKAGAWA, Mitsuru ITO, Kenta SASAKI, Akihiko OIDE, Makoto YOSHINO, Kazuhiro EBINA
  • Patent number: 11011294
    Abstract: A multilayer coil component includes an element body made of a ferrite sintered body and a coil. The coil is configured with a plurality of internal conductors juxtaposed in the element body and electrically connected to one another. An average crystal grain size in a surface region of the element body is smaller than an average crystal grain size in a region between the internal conductors in the element body. A surface of the element body is covered with a layer made of an insulating material. The insulating material is not present among the crystal grains in the surface region of the element body.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: May 18, 2021
    Assignee: TDK CORPORATION
    Inventors: Shinichi Sato, Yohei Tadaki, Akihiko Oide, Yuma Ishikawa, Hidekazu Sato
  • Patent number: 10848119
    Abstract: An element body includes a first function portion including a first material, a second function portion including a second material different from the first material, and an intermediate portion placed between the first function portion and the second function portion. The intermediate portion includes a first component included in the first material, and a second component included in the second material. A side surface of the element body includes surfaces of the first function portion, the second function portion, and the intermediate portion. Each of terminal electrodes includes electrode portion formed on the side surface across the surfaces of the first function portion, the second function portion, and the intermediate portion. An insulating layer is formed on the side surface in such a manner as to be in contact with at least a region exposed from the electrode portions between the electrode portions in the surface of the intermediate portion.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: November 24, 2020
    Assignee: TDK CORPORATION
    Inventors: Akihiko Oide, Yoji Tozawa, Seiichi Nakagawa, Shinichi Kondo, Takashi Endo, Makoto Yoshino, Noriaki Hamachi
  • Patent number: 10784834
    Abstract: A multilayer LC filter array includes an element body of a rectangular parallelepiped shape, a first filter including a first inductor and a first capacitor, a second filter including a second inductor and a second capacitor, a first input terminal electrode and a first output terminal electrode that are connected to the first inductor, a second input terminal electrode and a second output terminal electrode that are connected to the second inductor, and a ground terminal electrode that is connected to the first capacitor and the second capacitor. The element body includes a principal surface. The ground terminal electrode is disposed at a center of the principal surface. The first input terminal electrode, the first output terminal electrode, the second input terminal electrode, and the second output terminal electrode are disposed at respective different corner portions of the element body when viewed from a direction orthogonal to the principal surface.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: September 22, 2020
    Assignee: TDK CORPORATION
    Inventors: Akihiko Oide, Naoki Uchida, Yoji Tozawa, Makoto Yoshino, Seiichi Nakagawa, Shinichi Sato, Hiroshi Ono, Takashi Endo
  • Publication number: 20200118731
    Abstract: An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.
    Type: Application
    Filed: December 16, 2019
    Publication date: April 16, 2020
    Applicant: TDK CORPORATION
    Inventors: Shinichi SATO, Yohei TADAKI, Akihiko OIDE, Yuma ISHIKAWA, Hidekazu SATO, Kazuhiro EBINA, Hiroyuki TANOUE
  • Patent number: 10541078
    Abstract: An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: January 21, 2020
    Assignee: TDK CORPORATION
    Inventors: Shinichi Sato, Yohei Tadaki, Akihiko Oide, Yuma Ishikawa, Hidekazu Sato, Kazuhiro Ebina, Hiroyuki Tanoue