Abstract: A solar photovoltaic system inspection apparatus sequentially applies AC inspection signals to a positive electrode and a negative electrode of a solar cell string, and is provided with: an impedance calculation unit configured to measure an indicator value when the signal is applied to the positive electrode, and an indicator value when the signal is applied to the negative electrode, the indicator values varying depending on the number of solar cell modules from the terminal to which the inspection signal was applied to a failure position; and a control unit configured to obtain the failure position based on the ratio of the indicator value measured when the inspection signal was applied to the positive electrode, to the indicator value measured when the inspection signal was applied to the negative electrode.

Abstract: The present invention is a solid sustained-release formulation comprising an agent for inhibiting semaphorin 3A as an active ingredient, which comprises an agent for inhibiting semaphorin 3A and pharmaceutically acceptable hardly water-soluble solid substance, in which the carrier is silicone.

Abstract: An electronic component has a first member in which an electrostatic actuator is provided, a second member in which a drive integrated circuit for driving the electrostatic actuator is provided, and join parts that joins the first member and the second member while a surface on which the electrostatic actuator is provided in the first member and a surface on which the drive integrated circuit is provided in the second member are opposed to each other. The electrostatic actuator and the drive integrated circuit are disposed in a space surrounded by the first member, the second member, and the join parts.

Abstract: Means for transferring efficiently a desired nucleic acid into a cell is provided. The present invention comprises using a complex comprising a collagen or a collagen derivative, and a desired nucleic acid.

Abstract: An optical module has a support board, an optical transmission path, and at least a single optical element having a light receiving function or a light emitting function provided on the support board. A light emission surface of the optical transmission path or a light incidence surface of the optical transmission path is arranged such that the optical element and the optical transmission path are optically coupled to each other, with respect to a light receiving surface or a light emitting surface of the optical element. The optical element is sealed by a sealing agent. A gap is provided between the optical transmission path and the surface of the sealing agent on the light receiving surface or the light emitting surface of the optical element.

Abstract: A light guide includes a core made of material having translucency and an optical path conversion mirror for reflecting the signal light from the optical element and converting the optical path of the signal light formed on at least the core. The signal light is transmitted through the core by the reflection at the optical path conversion mirror. The optical path conversion mirror surface has an inclination angle ? formed with a bottom surface of the core changing in the X-direction in a cross-sectional shape in which the core is cut at a YZ plane, the Y-direction being an optical axis direction of the optical element, the Z-direction being an advancing direction of the signal light of the light guide, and the X-direction being a direction perpendicular to both the Y-direction and the Z-direction.

Abstract: The present invention is a solid sustained-release formulation comprising an agent for inhibiting semaphorin 3A as an active ingredient, which comprises an agent for inhibiting semaphorin 3A and pharmaceutically acceptable hardly water-soluble solid substance, in which the carrier is silicone.

Abstract: An integrally molding die for manufacturing a package includes a supporting portion for supporting at least one end including an incident/exit port of a light signal in a light transmission path, and a lead frame for mounting an optical element. The integrally molding die includes a recess for forming the supporting portion, a first projection, which comes into contact with an optical element mounting surface of the lead frame, and a second projection, which comes into contact with a back surface of the optical element mounting surface.

Abstract: A connection member (21), which electrically connects a package (14) on which an optical element that converts an electric signal to an optical signal or converts an optical signal to an electric signal and at least one end portion including an incident/releasing port for an optical signal of an optical waveguide (11) that is optically coupled with the optical element to transmit the optical signal are mounted, and a second substrate (2) to each other, is provided with a holding unit having elasticity, which holds the package (14), and a connection unit that is connected to the substrate (2).

Abstract: A light guide includes a core made of material having translucency and an optical path conversion mirror for reflecting the signal light from the optical element and converting the optical path of the signal light formed on at least the core. The signal light is transmitted through the core by the reflection at the optical path conversion mirror. The optical path conversion mirror surface has an inclination angle ? formed with a bottom surface of the core changing in the X-direction in a cross-sectional shape in which the core is cut at a YZ plane, the Y-direction being an optical axis direction of the optical element, the Z-direction being an advancing direction of the signal light of the light guide, and the X-direction being a direction perpendicular to both the Y-direction and the Z-direction.

Abstract: A bonding structure for a container member is disclosed. The container member has an opening and a covering member for covering the opening. The container member and covering member are abutted with each other and bonded by a friction stir welding operation. The bonding structure for the container and covering members comprises a bonding portion and a backing member. The bonding portion of the container member and the covering member is formed by inserting a friction stir welding tool into an abutting portion of the container member and the covering member. The backing member is provided for obstructing a plastic flow of materials for the container member and the covering member when the friction stir welding operation is performed. The backing member is disposed adjacent to the bonding portion, at a side of the abutting portion that is opposite to an inserting side of the friction stir welding tool.

Abstract: An electrode structure has a Cu electrode that provided in a surface of a substrate, a diffusion preventing film that is made of a material in which a diffusion coefficient of Sn is equal to or lower than 3×10?23 cm2/sec, the whole Cu electrode being covered with the diffusion preventing film, and a solder layer that is provided above the diffusion preventing film, the solder layer being made of Au—Sn solder.

Abstract: In an electrode portion structure in which an electrode is formed in an end portion of a through-wiring, disconnection is prevented in an electrode portion. A through-hole that vertically pierces a substrate is made in the substrate, and a through-electrode is provided in the through-hole. The through-electrode is projected in s curved-surface manner from an upper surface of the substrate. The upper surface of the substrate 12 is coated with an insulating film, and a contact hole is made in the insulating film while aligned with the through-electrode. An opening diameter of the contact hole is lower than a sectional diameter of the through-electrode, and surroundings of an upper surface of the through-electrode are coated with the contact hole. A thickness Ddiel of the insulating film is equal to or lower than a projection length Dp of the through-electrode from the upper surface of the substrate at an opening edge of the contact hole.

Abstract: The present invention provides an immunopotentiating composition which comprises an antigen or antigen-inducing substance, and a carrier comprising a biocompatible material for effectively increasing an immune response derived from an antigen. The present invention further provides a method of producing an antibody by administering said immunopotentiating composition to a mammal or bird, thereby modulating the immune response in said mammal or bird and recovering the antibody produced.

Abstract: An optical module has an optical element which transmits or receives an optical signal, an optical transmission line optically coupled to the optical element to transmit the optical signal, and a board to which at least one end portion including an incident and outgoing port of the optical signal in the optical transmission line and the optical element are fixed. A wall facing a side surface of the optical transmission line is provided in the board. A first space is provided between the board and the optical transmission line, and a second space is provided between the side surface of the optical transmission line and the wall. The first and second spaces are filled with a bonding agent.

Abstract: Preparations for transferring efficiently oligonucleotides necessary in antisense therapy or the like into animal cells so as to be useful in treatment for various diseases, which comprises a collagen as an essential component are provided.

Abstract: A connection member electrically connects an optical element configured to convert an electric signal to an optical signal or to convert an optical signal to an electric signal, a first substrate including an incident/releasing port of an optical transmission path for an optical signal at least one end portion thereof, and a second substrate to each other. The optical transmission path is optically coupled with the optical element to transmit the optical the connection. The connection member includes a connection unit connected to the second substrate and a holding unit having elasticity and holding the first substrate. The holding unit is provided with an electrode at a connecting position to the first substrate, and the holding unit holds the first substrate by connecting the first substrate to the electrode.

Abstract: A light emitting element circuit has a light emitting element, a drive circuit that supplies a current to the light emitting element, and a signal circuit that autonomously supplies a signal according to an ambient temperature. The signal adjusts the current such that the current corresponds to a temperature characteristic of the light emitting element.

Abstract: An integrally molding die for manufacturing a package includes a supporting portion for supporting at least one end including an incident/exit port of a light signal in a light transmission path, and a lead frame for mounting an optical element. The integrally molding die includes a recess for forming the supporting portion, a first projection, which comes into contact with an optical element mounting surface of the lead frame, and a second projection, which comes into contact with a back surface of the optical element mounting surface.

Abstract: A bonding structure for a container member is disclosed. The container member has an opening and a covering member for covering the opening. The container member and covering member are abutted with each other and bonded by a friction stir welding operation. The bonding structure for the container and covering members comprises a bonding portion and a backing member. The bonding portion of the container member and the covering member is formed by inserting a friction stir welding tool into an abutting portion of the container member and the covering member. The backing member is provided for obstructing a plastic flow of materials for the container member and the covering member when the friction stir welding operation is performed. The backing member is disposed adjacent to the bonding portion, at a side of the abutting portion that is opposite to an inserting side of the friction stir welding tool.